Why are “Package Substrate” and “PCB” often confused? In the semiconductor and electronics manufacturing industry, “Package Substrate” and “PCB” are frequently discussed in the same context, and even used interchangeably in some non-professional settings. This confusion is not surprising, as they both appear to be circuit carriers composed of multiple layers of materials, and both […]
FR4 PCBs (glass fiber–reinforced epoxy laminate boards), as the most widely used type of printed circuit board, have production efficiency and cost control that directly impact overall product competitiveness. Depanelization, as a critical step in the PCB manufacturing process, achieves an optimized balance among mass-production efficiency, product quality, and manufacturing cost through systematic process design.
Flexible PCBs, characterized by their bendability and ultra-thin form factor, break through the geometric constraints of traditional rigid boards, while rigid FR4 boards, relying on structural stability, low cost, and ease of processing, continue to dominate the mainstream market. From body-conforming wearable devices to structurally stable industrial control systems, each excels in its respective domain—often
The physical characteristics of millimetre-wave signals render their transmission far more fragile than that of lower-frequency signals, forming the core premise for their reliance on high-density interconnect（HDI） technology. Compared to traditional low-frequency electromagnetic waves, millimetre waves exhibit three inherent limitations, each posing stringent challenges to printed circuit board interconnect techniques. 1.Severe signal attenuation necessitates minimising
SLP (Substrate-like PCB) is not an entirely new technological category, but rather a ‘transitional high-end PCB technology’ bridging the gap between traditional HDI PCBs and IC packaging substrates. Its core positioning lies in integrating the mature manufacturing processes of PCBs with the fine-pitch routing characteristics of IC substrates. This enables higher circuit density and integration
The thermal conductivity coefficient of FR4 serves as a parameter for assessing the thermal performance of FR4 material (glass fibre reinforced epoxy resin). This coefficient is not a fixed absolute value but falls within specific industry standard ranges, exhibiting variations influenced by factors such as substrate formulation and manufacturing processes. According to international standards and
PCB panelization design serves as the pivotal link between R&D and production. High-quality FR4 pcb panels can enhance SMT placement efficiency by over 30% while reducing defect rates; conversely, poorly designed panels impede mass production and inflate costs. Design considerations must balance universal specifications with the material properties and manufacturing characteristics of FR4. The essence
The choice of FR4 PCB color is often bound by ingrained assumptions: green is seen as the “king of cost performance,” black carries an aura of “high-end, high performance,” while red and blue are regarded as signatures of industrial equipment. In PCB selection discussions, this seems almost axiomatic. Yet few people stop to ask whether
As the most widely used substrate material, the glass fibre epoxy structure of FR4 PCBs inherently predisposes their surface copper layers to oxidation and poor solderability. The three mainstream surface finishing processes—HASL, ENIG, and OSP—function like distinct protective armour for FR4 PCBs, each tailored to different application scenarios and performance requirements. Selecting the appropriate process
The Position and Value of AlN Aluminium Nitride in Advanced Electronics Manufacturing As electronic products continue to evolve towards higher power, higher frequency, and higher integration, traditional substrate materials are gradually revealing their bottlenecks in terms of heat dissipation and reliability. Against this backdrop, AlN aluminum nitride, as a high-performance ceramic material, is beginning to
LTCC (Low-Temperature Co-fired Ceramic) technology, a multilayer circuit technique originating in the 1980s, holds a pivotal position in high-density and high-frequency electronics. This process commences with the use of green ceramic powder, meticulously formed into green ceramic tape via a casting process. Subsequently, each layer undergoes sequential punching operations, precise filling of through-hole metal pastes,
In high-end electronic fields such as high-frequency communications and precision sensing, the dimensional accuracy of LTCC (Low-Temperature Co-fired Ceramic) directly defines the upper limit of device performance. Even micron-level deviations can lead to circuit interconnection failure or signal transmission distortion. Pushing LTCC dimensional tolerances to the extreme is no longer a matter of isolated process
