Nelco N4000 13 is a very high quality multilayer sheet that is carefully crafted from glass fibre and epoxy resin, with the number of layers varying between approximately 8 and 16, while its thickness varies between 0.25 mm and 5.6 mm. The material’s high insulating ability, excellent thermal stability and strong mechanical strength make it […]
The hard drive printed circuit board is a key component of a hard disc. It consists of one or more layers of glass fibre substrates stacked on top of each other and covered with various electronic components, such as integrated circuits, connectors, capacitors, and so on. In the operation of a hard disc, the circuit
SMT high temperature soldering technology is a soldering method that uses peak soldering temperatures in excess of 220°C in the SMT (or Surface Mount Technology) process. This technique is typically implemented in the 245 to 247°C temperature range to ensure that the solder paste and the BGA (ball grid array) solder balls are able to
A cold solder joint is a soldering phenomenon that occurs when the required minimum wetting temperature between the brazing material and the base metal is not reached, or when the metallurgical reaction fails to proceed adequately despite the fact that wetting occurs in some localised areas. When this phenomenon occurs, it means that there is
DIP package assembly, also known as Dual In-line Package (DIP), is an assembly method that requires the pins of an electronic component to be inserted into a through-hole of a printed circuit board (PCB), and then secured using soldering techniques such as wave soldering. The DIP package process is particularly suitable for larger electronic components
A phone circuit board is a key component used for the connection and assembly of circuits inside a mobile phone. It is usually a thin board made of insulating material covered with a conductive layer that is used to connect and support the various electronic components inside a mobile phone, such as processors, memory, sensors,
PCB backdrill, also known as controlled depth drilling, is simply the process of drilling a hole from the back side of an already manufactured multilayer circuit board. However, this is not just playing, but to accurately trim some of the through-holes (we also call it PTH holes, that is, plated through-holes) in those unwanted ‘little
In the mass production of printed circuit boards (PCBs), manufacturers often combine multiple individual boards into one large board, a process known as boardmixing, where multiple small boards are combined into one large board. The aim is to feed these boards more efficiently into the automated machines of the SMT (surface mount technology) production line,
Hot plate for pcb soldering is an advanced soldering technique that is primarily used to securely attach electronic components to printed circuit boards (PCBs). This method utilises the heating function of the hot plate to provide uniform temperature control, thus ensuring an efficient and stable soldering process. The hot plate for pcb soldering process achieves
Parasitic resistances are resistances that are not intentionally designed into a circuit, but are created due to circuit layout or component characteristics, for example. They are usually unavoidable and affect the performance and stability of the circuit. Parasitic resistors have the following characteristics: Parasitic resistors are often considered the ‘enemy’ of circuit design due to
HDI technology is a cutting-edge PCB (Printed Circuit Board) manufacturing process that offers the significant benefits of high-density layout, high reliability and high integration, with the PCB serving as the cornerstone of electronic component interconnectivity, carrying and solidly connecting all types of electronic assemblies. Through the application of high-density integration HDI technology, can promote the
Allflex PCB, also known as Flexible Printed Circuit Board (FPC), is a type of circuit board that can be completely bent. Folded or curled circuit board. It consists of one or more layers of polyimide film as a substrate, covered with a copper foil layer and a cover film, and the circuit pattern is formed
What is the bend radius of a flexible circuit board? The bending radius of a Flexible Printed Circuit Board (FPC) refers to the fact that when the FPC is bent, the two sides of its centre line are subjected to different types of stress, pressure on the inside and tension on the outside. The magnitude
The stacked construction technique of HDI circuit boards allows multiple circuit layers to be interconnected by means of precisely tuned blind and buried vias, which are significantly smaller in diameter than the through-holes found in conventional PCBs. This fine interconnect mechanism not only reduces board size, but also significantly increases routing density, allowing more electronic
ELIC PCB is one of the HDI products, the full name is every layer interconnection, is the highest end of the HDI products. ELIC boards are commonly stacked for 8 to 14 layers. Any layer interconnection (ALIVH) technology, as the name suggests, is a multi-layer printed circuit board (PCB) can be achieved in any two
Circuit board labels are the PCB (Printed Circuit Board, Printed Circuit Board) technology based on the manufacture of high-frequency RFID tags. PCB tags can be divided into a variety of types according to power, size, frequency and other factors, according to the frequency distinction between ultra-high-frequency PCB anti-metal tags, high-frequency PCB anti-metal tags and so
When designing a printed circuit board (PCB), following basic pcb layout rules is essential to ensure the functionality and performance of the circuit. The basic rules of PCB layout:1.According to the layout strategy of ‘major priority, complexity first’, i.e., the key unit circuits and core components should be arranged first.2.In the layout process, should refer
PCB side plating, also known as pcb edge plating, is a copper plating that is applied from the top to the bottom surface of the board and along (at least) one of the peripheral edges. PCB edge plating is the process of allowing a metallised layer to extend up to the edge of the board
In the production process of electronic products, circuit card assembly testing is a crucial step, which is directly related to the performance and reliability of the product. Circuit card, as a carrier connecting various electronic components, the quality of its assembly directly affects the function of the whole system to achieve. Therefore, a reasonable assembly
In modern electronic equipment manufacturing, the cost of printed circuit boards (PCBs) represents a significant portion of the total product cost. The custom pcb cost per unit fluctuates due to diverse market demands and technological developments. This article will analyse in detail the main factors affecting the custom pcb cost per unit. 1.Material CostThe material
Circuit card assembly (CCA) is thin, flat board of dielectric material with conductive paths or tracks etched on their surface. In order to automate the production of CCAs, surface mount technology (SMT) and through-hole assembly machines are often used. Those responsible for the layout design and assembly of this form of manufacturing must have extensive
Insulate Metal Substrate, as a type of computer motherboard, aims to improve thermal efficiency and mechanical strength by applying metallisation to a thick substrate. It is also known as aluminium substrate, aluminium cladding or metal clad PCB (MC PCB), and even thermally conductive PCB (in fact, all PCBs are thermally conductive). Compared to the regular
Insulate metal substrates are made using a unique insulating material that presses the copper foil of the circuit board to the metal substrate. The metal substrate is specially treated to increase adhesion and resilience, which allows the board to withstand the mechanical and thermal stresses of many applications. The insulating material is a special blend
Semiconductor base material is an indispensable component in the development of contemporary advanced manufacturing, which is widely used in the production of various electronic devices such as transistors, light-emitting diodes and solar cells. In the manufacturing process of semiconductor products, selecting the right substrate is a crucial part of the process, as the quality of
