As a core foundational material in the high-end chip packaging process, the classification of IC substrates essentially follows a tiered matching principle of ‘material properties → structural form → application requirements’. Different types of IC substrates exhibit significant differences in key aspects such as wiring density, temperature resistance and production costs; these differences directly determine […]
In the field of RF and microwave electronics, the performance of substrate materials directly determines the potential for circuit miniaturisation, signal integrity and environmental adaptability. Thanks to its outstanding comprehensive properties, aluminium oxide ceramic substrate has become one of the most widely used core substrate materials in this field. Its high dielectric constant facilitates circuit
Following surface-mount soldering (reflow soldering), BGA devices typically undergo several post-process steps to enhance their environmental adaptability, mechanical strength and reliability. In accordance with industry practice, these primarily comprise three types of processes: conformal coating, underfill and adhesive reinforcement, and PCB depanelling. The technical requirements and key implementation points for these processes are outlined below.
What is reflow soldering? Reflow soldering is a core soldering process in surface-mount technology (SMT), used to establish a mechanical connection and electrical continuity between the terminals or leads of surface-mount devices (SMDs) and the pads on a printed circuit board (PCB); it is a type of soft soldering. The basic principle involves remelting the
In the printed circuit board industry, the OSP process is widely used. Thanks to its outstanding advantages—including low cost, a simple manufacturing process and excellent solder joint reliability—it has become the preferred process for many PCB manufacturers. OSP, or Organic Solderable Protective Coating, involves the chemical deposition of a thin organic protective film onto the
Semiconductor packaging and testing (commonly referred to as ‘packaging and testing’) is a critical final stage in the chip manufacturing supply chain. It involves the post-processing that follows wafer fabrication, protecting the chip’s core circuitry through packaging and establishing electrical interconnections. Through multi-dimensional testing, it screens for good products and verifies performance stability. As such,
Aluminum PCBs (Aluminum substrates) are a core product within the category of high-performance metal-clad copper-clad laminates (MCPCBs). Their most notable advantage lies in their exceptional thermal conductivity, which is the key distinction from standard PCBs and makes them widely used in high-power applications. Compared to copper-based PCBs, while the thermal conductivity of pure aluminum (approximately
With the continuous advancement of communication technologies and the shift towards intelligent automotive electronics, market demand for high-power printed circuit boards and high frequency microwave pcbs continues to rise, becoming a key driver of growth in the printed circuit board industry. Microwave pcbs are manufactured using specialised microwave-grade copper-clad laminates in conjunction with conventional rigid
As electronic products evolve towards higher integration and miniaturisation, Ball Grid Array (BGA) packaging has become an indispensable component type in modern PCB design, thanks to its high-density interconnections and excellent electrical and thermal performance. However, the pad design, routing planning and reliability verification of BGA packaging directly determine the manufacturing yield and long-term stability
Due to their high routing density and excellent space utilisation, double sided pcbs are widely used in various electronic products. However, their dual-sided layout and metallised via structure place higher demands on the soldering process. From flux spraying and selective soldering to the sequence of manual soldering and polarity identification, every detail directly affects the
The layer-up strategy for multilayer PCBs directly determines signal integrity, power supply stability and electromagnetic compatibility (EMC), and is a core skill that hardware engineers must master. A well-designed layer-up arrangement can suppress interference and enhance reliability at the lowest cost; conversely, it may lead to issues such as signal distortion and failure in EMC
BGA packaging has become the mainstream form of integrated circuit packaging due to its high density, high reliability and excellent electrical and thermal performance. Compared to traditional DIP and QFP packages, BGA distributes solder balls evenly across the underside of the package, resolving the issue of bridging between closely spaced pins, shortening lead lengths, reducing
A BGA substrate (Ball Grid Array Substrate) is the core carrier of a ball grid array package; essentially, it is a high-density interconnect (HDI) multilayer PCB used to mount the chip, provide electrical interconnection between the chip and the motherboard, and offer mechanical support, with solder bumps arranged in an array on the reverse side.
A bare PCB serves as the core framework of a traditional circuit board; its fundamental function is to guide the flow of current through carefully designed circuit paths, and it is widely used in various types of electronic devices. A blank PCB (i.e. a bare board) features a simple structure, offering engineers and designers ample
In the design of power adapters, the quality of the PCB routing on the bare PCB directly determines the stability, reliability and electromagnetic compatibility (EMC) of the entire unit. A well-designed PCB routing not only effectively suppresses noise and reduces losses, but also helps to mitigate safety compliance risks. Six Key PCB Routing Techniques 1.Current
Printed circuit boards (PCBs) are the core components of modern electronic products, and their manufacture relies on a key base material: copper-clad laminate (CCL). Depending on product form and application, CCL is primarily divided into two categories: rigid copper-clad laminate (conventional CCL) and flexible copper-clad laminate (FCCL). Among these, FCCL, owing to their unique bendable
The soundness of RF board layout directly determines the transmission quality of RF signals, interference immunity and the overall performance of the equipment; it is a core aspect of RF product design. This article focuses on its core principles, preparation, practical implementation and simulation, outlining key points to guide engineering practice. Core Principles of RF
In today’s rapidly evolving technological landscape, drones have become deeply integrated into every aspect of daily life and industrial production, emerging as indispensable smart devices. At the heart of a drone’s stable operation lies drone PCB assembly (printed circuit board assembly) – this compact circuit board serves as the drone’s ‘brain’ for computation, its ‘nerves’
The key difference between leaded solder and lead free solder processes lies in the lead content of the solder. According to the EU RoHS Directive, lead content must be below 1,000 ppm (parts per million) to be considered compliant; Japanese standards are even stricter, requiring a level below 500 ppm. Lead-free solders typically consist mainly
As PCBs evolve towards being lighter, thinner, smaller and more compact, rigid flex boards (also known as rigid-flex assemblies) have emerged as a key technology for reducing the size and enhancing the performance of electronic products, alongside high-density rigid boards, thanks to their three-dimensional connection and assembly capabilities. By combining flexible circuits (FPCs) with traditional
As IC pin densities increase and signal frequencies rise, the choice of PCB surface treatment process has become particularly critical. Gold plated circuit boards were once favoured for their high flatness and long shelf life, but issues such as gold whisker short circuits and the skin effect have become increasingly prominent in high-density, high-frequency applications.
What is FCT testing? The core principle of FCT (Functional Circuit Test) is to treat the PCBA as a complete functional module, simulate its actual operating environment within the end product, apply real-world input signals, and verify whether the output response meets design requirements. Put simply, it involves providing the Unit Under Test (UUT) with
The defining characteristic of rigid PCBs (rigid printed circuit boards) is that they are ‘non-flexible’; relying on their rigid substrate, they provide stable support and electrical connection pathways for electronic components. Unlike the flexible substrates used in flexible PCBs, the rigidity of a rigid PCB derives entirely from its core substrate. In actual production, the
IC packaging involves encapsulating the bare die—cut from a wafer—into a complete component that can be directly mounted onto a PCB. It fulfils three fundamental functions: establishing an electrical connection between the die and external circuits, protecting the die from environmental damage, and aiding heat dissipation. To give a practical example: in the case of
