PCB Assembly

pcb board assembly

Common defects in pcb board assembly processing

PCB board assembly processing, there may be a variety of defects, these defects can be categorised as the following major aspects, designed to improve product quality and reduce the defective rate. Welding defectsWelding is a key part of PCB board assembly processing, common welding defects include: False soldering (Dry Joints/Cold Solder): refers to incomplete solder […]

dip

What is dual inline package?

What is dual inline package? Dual inline package (DIP) is a type of integrated circuit package whose main feature is that the integrated circuit chip is mounted on two parallel rows of metal pins. This type of package is simple, easy to produce and maintain, so it is widely used in the electronics industry. Dual

body to body clearance for smt parts​

Body to body clearance for smt parts

The body to body clearance for smt parts is the minimum distance that must be maintained between two neighboring components in surface mount technology (SMT). This distance is required to ensure board performance and reliability while avoiding electromagnetic interference and thermal conduction problems. Minimum body to body clearance for smt parts​ StandardIPC-7351B is an industry

smt connectors

Explanation of SMT connectors

SMT connectors are connectors assembled using SMT technology. In specific use, SMT connectors like SMT components, for the connector pads, are directly affixed to the surface of the circuit board, and no longer need to be like the traditional TH connectors need to be pierced to install. SMT connectors are divided into: lying paste connector

through hole assembly

Advantages of through hole assembly

Through-hole assembly, also known as through-hole technology, is a mounting method for electronic components. It consists of inserting components into existing holes in printed circuit boards (PCBs) using the component’s pins and soft brazing of electronic components by hand assembly or automatic insertion loaders. Advantages of through hole assemblyThrough hole assembly technology, or THT for

pcba

PCBA mass production common problems and solutions

In the PCBA mass production process, due to the expansion of production scale and process complexity increases, often encounter some common problems. The following will explore these issues in depth and provide the corresponding solutions. Design and Material Preparation StageIgnoring the special needs of mass production during the design phase can lead to subsequent manufacturing

automotive circuit board

Automotive circuit board PCBA manufacturing and technology

As the core component of automotive electronic system, the manufacturing quality of automotive circuit board (PCBA) is directly related to the performance and safety of the whole vehicle. Due to the complexity of the automotive operating environment, PCBA production needs to meet the high reliability, high temperature resistance, vibration resistance and other stringent requirements. In

tin explosion

Reasons and solutions for PCB tin explosion phenomenon

The phenomenon of PCB tin explosion refers to the occurrence of tin explosion and ejection at the junction of solder joints and soldering materials during the soldering process of PCB (printed circuit board). Specifically, when the high-temperature soldering iron tip or soldering heat source comes into contact with the solder wire or solder paste, if

pcba processing

Optimisation of pcba processing costs

In the fierce competition in the electronics manufacturing industry, effective control of PCBA (Printed Circuit Board Assembly) processing costs is the key to enhancing the competitiveness of enterprises. From board design to component sourcing, to placement and assembly testing, every step of the process holds the potential for cost optimization. In order to minimize PCBA

solder blow hole

PCB solder blow hole defects and solution

Solder blow hole refers to the plug-in over the wave soldering, the hole in the gas due to high temperature and out of the solder, so that the hollow formed in the solder. Due to high temperature and high humidity, plating quality, organic pollutants and other reasons caused by plug-in solder joints blow holes, often

pcba coating

PCBA Coating Improves Electronics Performance

PCBA coating is the process of evenly coating the PCBA surface with a specific material,usually triple-proof paint or other protective coatings.This process is generally carried out after the PCBA has undergone placement,soldering and other processes and has completed electrical performance testing. PCBA coating process usually includes the following core steps:Cleaning: Remove dust,oil,flux residue and other

automotive pcb assembly

Automotive pcb assembly processing flow

With the rapid development of automotive electronics technology,automotive pcb assembly as the core component of automotive intelligence and automation,the importance of its processing process is becoming increasingly prominent. The processing flow of automotive pcb assembly:1.Preparation stage of raw materialsCircuit board substrate selection: according to the special needs of automotive electronics, select the appropriate circuit board