Reflow soldering of ceramic circuit boards constitutes a critical process in achieving component encapsulation, wherein the precision of temperature curve control serves as the very lifeline determining soldering quality. Ceramic materials inherently possess high hardness yet significant brittleness, coupled with a thermal expansion coefficient markedly different from metallic solders. Should the temperature curve be improperly
Ceramic PCBs, with their superior thermal conductivity, high-temperature resistance and insulation properties, have become the core substrate for high-end electronic equipment. The quality of the routing process directly determines their performance and service life. Even with identical ceramic substrates and identical component configurations, improper routing can lead to signal crosstalk, impeded heat dissipation, mechanical stress
As electronic devices accelerate toward miniaturization, higher power, and higher operating frequencies, unprecedentedly stringent requirements are being placed on circuit board precision, thermal performance, and reliability. Ceramic circuit boards, benefiting from their inherent material advantages, have become a core choice for high-end applications. Among the various manufacturing approaches, the DPC (Direct Plated Copper) process has
As electronic equipment continues to demand higher power density and greater operational stability, ceramic circuit boards have seen increasing adoption in high-end manufacturing sectors due to their excellent thermal conductivity, high dielectric strength, and superior resistance to high temperatures. Compared with conventional FR-4 PCBs, ceramic circuit boards are generally much more expensive. This price gap
As radio-frequency communications, millimetre-wave radar, high-speed interconnects and power modules advance towards higher frequencies, the transmission characteristics of signals within printed circuit boards undergo fundamental changes. Under high-frequency conditions, energy dissipation ceases to be governed by a single dominant factor, instead being determined by the combined effects of material polarisation behaviour, conductor current distribution and
In the manufacturing process of multilayer ceramic pcb, lamination is not merely a straightforward step of ‘stacking and applying pressure’. As the number of layers increases, circuit density rises, and substrate dimensions expand, the differing responses of each layer’s materials under stress and thermal conditions become progressively amplified. Minor displacements that might be negligible in
In the wave of nanotechnology, two-dimensional materials have become a focus in the field of materials science due to their atomic scale thickness and unique physical properties. Among them, High-k 2D materials are gradually becoming a key force driving the innovation of electronic devices due to their excellent electrical properties and broad application prospects. Compared
With the continuous increase in power density and operating frequency of electronic systems, traditional organic PCB materials are gradually reaching their performance limits. Ceramic PCBs, characterized by high thermal conductivity, excellent dimensional stability, and superior dielectric performance, have become an important solution for high-power, high-frequency, and high-reliability applications. However, compared with conventional FR-4 PCBs, ceramic
With the continuous advancement of power electronics and high-reliability electronic systems, ceramic PCBs have gained widespread application in power modules, automotive electronics, and industrial control domains due to their superior thermal conductivity, electrical stability, and environmental adaptability. However, compared to conventional FR-4 PCBs, ceramic PCBs present distinct technical constraints in routing design. Persisting with organic
As the power density of electronic systems continues to increase, thermal management has become one of the core factors constraining product performance and reliability. Within traditional FR-4 PCB architectures, the substrate’s inherently limited thermal conductivity makes it difficult to dissipate heat generated by components promptly and efficiently. Consequently, systems often rely on external heat sinks,
Engineering Significance and Application Background of Impedance Control PCBs In high-speed electronic systems, signal transmission is no longer simply a matter of “connection is sufficient.” As signal frequencies increase and rise times become steeper, PCB traces themselves have evolved from simple conductors into transmission structures with defined electrical characteristics. It is against this backdrop that
In high-power, high-reliability electronic products, solder joint cracking remains one of the key failure modes affecting system longevity and stability. Particularly in power modules, automotive electronics, industrial control, and aerospace applications, solder joints endure prolonged thermal cycling, mechanical stress, and current surges. Compared to conventional organic substrates like FR-4, ceramic substrates demonstrate significant advantages in
