PCB layer means copper layer, PCB is made of copper layer + substrate compression and become, in addition to a single panel is a layer of copper, double-sided above the board are even number of layers. Components are soldered on the outermost layer, the other layers play a role in wire connection, but now there […]
Keyboard as an important bridge of human-computer interaction, the stability and reliability of its performance is crucial. As the “heart” of the keyboard, the design and maintenance of the keyboard PCB is directly related to the overall performance of the keyboard. How to design a keyboard pcbKeyboard pcb design process covers the entire process from
Low-temperature co-fired ceramic (LTCC) technology is an eye-catching integrated component technology developed in recent years. It represents the development direction of miniaturization, high frequency and integration of electronic components. It has now become the mainstream implementation solution for passive integration. LTCC material requirements: The material performance requirements of LTCC devices include three aspects: electrical performance,
Hard gold plating is an electroplating process for plating a layer of hard gold (Gold) on a metal surface, whose main components are pure gold and other alloying elements. PCB hard gold plating technology is mainly through the electrochemical method, in the PCB board surface deposition of a layer of high purity metal gold. In
Flexible substrates composed entirely of flexible materials rather than having a rigid part with a polyimide core surrounded by copper and prepreg. In order to enhance your understanding of flexible PCB, this article will introduce the common types of substrate materials for flexible PCB. If you are interested in flexible PCB, you may wish to
Rogers 5880 sheet is a polytetrafluoroethylene (PTFE)-based material with a dielectric constant of 2.2 and is available in thicknesses ranging from 0.003 inches to 0.240 inches. The sheets are available in copper foil thicknesses of 0.5oz, 1oz, 2oz, and 3oz, with finishes of chemical gold plating, chemical silver plating, and chemical tin plating. The panels
What is fpga?FPGA is also a chip in essence, is a digital circuit-based integrated chip, is in the PAL (Programmable Array Logic), GAL (Generalized Array Logic) and other programmable devices on the basis of further development of the product. It is as a special integrated circuit (ASIC) in the field of a semi-customized circuits and
Dip soldering is a welding method, mainly used in the plug-in process and SMT red rubber surface, it will be pre-inserted components of the printed circuit board immersed in the molten state of the solder, so as to complete the circuit board on all the soldering points of the welding. The method is mainly used
Rogers pcb substrate, using the proprietary amide resin material developed by Rogers, this material gives it excellent dielectric properties, thermal stability and mechanical strength. Even under extreme working environments such as high temperature and high humidity, high frequency and high speed, Rogers PCB boards are able to maintain stable operation, demonstrating their strong adaptability and
RF circuit board design is an important branch in the field of electrical engineering, which focuses on the design, optimization, and implementation of circuits and systems used to process Radio Frequency (RF) signals. RF signals usually refer to electromagnetic signals with frequencies between several thousand hertz and several hundred gigahertz, and are widely used in
The principle of multilayer PCB design is to lay out different circuit components according to their functions and locations, and then connect them through wires. During the design process, various factors need to be considered, such as the selection of parameters for components such as resistors, capacitors, inductors, etc., the routing of signal wires, and
Understanding the classification and processes of PCB manufacturing processes and mastering basic PCB manufacturing process capabilities are the foundation for PCB manufacturability design. Classification of printed circuit boards Printed circuit board according to the production material can be divided into rigid printed circuit board and flexible printed circuit board. Rigid printed circuit boards are phenolic
The drilled hole tolerance of a pcb board is the tolerance between the diameter of the holes or slots drilled or milled during the PCB manufacturing process and the design requirements. This tolerance requirement is to ensure that the components on the board are installed correctly and can be well connected. Generally, the hole diameter
Flip chip packaging technology, also known as FC packaging technology, is an advanced integrated circuit packaging technology. In traditional packaging technology, the chip is encapsulated at the bottom and connected to the package substrate through gold wires. Flip chip technology, on the other hand, flips and mounts the chip directly onto the package substrate, and
Electrostatic spray coat is the use of high-voltage electrostatic field to make negatively charged paint particles along the electric field in the opposite direction of the directional movement, and will be adsorbed on the surface of the workpiece paint particles of a spraying method. Electrostatic spray equipment consists of spray gun spray cup and electrostatic
Thermal board,as a kind of thermal isolation material, its main function is to block the transfer of heat and ensure the effective isolation of heat energy. In the fields of construction, pipe insulation and air-conditioning pipe insulation, thermal insulation board plays a vital role in significantly reducing heat loss and thus improving the utilization of
Flex PCBA refers to printed circuit boards and their assembly technology made of flexible materials. This kind of circuit board is characterized by high wiring density, light weight and thin skin, and is constructed very reliably on the basis of flex, capable of bending, twisting and folding. It is suitable for special shapes and can
Electrical Contact Pad is a conductive area on a PCB (Printed Circuit Board) used to connect electronic component pins or wires. The pad is usually made of copper and is plated (such as tin or gold) to enhance its conductivity and corrosion resistance. The quality and design of electrical contact pads are critical to PCB
PCB, the Chinese name for the printed circuit board, also known as printed circuit boards, is an important electronic component, is the support body of electronic components, is the carrier of the electrical connection of electronic components. Because it is made using electronic printing technology, it is called printed circuit board. Source PCBs, the interconnection
What is fct? It refers to a test method that provides a simulated operating environment (excitation and load) for a test target board (UUT: Unit Under Test) to operate in a variety of design states, so as to obtain the parameters of each state to verify the functionality of the UUT. Simply put, the UUT
In the world of electronics, the circuit board is the bridge between the various electronic components and the basis for realizing the function of the circuit. For electronics hobbyists, innovators or professionals, designing and make your own pcb board is a fun and challenging task. Defining the design requirementsBefore you start designing a circuit board,
PCB is the abbreviation of Printed Circuit Board. Also known as printed circuit board or printed circuit board. it is called a “printed” circuit board because it is made using electronic printing. A printed circuit board is a substrate used for assembling electronic components. 1. Printed circuit board (PCB) It is a printed board that
In the field of electronic design, PCB layout is a crucial part. For beginners, how to quickly and accurately complete the PCB board layout is a major challenge. Fortunately, there are many free PCB layout program on the market, these tools are not only powerful, but also easy to get started, for electronic design beginners
Wave soldering refers to the molten brazing material, by electric pump or electromagnetic pump jet into the design requirements of the solder crest, can also be formed by injecting nitrogen into the solder pool, so that the pre-loaded components of the printed circuit board through the solder crest, in the brazing material surface to form
