As electronic devices progress towards higher power and miniaturization, PCB thermal management faces severe challenges. Screen printing, once considered merely an auxiliary process for marking and insulation, is now emerging as a crucial support for enhancing PCB heat dissipation efficiency through multi-dimensional innovations in materials, structures, and processes. Core Objectives of PCB Thermal ManagementThe primary […]
PCB screen printing is a process that transfers special inks onto the substrate surface through a screen stencil to form characters, solder mask patterns, or conductive circuits. Its core difference lies in the need to meet the stringent requirements of the electronics industry for precision, temperature resistance, and adhesion. It supports PCB reliability throughout the
In the field of PCB manufacturing, screen printing refers to the process technology whereby conductive pastes, solder resist inks, character inks and other materials are precisely transferred onto the surface of the PCB substrate through a screen stencil using a squeegee under pressure. Following curing, this forms specific patterns or functional layers. Its core principle
PCBs (printed circuit boards) serve as the “nerve centre” of electronic devices, bearing the core mission of signal transmission and electrical interconnection. Their performance directly determines the stability and reliability of electronic products, with the key to achieving this lying in a seemingly simple yet crucial process within PCB manufacturing: screen printing. The core value
The Nature and Formation Mechanism of Cold Solder Joints In electronic manufacturing and soldering quality control, cold solder joints are a seemingly basic but long-underestimated hidden problem. It’s not a “rare defect,” but a common source of failure throughout the entire process of manual soldering, SMT assembly, wave soldering, and even rework. Many products perform
The complex processes involved in HDI PCB, such as laser microvia drilling and multi-layer buried/blind vias, while enhancing interconnect density, also exponentially increase the risk of manufacturing defects. A mere 0.075mm deviation in a microvia or a micrometre-level flaw in the copper plating can lead to signal attenuation, continuity failure, or even cause end-device malfunctions.
HDI PCB, serving as the core carriers for high-end electronic devices, meets the demands for miniaturisation and high performance through their high-density interconnect characteristics. However, complex processes such as laser drilling and multi-layer buried/blind vias also drive up manufacturing costs. Many enterprises in HDI PCB applications often fall into the misconception of ‘achieving performance targets
The high-density pin layout of BGA packaging is emerging as a core constraint on the path towards miniaturisation and high performance in premium electronic devices. When pin pitch shrinks to 0.5mm or even 0.4mm, traditional fan-out methods either suffer signal congestion due to insufficient routing space or experience performance degradation from excessively long bypass paths.
In this era of rapid technological advancement, autonomous driving is progressively evolving from concept to reality, emerging as a pivotal direction for the automotive industry’s future development. However, for autonomous driving to achieve truly safe and reliable operation, the dependability of its core components—sensors—is paramount. Among numerous technologies enhancing sensor reliability, LTCC technology stands out,
Micro-hole machining on ceramic substrates represents the final hurdle in realising the performance of high-end electronic devices. The brittle yet hard ceramic materials (such as aluminium oxide and aluminium nitride) impose extreme demands on drilling precision and stability, particularly for micro-holes ≤0.5mm in diameter. Improper processing readily leads to defects like chipping, cracking, and rough
The Fundamental Differences and Design Significance of FFC and FPC Cables In modern electronic products, flexible interconnect technology is increasingly becoming a critical component. The selection and design of FFC (Flat Flexible Cable) and FPC (Flexible Printed Circuit) cables directly impact product reliability, performance, and assembly efficiency. Many people easily confuse the two, but in
The precision of ceramic circuit board design directly determines product reliability and mass production yield rates. Compared to traditional FR4 circuit boards, ceramic circuit board (such as aluminium oxide and aluminium nitride) exhibit brittle-hard characteristics, unique thermal expansion coefficients, and specific process compatibility requirements. Many engineers, either adhering to conventional design thinking or overlooking the
Ceramic circuit boards, owing to their high thermal conductivity and excellent insulation properties, have become a key material in high-end electronics. However, their high cost has hindered widespread adoption. Reasons for the High Cost of Ceramic Circuit Boards The high cost of ceramic circuit boards is not caused by a single link but results from
With the rapid development of power electronics technology, high-voltage circuits—thanks to their high efficiency and stability—have been widely adopted in new energy vehicles, industrial power supplies, and power systems, among many other fields. However, during operation, high-voltage circuits are exposed to severe challenges such as high voltage, strong electric fields, elevated temperatures, and complex environmental
Why FMC Connector PCB Layout Often Determines System Limits In high-speed digital system design, many performance issues don’t originate with the chip itself, but rather occur in the very first step after the chip leaves its package. The FMC connector is precisely such an easily underestimated yet highly critical interface component. When a system operates
Vehicle grade PCB sockets refer to printed circuit board end connectors that meet the requirements of harsh automotive environments such as high temperature, vibration, and humidity, and are used for signal/power connections of automotive electronic control units (ECUs) and other onboard devices. They have high reliability, high sealing (such as IP69K), miniaturized design, and solder
The dielectric properties of PCB substrates have become a critical factor influencing device performance and stability. Conventional FR4 boards, due to their high dielectric loss, struggle to meet the demands of medium-to-high frequency signal transmission. Meanwhile, high-end, high-frequency materials remain prohibitively expensive and difficult to process, hindering their widespread adoption in consumer electronics and similar
As the most widely used substrate in the PCB field, the flame retardancy of FR4 directly impacts the fire risk of end products. UL94-V0, the industry-recognised flame retardancy rating standard, serves as the ‘safety pass’ for FR4 board. Understanding the UL94-V0 standard for FR4 laminate enables precise control of safety thresholds in product design, preventing
Below is a precise, idiomatic, and industry-appropriate English translation suitable for use in PCB engineering documentation, technical white papers, or professional marketing materials.Thanks to its mature manufacturing ecosystem and excellent cost performance, FR4 has long dominated the PCB substrate market. However, as signal frequencies climb into the GHz range, signal-integrity challenges in FR4 routing are
Below is a faithful, technically accurate, and idiomatic English translation suitable for professional use in electronics manufacturing, PCB engineering, or technical marketing materials.As the mainstream PCB substrate, the performance stability of FR4 directly determines the reliability of end products. However, during the drilling process, the high-speed penetration of the drill bit into the substrate generates
In the RF PCB design process, the selection of high-frequency laminates often falls into the dual pitfalls of prioritising performance at all costs and prioritising cost at all costs. A prevalent misconception within the industry holds that high-frequency applications necessitate premium high-frequency laminates, viewing high-end materials like Rogers as the sole guarantee of performance. This
The core relationship between lead-free soldering and FR4 boards lies in the challenge posed by the elevated soldering temperature to the thermal properties of the substrate. Compared to traditional leaded soldering, the temperature characteristics of lead-free soldering directly exceed the performance limits of conventional FR4, compelling upgrades in the thermal stability and mechanical strength of
Why are “Package Substrate” and “PCB” often confused? In the semiconductor and electronics manufacturing industry, “Package Substrate” and “PCB” are frequently discussed in the same context, and even used interchangeably in some non-professional settings. This confusion is not surprising, as they both appear to be circuit carriers composed of multiple layers of materials, and both
FR4 PCBs (glass fiber–reinforced epoxy laminate boards), as the most widely used type of printed circuit board, have production efficiency and cost control that directly impact overall product competitiveness. Depanelization, as a critical step in the PCB manufacturing process, achieves an optimized balance among mass-production efficiency, product quality, and manufacturing cost through systematic process design.
