As PCBs evolve towards being lighter, thinner, smaller and more compact, rigid flex boards (also known as rigid-flex assemblies) have emerged as a key technology for reducing the size and enhancing the performance of electronic products, alongside high-density rigid boards, thanks to their three-dimensional connection and assembly capabilities. By combining flexible circuits (FPCs) with traditional […]
As IC pin densities increase and signal frequencies rise, the choice of PCB surface treatment process has become particularly critical. Gold plated circuit boards were once favoured for their high flatness and long shelf life, but issues such as gold whisker short circuits and the skin effect have become increasingly prominent in high-density, high-frequency applications.
What is FCT testing? The core principle of FCT (Functional Circuit Test) is to treat the PCBA as a complete functional module, simulate its actual operating environment within the end product, apply real-world input signals, and verify whether the output response meets design requirements. Put simply, it involves providing the Unit Under Test (UUT) with
The defining characteristic of rigid PCBs (rigid printed circuit boards) is that they are ‘non-flexible’; relying on their rigid substrate, they provide stable support and electrical connection pathways for electronic components. Unlike the flexible substrates used in flexible PCBs, the rigidity of a rigid PCB derives entirely from its core substrate. In actual production, the
IC packaging involves encapsulating the bare die—cut from a wafer—into a complete component that can be directly mounted onto a PCB. It fulfils three fundamental functions: establishing an electrical connection between the die and external circuits, protecting the die from environmental damage, and aiding heat dissipation. To give a practical example: in the case of
What is a RF PCB? Put simply, a RF PCB is a printed circuit board specifically designed for the transmission and control of radio frequency and microwave signals. Within the industry, PCBs operating at frequencies above 100 MHz are generally classified as RF PCBs, whilst those operating at frequencies above 2 GHz fall within the
In the field of PCB design and assembly, through hole PCBs remain a core technology—even though surface-mount technology (SMT) now dominates most modern devices. Many engineers still opt for through hole PCBs when designing products that require high mechanical strength, high power handling capacity, or ease of maintenance. In practice, you will find through hole
As electronic products continue to evolve towards lighter, thinner designs and higher levels of integration, hardware design is no longer confined to simple two- or four-layer boards. 6 layer PCBs (six-layer printed circuit boards), as a compromise solution that balances performance, size, cost and structural stability in complex circuit designs, have become one of the
Redefining the PCB Proto board : A Core Hub and Risk Control Point in Hardware Product Development In the grand narrative of hardware innovation, the PCB prototype is often misunderstood as a simple, transitional “circuit verification object.” This perception is dangerous and costly. We must redefine it as a “miniature product” that undergoes the first
Millimetre wave radar is a precision detection device operating in the 30–300 GHz millimetre wave band. Its wave length lies between that of microwaves (1–100 mm) and far-infrared waves (0.75–1 mm), combining characteristics of both. As one of the core sensors in intelligent driving perception systems, millimetre wave radar emits high-frequency millimetre-wave signals and receives
In millimetre wave radar systems, the antenna is the core component that determines system performance; its design and manufacturing process directly influence detection range, angular resolution, sensitivity and interference resistance, and form the foundation for achieving precise sensing and efficient response. From in-vehicle ADAS to industrial IoT and aerospace, the continuous expansion of millimetre wave
In printed circuit board (PCB) design, pcb thickness is a crucial parameter. Currently, 1.6 mm is the most commonly used standard thickness in the vast majority of general-purpose applications, such as consumer electronics and industrial control. However, as electronic products evolve towards miniaturisation, high performance and multifunctionality, PCB thickness must also be selected flexibly according
During the PCB manufacturing process, the darkening of the gold plating layer is a relatively common cosmetic defect. This not only affects the visual appearance of the product but may also indirectly impact its electrical conductivity and resistance to oxidation, resulting in unnecessary production losses. Based on practical production experience, this issue is not caused
High TG laminates refer to materials with a Tg value typically above 170°C; for example, common lead-free compatible laminates can have a Tg of around 185°C. Furthermore, the thermal decomposition temperature (Td) at which these laminates lose 5% of their mass is also higher—taking a standard FR4 laminate from a particular brand as an example,
In the electronic assembly process, the baking of FR4 PCBs may seem unremarkable, but it is in fact a critical step that determines the quality of the solder joints. Its primary purpose is to thoroughly remove any moisture absorbed by the board during storage, transport or whilst in the workshop environment. If moisture remains within
Rolled copper and electrolytic copper are the two main types of copper foil used in high frequency PCBs for lamination with PTFE boards. Due to differences in their manufacturing processes, there are significant variations between the two in terms of lamination strength, high-frequency performance, process compatibility and environmental resistance. Rolled copper is produced through a
Unlike standard PCB substrates, the thermal conductivity of PTFE PCBs is not determined solely by the substrate itself, but rather by the combined effects of substrate properties, filler modification, manufacturing processes and application scenarios. The core challenge in optimising thermal conductivity lies in enhancing thermal efficiency without compromising PTFE’s inherent advantages of low high-frequency loss.
What is a BGA? When dealing with high-density integrated circuits (ICs) – such as microprocessors or complex ASICs – you are likely to encounter ball grid arrays (BGAs). Unlike traditional pin-based packages, this surface-mount technology utilises a full array of solder balls on the underside of the chip, fundamentally resolving the issue of insufficient pin
Unlike standard PCBs, the core of multilayer RF PCB design lies in balancing signal integrity with manufacturability. High-frequency signals are prone to attenuation, reflection and crosstalk during transmission, and the complexity of multi-layer structures further exacerbates these issues. The core value of multilayer RF PCBs lies in utilising three-dimensional routing to overcome the performance limitations
Flexible printed circuit boards (FPCs), with their inherent properties of being bendable, foldable, lightweight, and compact, are ideally suited to the requirements of tight spaces and complex structural assemblies in sectors such as smartphones, wearable devices, automotive electronics, medical instruments and aerospace. They have become an indispensable core interconnect component in modern electronic products. The
The stack up design of a PCB (printed circuit board) directly determines its electrical performance, mechanical reliability, manufacturability and cost. Among these, Through Hole Board and HDI boards are the two main types, and there is a fundamental difference in the underlying logic of their stack up designs—this difference stems from the fundamental differences between
HDI PCB(High Density Interconnect) is a core PCB manufacturing process designed for high-density wiring, characterised primarily by the use of micro-blind vias and buried blind vias to achieve efficient interconnection between different copper layers within the circuit board. As electronic products rapidly evolve towards lighter, thinner and higher-performance designs, market demand for HDI boards continues
In the efficiency race of power electronics systems, engineers often focus on “front-end parameters” such as the on-resistance, gate charge, and reverse recovery charge of switching devices. However, a deeper, more fundamental factor—the “Substrate Diode“—whose impact is amplified after system integration, is often the hidden battleground determining the performance ceiling and long-term reliability of the
In the field of PCB manufacturing, the circuit patterning process is a critical factor in determining the performance and quality of the PCB. Among these, Tenting (subtractive process), SAP (semi-additive process) and mSAP (modified semi-additive process) are three core processes, each with its own unique characteristics and suitable applications. These three processes differ significantly in
