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double sided pcb

Double Sided PCB Soldering Tips and Precautions

Due to their high routing density and excellent space utilisation, double sided pcbs are widely used in various electronic products. However, their dual-sided layout and metallised via structure place higher demands on the soldering process. From flux spraying and selective soldering to the sequence of manual soldering and polarity identification, every detail directly affects the […]

multilayer pcb

Layering strategies for multilayer PCBs

The layer-up strategy for multilayer PCBs directly determines signal integrity, power supply stability and electromagnetic compatibility (EMC), and is a core skill that hardware engineers must master. A well-designed layer-up arrangement can suppress interference and enhance reliability at the lowest cost; conversely, it may lead to issues such as signal distortion and failure in EMC

BGA packaging

BGA Packaging Design and Defect Prevention and Control

BGA packaging has become the mainstream form of integrated circuit packaging due to its high density, high reliability and excellent electrical and thermal performance. Compared to traditional DIP and QFP packages, BGA distributes solder balls evenly across the underside of the package, resolving the issue of bridging between closely spaced pins, shortening lead lengths, reducing

BGA substrate

Manufacturing Process and Applications of BGA Substrates

A BGA substrate (Ball Grid Array Substrate) is the core carrier of a ball grid array package; essentially, it is a high-density interconnect (HDI) multilayer PCB used to mount the chip, provide electrical interconnection between the chip and the motherboard, and offer mechanical support, with solder bumps arranged in an array on the reverse side.

bare pcb

Classification and Testing of Bare PCBs

A bare PCB serves as the core framework of a traditional circuit board; its fundamental function is to guide the flow of current through carefully designed circuit paths, and it is widely used in various types of electronic devices. A blank PCB (i.e. a bare board) features a simple structure, offering engineers and designers ample

pcb routing

Tips for Optimising PCB Routing

In the design of power adapters, the quality of the PCB routing on the bare PCB directly determines the stability, reliability and electromagnetic compatibility (EMC) of the entire unit. A well-designed PCB routing not only effectively suppresses noise and reduces losses, but also helps to mitigate safety compliance risks. Six Key PCB Routing Techniques 1.Current

Optimizing Relays Electronic Components for High-Voltage DC Switching

Optimizing Relays Electronic Components for High-Voltage DC Switching

The Physical Framework and Operating Limits of Relays Electronic components As the progenitor of “weak current controlling strong current” in the electronics industry, the core value of relays lies in current isolation (Galvanic Isolation). Although modern semiconductor switches are constantly emerging, electromagnetic relays (EMRs) remain an irreplaceable industrial pillar in the face of requirements for

fccl

Classification and Manufacturing Processes of FCCL

Printed circuit boards (PCBs) are the core components of modern electronic products, and their manufacture relies on a key base material: copper-clad laminate (CCL). Depending on product form and application, CCL is primarily divided into two categories: rigid copper-clad laminate (conventional CCL) and flexible copper-clad laminate (FCCL). Among these, FCCL, owing to their unique bendable

RF board

Core Specifications and Practical Implementation of RF Board Layout

The soundness of RF board layout directly determines the transmission quality of RF signals, interference immunity and the overall performance of the equipment; it is a core aspect of RF product design. This article focuses on its core principles, preparation, practical implementation and simulation, outlining key points to guide engineering practice. Core Principles of RF

drone pcb

Core Components of Drone PCB Assembly (PCBA) and Key Procurement Considerations

In today’s rapidly evolving technological landscape, drones have become deeply integrated into every aspect of daily life and industrial production, emerging as indispensable smart devices. At the heart of a drone’s stable operation lies drone PCB assembly (printed circuit board assembly) – this compact circuit board serves as the drone’s ‘brain’ for computation, its ‘nerves’

leaded solder

A comparison of leaded solder and lead free solder processes

The key difference between leaded solder and lead free solder processes lies in the lead content of the solder. According to the EU RoHS Directive, lead content must be below 1,000 ppm (parts per million) to be considered compliant; Japanese standards are even stricter, requiring a level below 500 ppm. Lead-free solders typically consist mainly

rigid flex board

Key Considerations in the Design of Rigid Flex Boards

As PCBs evolve towards being lighter, thinner, smaller and more compact, rigid flex boards (also known as rigid-flex assemblies) have emerged as a key technology for reducing the size and enhancing the performance of electronic products, alongside high-density rigid boards, thanks to their three-dimensional connection and assembly capabilities. By combining flexible circuits (FPCs) with traditional

gold plated circuit board

Choosing between gold plated circuit board and immersion gold plated boards

As IC pin densities increase and signal frequencies rise, the choice of PCB surface treatment process has become particularly critical. Gold plated circuit boards were once favoured for their high flatness and long shelf life, but issues such as gold whisker short circuits and the skin effect have become increasingly prominent in high-density, high-frequency applications.