automotive pcb assembly

Automotive pcb assembly​ driving the future

Automotive pcb assembly​,specifically refers to the use of automated placement technology,the various types of electronic components will be accurately placed on top of the printed circuit board (PCB),and undergo a series of processes such as soldering,testing,and ultimately produce a specific function of the electronic control components.Such components play a vital role in various electronic systems

pcba

PCB to PCBA Manufacturing Process

In the manufacturing process of modern electronic products, the manufacturing of printed circuit board assembly (PCBA) is undoubtedly one of the core links. From a bare PCB bare board, to eventually become a feature-rich, stable performance of the core components of electronic products, PCBA manufacturing process is full of precision and efficiency. From the PCB

EMC

Capacitive Resistors Guard EMC Safety

Electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection are two crucial considerations in the design and manufacture of electronic equipment, EMC covers both electromagnetic immunity (EMS) and electromagnetic interference (EMI), which are directly related to the stable operation of the equipment in complex electromagnetic environments and the control of interference with other equipment. ESD protection

electronic components

Selection of Electronic Components and Substrates for PCBA

Principles of Electronic Component SelectionPerformance and Reliability FirstWhen selecting electronic components, performance and reliability are the primary considerations, covering electrical characteristics, temperature range and voltage resistance. Key components, such as processors and memories, should be reliable products of well-known brands and proven in the market to ensure product stability and improve overall performance. Appropriate Packaging

wave soldering process

Wave soldering process optimisation

As an integral part of the electronics manufacturing industry, wave soldering has a direct impact on the performance and reliability of electronic products in terms of soldering quality. Optimising the wave soldering process means striving for excellence in every detail to ensure that every solder joint is the best it can be. Wave soldering typically

PCBA

PCBA SMD preparation and processing considerations

PCBA chip processing is one of the core links in the manufacturing process of electronic products, which includes a number of stages from circuit design to product moulding. Each stage needs to be carefully prepared to ensure that the production process is carried out smoothly, as well as the quality and reliability of the final

ate in pcba testing

ate in pcba testing

Ate in pcba testing means testing the electrical conductivity and input-output values of the PCBA circuit board with mounted electronic components. In the design of the PCB circuit board, there are numerical relationships such as voltage and current between different test points. It is necessary to use professional testing equipment or manually operate a multimeter

light emitting diode

How to check light emitting diode with multimeter

An LED (light emitting diode) is a semiconductor diode,specifically a p-n junction, that emits light when a positive current flows from the anode (labelled ‘+’, i.e., positive) to the cathode (labelled ‘-’, i.e., negative). The symbol of the diode is usually represented by an arrow that meets the vertical line at the front end,and the

common components on a PCBA

Overview of common components on a PCBA

PCBA processing is the core process of circuit board manufacturing, covering the two main aspects of PCB manufacturing and SMT placement processing, in which the addition of electronic devices is indispensable. Electronic devices are not only the basic elements of PCBA processing, but also play a decisive role in the performance and quality of the

PCB Assembly Capability

PCB Assembly Capability

iPCB has a highly creative team with extensive experience in the PCBA industry. To provide customers with high-quality, efficient, economical, and applicable products, as well as professional PCBA one-stop services. PCBA manufacturing capabilitySMT SMT processing: Supports 0201 component SMT packaging, with a daily production capacity of 8 million points and 8 SMT production lines. At

SMT Assembly Factory

SMT Assembly

SMT = Surface Mount Technology, SMT is currently the most popular technology and process in the electronic assembly industry. The electronic manufacturing industry is experiencing rapid development. SMT assembly, as the core technology of this transformation, is leading electronic manufacturing towards a new future. SMT assembly is a technology that directly installs electronic components on

Integrated Circuit

Integrated Circuit

Integrated circuit = IC, an IC is a type of microelectronic device that developed in the late 1950s to 1960s as a new type of semiconductor device. It is an electronic device that undergoes semiconductor manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, and aluminum evaporation, integrating all the semiconductor, resistor, capacitor, and other components

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