HDI PCB (High-Density Interconnect printed circuit boards) and conventional multilayer printed circuit boards are two types of PCB products in the electronics manufacturing sector that differ significantly in terms of application scenarios and technical standards. As electronic devices rapidly evolve towards miniaturisation, slimness, high performance and high integration, the limitations of traditional multilayer PCB manufacturing […]
Thanks to their superior physical properties and advantages in large-scale mass production, glass substrates have emerged as the key alternative solution in the advanced packaging sector for next-generation high-bandwidth, high-computing-power AI chips. As high-end AI chip processes continue to evolve, with increasing chip sizes and significantly higher integration levels, the physical limitations and process bottlenecks
From Organic Resin to Glass: Why Intel Sparked a “Materials Revolution” in Chip Substrates In the history of semiconductor chip development, the renowned “Moore’s Law” has consistently guided the industry’s integration efforts at breakneck speed. However, as transistor sizes approached physical limits (e.g., reaching 2 nanometers or even smaller process technologies), squeezing space onto a
The PCBA manufacturing process encompasses several core stages, including substrate pre-treatment, solder paste printing, component placement, reflow soldering, through-hole insertion, wave soldering, functional testing and final product inspection.The appropriate production processes vary significantly depending on the specifications and structure of the PCB;manufacturers select the appropriate manufacturing processes based on the PCB design, component types and
As the core component responsible for computing power transmission, signal exchange and power distribution within AI server PCB, high-layer-count, high-performance PCBs directly determine model training efficiency, system stability and data transmission limits. Among these, high-end PCBs featuring a 44-layer ultra-high-density architecture and utilising M9 ultra-low-loss speciality substrate have become the standard core hardware for the
BGA Packaging Pin Evolution and Basic Fan-Out Strategy In the world of modern high-density interconnect circuit board design, BGA PCB design is undoubtedly the ultimate watershed moment testing an engineer’s skills. Traditional chip pins, like the legs of a centipede, are neatly arranged around the chip (e.g., in QFP packaging). We can see and touch
Multilayer microwave circuit boards are specialised printed circuit boards designed for high-frequency applications. Through a composite structure of multiple layers of insulating substrate and conductive copper foil, they enable the efficient transmission of electromagnetic waves and functional integration. Their core lies in the use of microwave transmission structures such as microstrip lines and striplines to
As the functionality of electronic products continues to evolve, the number of components mounted on PCBs is constantly increasing, component pin pitches are becoming increasingly fine, and circuit design is gradually shifting from conventional wide-pitch surface-mount technology to ultra-fine-pitch BGA layouts. Thanks to their high-density integration, excellent electrical performance and thermal management advantages, BGA (Ball
As a core foundational material in the high-end chip packaging process, the classification of IC substrates essentially follows a tiered matching principle of ‘material properties → structural form → application requirements’. Different types of IC substrates exhibit significant differences in key aspects such as wiring density, temperature resistance and production costs; these differences directly determine
In the field of RF and microwave electronics, the performance of substrate materials directly determines the potential for circuit miniaturisation, signal integrity and environmental adaptability. Thanks to its outstanding comprehensive properties, aluminium oxide ceramic substrate has become one of the most widely used core substrate materials in this field. Its high dielectric constant facilitates circuit
Following surface-mount soldering (reflow soldering), BGA devices typically undergo several post-process steps to enhance their environmental adaptability, mechanical strength and reliability. In accordance with industry practice, these primarily comprise three types of processes: conformal coating, underfill and adhesive reinforcement, and PCB depanelling. The technical requirements and key implementation points for these processes are outlined below.
What is reflow soldering? Reflow soldering is a core soldering process in surface-mount technology (SMT), used to establish a mechanical connection and electrical continuity between the terminals or leads of surface-mount devices (SMDs) and the pads on a printed circuit board (PCB); it is a type of soft soldering. The basic principle involves remelting the
In the printed circuit board industry, the OSP process is widely used. Thanks to its outstanding advantages—including low cost, a simple manufacturing process and excellent solder joint reliability—it has become the preferred process for many PCB manufacturers. OSP, or Organic Solderable Protective Coating, involves the chemical deposition of a thin organic protective film onto the
Semiconductor packaging and testing (commonly referred to as ‘packaging and testing’) is a critical final stage in the chip manufacturing supply chain. It involves the post-processing that follows wafer fabrication, protecting the chip’s core circuitry through packaging and establishing electrical interconnections. Through multi-dimensional testing, it screens for good products and verifies performance stability. As such,
Aluminum PCBs (Aluminum substrates) are a core product within the category of high-performance metal-clad copper-clad laminates (MCPCBs). Their most notable advantage lies in their exceptional thermal conductivity, which is the key distinction from standard PCBs and makes them widely used in high-power applications. Compared to copper-based PCBs, while the thermal conductivity of pure aluminum (approximately
With the continuous advancement of communication technologies and the shift towards intelligent automotive electronics, market demand for high-power printed circuit boards and high frequency microwave pcbs continues to rise, becoming a key driver of growth in the printed circuit board industry. Microwave pcbs are manufactured using specialised microwave-grade copper-clad laminates in conjunction with conventional rigid
As electronic products evolve towards higher integration and miniaturisation, Ball Grid Array (BGA) packaging has become an indispensable component type in modern PCB design, thanks to its high-density interconnections and excellent electrical and thermal performance. However, the pad design, routing planning and reliability verification of BGA packaging directly determine the manufacturing yield and long-term stability
Due to their high routing density and excellent space utilisation, double sided pcbs are widely used in various electronic products. However, their dual-sided layout and metallised via structure place higher demands on the soldering process. From flux spraying and selective soldering to the sequence of manual soldering and polarity identification, every detail directly affects the
The layer-up strategy for multilayer PCBs directly determines signal integrity, power supply stability and electromagnetic compatibility (EMC), and is a core skill that hardware engineers must master. A well-designed layer-up arrangement can suppress interference and enhance reliability at the lowest cost; conversely, it may lead to issues such as signal distortion and failure in EMC
BGA packaging has become the mainstream form of integrated circuit packaging due to its high density, high reliability and excellent electrical and thermal performance. Compared to traditional DIP and QFP packages, BGA distributes solder balls evenly across the underside of the package, resolving the issue of bridging between closely spaced pins, shortening lead lengths, reducing
A BGA substrate (Ball Grid Array Substrate) is the core carrier of a ball grid array package; essentially, it is a high-density interconnect (HDI) multilayer PCB used to mount the chip, provide electrical interconnection between the chip and the motherboard, and offer mechanical support, with solder bumps arranged in an array on the reverse side.
A bare PCB serves as the core framework of a traditional circuit board; its fundamental function is to guide the flow of current through carefully designed circuit paths, and it is widely used in various types of electronic devices. A blank PCB (i.e. a bare board) features a simple structure, offering engineers and designers ample
In the design of power adapters, the quality of the PCB routing on the bare PCB directly determines the stability, reliability and electromagnetic compatibility (EMC) of the entire unit. A well-designed PCB routing not only effectively suppresses noise and reduces losses, but also helps to mitigate safety compliance risks. Six Key PCB Routing Techniques 1.Current
The Physical Framework and Operating Limits of Relays Electronic components As the progenitor of “weak current controlling strong current” in the electronics industry, the core value of relays lies in current isolation (Galvanic Isolation). Although modern semiconductor switches are constantly emerging, electromagnetic relays (EMRs) remain an irreplaceable industrial pillar in the face of requirements for