FCT

Key Points of FCT Testing

What is FCT testing? The core principle of FCT (Functional Circuit Test) is to treat the PCBA as a complete functional module, simulate its actual operating environment within the end product, apply real-world input signals, and verify whether the output response meets design requirements. Put simply, it involves providing the Unit Under Test (UUT) with

rigid pcb

Substrates and processes for rigid PCBs

The defining characteristic of rigid PCBs (rigid printed circuit boards) is that they are ‘non-flexible’; relying on their rigid substrate, they provide stable support and electrical connection pathways for electronic components. Unlike the flexible substrates used in flexible PCBs, the rigidity of a rigid PCB derives entirely from its core substrate. In actual production, the

IC packaging

Types of Functional Structures in IC Packaging and Methods for Selection

IC packaging involves encapsulating the bare die—cut from a wafer—into a complete component that can be directly mounted onto a PCB. It fulfils three fundamental functions: establishing an electrical connection between the die and external circuits, protecting the die from environmental damage, and aiding heat dissipation. To give a practical example: in the case of

RF PCB

Key Points in RF PCB Design and Manufacturing

What is a RF PCB? Put simply, a RF PCB is a printed circuit board specifically designed for the transmission and control of radio frequency and microwave signals. Within the industry, PCBs operating at frequencies above 100 MHz are generally classified as RF PCBs, whilst those operating at frequencies above 2 GHz fall within the

through hole PCB

Design and Applications of Through Hole PCB Technology

In the field of PCB design and assembly, through hole PCBs remain a core technology—even though surface-mount technology (SMT) now dominates most modern devices. Many engineers still opt for through hole PCBs when designing products that require high mechanical strength, high power handling capacity, or ease of maintenance. In practice, you will find through hole

6 layer pcb

Practical 6 layer PCB Design

As electronic products continue to evolve towards lighter, thinner designs and higher levels of integration, hardware design is no longer confined to simple two- or four-layer boards. 6 layer PCBs (six-layer printed circuit boards), as a compromise solution that balances performance, size, cost and structural stability in complex circuit designs, have become one of the

An In-Depth Analysis of Hardware PCB Proto Board Development

An In-Depth Analysis of Hardware PCB Proto Board Development

Redefining the PCB Proto board : A Core Hub and Risk Control Point in Hardware Product Development In the grand narrative of hardware innovation, the PCB prototype is often misunderstood as a simple, transitional “circuit verification object.” This perception is dangerous and costly. We must redefine it as a “miniature product” that undergoes the first

millimetre wave radar

Principles and Applications of Millimetre Wave Radar

Millimetre wave radar is a precision detection device operating in the 30–300 GHz millimetre wave band. Its wave length lies between that of microwaves (1–100 mm) and far-infrared waves (0.75–1 mm), combining characteristics of both. As one of the core sensors in intelligent driving perception systems, millimetre wave radar emits high-frequency millimetre-wave signals and receives

millimetre wave radar

Innovations in the metallisation of millimetre wave radar antennas

In millimetre wave radar systems, the antenna is the core component that determines system performance; its design and manufacturing process directly influence detection range, angular resolution, sensitivity and interference resistance, and form the foundation for achieving precise sensing and efficient response. From in-vehicle ADAS to industrial IoT and aerospace, the continuous expansion of millimetre wave

pcb thickness

Classification of PCB Thickness and Its Impact on Performance

In printed circuit board (PCB) design, pcb thickness is a crucial parameter. Currently, 1.6 mm is the most commonly used standard thickness in the vast majority of general-purpose applications, such as consumer electronics and industrial control. However, as electronic products evolve towards miniaturisation, high performance and multifunctionality, PCB thickness must also be selected flexibly according

gold plating

Causes and Solutions for Blackening of Gold Plating on PCB Boards

During the PCB manufacturing process, the darkening of the gold plating layer is a relatively common cosmetic defect. This not only affects the visual appearance of the product but may also indirectly impact its electrical conductivity and resistance to oxidation, resulting in unnecessary production losses. Based on practical production experience, this issue is not caused

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