Micro-hole machining on ceramic substrates represents the final hurdle in realising the performance of high-end electronic devices. The brittle yet hard ceramic materials (such as aluminium oxide and aluminium nitride) impose extreme demands on drilling precision and stability, particularly for micro-holes ≤0.5mm in diameter. Improper processing readily leads to defects like chipping, cracking, and rough […]
The Fundamental Differences and Design Significance of FFC and FPC Cables In modern electronic products, flexible interconnect technology is increasingly becoming a critical component. The selection and design of FFC (Flat Flexible Cable) and FPC (Flexible Printed Circuit) cables directly impact product reliability, performance, and assembly efficiency. Many people easily confuse the two, but in
The precision of ceramic circuit board design directly determines product reliability and mass production yield rates. Compared to traditional FR4 circuit boards, ceramic circuit board (such as aluminium oxide and aluminium nitride) exhibit brittle-hard characteristics, unique thermal expansion coefficients, and specific process compatibility requirements. Many engineers, either adhering to conventional design thinking or overlooking the
Ceramic circuit boards, owing to their high thermal conductivity and excellent insulation properties, have become a key material in high-end electronics. However, their high cost has hindered widespread adoption. Reasons for the High Cost of Ceramic Circuit Boards The high cost of ceramic circuit boards is not caused by a single link but results from
With the rapid development of power electronics technology, high-voltage circuits—thanks to their high efficiency and stability—have been widely adopted in new energy vehicles, industrial power supplies, and power systems, among many other fields. However, during operation, high-voltage circuits are exposed to severe challenges such as high voltage, strong electric fields, elevated temperatures, and complex environmental
Why FMC Connector PCB Layout Often Determines System Limits In high-speed digital system design, many performance issues don’t originate with the chip itself, but rather occur in the very first step after the chip leaves its package. The FMC connector is precisely such an easily underestimated yet highly critical interface component. When a system operates
Vehicle grade PCB sockets refer to printed circuit board end connectors that meet the requirements of harsh automotive environments such as high temperature, vibration, and humidity, and are used for signal/power connections of automotive electronic control units (ECUs) and other onboard devices. They have high reliability, high sealing (such as IP69K), miniaturized design, and solder
The dielectric properties of PCB substrates have become a critical factor influencing device performance and stability. Conventional FR4 boards, due to their high dielectric loss, struggle to meet the demands of medium-to-high frequency signal transmission. Meanwhile, high-end, high-frequency materials remain prohibitively expensive and difficult to process, hindering their widespread adoption in consumer electronics and similar
As the most widely used substrate in the PCB field, the flame retardancy of FR4 directly impacts the fire risk of end products. UL94-V0, the industry-recognised flame retardancy rating standard, serves as the ‘safety pass’ for FR4 board. Understanding the UL94-V0 standard for FR4 laminate enables precise control of safety thresholds in product design, preventing
Below is a precise, idiomatic, and industry-appropriate English translation suitable for use in PCB engineering documentation, technical white papers, or professional marketing materials.Thanks to its mature manufacturing ecosystem and excellent cost performance, FR4 has long dominated the PCB substrate market. However, as signal frequencies climb into the GHz range, signal-integrity challenges in FR4 routing are
Below is a faithful, technically accurate, and idiomatic English translation suitable for professional use in electronics manufacturing, PCB engineering, or technical marketing materials.As the mainstream PCB substrate, the performance stability of FR4 directly determines the reliability of end products. However, during the drilling process, the high-speed penetration of the drill bit into the substrate generates
In the RF PCB design process, the selection of high-frequency laminates often falls into the dual pitfalls of prioritising performance at all costs and prioritising cost at all costs. A prevalent misconception within the industry holds that high-frequency applications necessitate premium high-frequency laminates, viewing high-end materials like Rogers as the sole guarantee of performance. This
The core relationship between lead-free soldering and FR4 boards lies in the challenge posed by the elevated soldering temperature to the thermal properties of the substrate. Compared to traditional leaded soldering, the temperature characteristics of lead-free soldering directly exceed the performance limits of conventional FR4, compelling upgrades in the thermal stability and mechanical strength of
Why are “Package Substrate” and “PCB” often confused? In the semiconductor and electronics manufacturing industry, “Package Substrate” and “PCB” are frequently discussed in the same context, and even used interchangeably in some non-professional settings. This confusion is not surprising, as they both appear to be circuit carriers composed of multiple layers of materials, and both
FR4 PCBs (glass fiber–reinforced epoxy laminate boards), as the most widely used type of printed circuit board, have production efficiency and cost control that directly impact overall product competitiveness. Depanelization, as a critical step in the PCB manufacturing process, achieves an optimized balance among mass-production efficiency, product quality, and manufacturing cost through systematic process design.
Flexible PCBs, characterized by their bendability and ultra-thin form factor, break through the geometric constraints of traditional rigid boards, while rigid FR4 boards, relying on structural stability, low cost, and ease of processing, continue to dominate the mainstream market. From body-conforming wearable devices to structurally stable industrial control systems, each excels in its respective domain—often
The physical characteristics of millimetre-wave signals render their transmission far more fragile than that of lower-frequency signals, forming the core premise for their reliance on high-density interconnect（HDI） technology. Compared to traditional low-frequency electromagnetic waves, millimetre waves exhibit three inherent limitations, each posing stringent challenges to printed circuit board interconnect techniques. 1.Severe signal attenuation necessitates minimising
SLP (Substrate-like PCB) is not an entirely new technological category, but rather a ‘transitional high-end PCB technology’ bridging the gap between traditional HDI PCBs and IC packaging substrates. Its core positioning lies in integrating the mature manufacturing processes of PCBs with the fine-pitch routing characteristics of IC substrates. This enables higher circuit density and integration
The thermal conductivity coefficient of FR4 serves as a parameter for assessing the thermal performance of FR4 material (glass fibre reinforced epoxy resin). This coefficient is not a fixed absolute value but falls within specific industry standard ranges, exhibiting variations influenced by factors such as substrate formulation and manufacturing processes. According to international standards and
PCB panelization design serves as the pivotal link between R&D and production. High-quality FR4 pcb panels can enhance SMT placement efficiency by over 30% while reducing defect rates; conversely, poorly designed panels impede mass production and inflate costs. Design considerations must balance universal specifications with the material properties and manufacturing characteristics of FR4. The essence
The choice of FR4 PCB color is often bound by ingrained assumptions: green is seen as the “king of cost performance,” black carries an aura of “high-end, high performance,” while red and blue are regarded as signatures of industrial equipment. In PCB selection discussions, this seems almost axiomatic. Yet few people stop to ask whether
As the most widely used substrate material, the glass fibre epoxy structure of FR4 PCBs inherently predisposes their surface copper layers to oxidation and poor solderability. The three mainstream surface finishing processes—HASL, ENIG, and OSP—function like distinct protective armour for FR4 PCBs, each tailored to different application scenarios and performance requirements. Selecting the appropriate process
The Position and Value of AlN Aluminium Nitride in Advanced Electronics Manufacturing As electronic products continue to evolve towards higher power, higher frequency, and higher integration, traditional substrate materials are gradually revealing their bottlenecks in terms of heat dissipation and reliability. Against this backdrop, AlN aluminum nitride, as a high-performance ceramic material, is beginning to
LTCC (Low-Temperature Co-fired Ceramic) technology, a multilayer circuit technique originating in the 1980s, holds a pivotal position in high-density and high-frequency electronics. This process commences with the use of green ceramic powder, meticulously formed into green ceramic tape via a casting process. Subsequently, each layer undergoes sequential punching operations, precise filling of through-hole metal pastes,
