Rogers RT duroid high-frequency circuit materials are composite laminates of PTFE (with random fillers of glass or ceramic), suitable for high-reliability applications such as aerospace. For many years, the RT/duroid series has been recognised within the industry as a high-reliability material offering exceptional performance.
Advantages
The RT/duroid material series offers significant advantages including ultra-low loss, low moisture absorption, stable dielectric constant (Dk) across frequency variations, and low outgassing, making it particularly suitable for aerospace applications.
RT/duroid Series High-Frequency Laminate Models
RT/duroid 5870 Laminate
Rogers RT duroid 5870 high-frequency laminate is a micro-glass-fibre reinforced PTFE composite material. This laminate is renowned for its low dielectric constant (Dk) and exceptional high-frequency performance. Randomly distributed micro glass fibres within the material ensure high dielectric constant uniformity. Its low Dk and low loss characteristics make it highly suitable for high-frequency and broadband applications requiring dispersion and loss to be controlled at extremely low levels.
Characteristics:
Dielectric constant (Dk): Measured at 10GHz as 2.33 ± 0.02.
Dissipation factor (Df): Measured at 10GHz as 0.0012.
Moisture absorption: Low.
Isotropy: Exhibits isotropic properties.
Density: Typical value of 2.2 gm/cm³.
Advantages:
Electrical Loss: Extremely low electrical loss, ranking among the lowest levels for reinforced PTFE materials.
Processability: Easily cut, trimmed, and formed.
Chemical Resistance: Excellent tolerance to hot and cold solvents or reagents used in etching or plating processes for edges and vias.
Humidity Environments: Highly suitable for use in high-humidity conditions.
Stability: Maintains stable electrical properties across a broad frequency range.
RT/duroid 5880 Laminate
Rogers RT duroid 5880 high-frequency laminate is likewise a micro-glass-fibre reinforced PTFE composite. Its low dielectric constant (Dk) and low loss characteristics make it highly suitable for high-frequency and broadband applications. Randomly oriented micro-glass fibre reinforcement provides this PTFE composite with excellent Dk consistency.
Characteristics:
Dielectric constant (Dk): 2.20 ± 0.02 measured at 10 GHz.
Dissipation factor (Df): 0.0009 measured at 10 GHz.
Moisture absorption: Low.
Isotropy: Exhibits isotropic properties.
Density: Typically 2.2 gm/cm³.
Advantages:
Electrical Properties: Maintains stable electrical characteristics across a broad frequency range.
Processability: Easily cut, trimmed and formed.
Chemical Resistance: Exhibits good tolerance to solutions and reagents used in etching or plating edges and vias.
Humid Environments: Highly suitable for use in high-humidity conditions.
Electrical Loss: Extremely low dielectric loss of 0.0009 at 10GHz.
RT/duroid 5880LZ Laminate
Rogers RT duroid 5880LZ high-frequency laminate is a PTFE composite material incorporating fillers, specifically engineered for precise stripline and microstrip circuit applications. Through the addition of unique fillers, this laminate achieves a low-density, lightweight composition, making it suitable for performance-critical scenarios where circuit weight is a significant consideration, such as aerospace systems.
Characteristics:
Dielectric Constant (Dk): 2.0 ± 0.04.
Dissipation Factor (Df): 0.0021 – 0.0027 at 10GHz.
Thermal Expansion Coefficient (Z-axis): 40 ppm/°C.
Density: Low, 1.4 gm/cm³.
Advantages:
Lightweight/Low Density: Unique fillers render it a low-density, lightweight material.
Electrical Stability: Maintains consistent electrical properties across a broad frequency range.
Chemical Resistance: Exhibits excellent tolerance to common hot and cold solutions and reagents used in etching or plating processes.
RT/duroid 6002 Laminate
Rogers RT duroid 6002 high-frequency board microwave material is a low-loss material offering exceptional high-frequency performance. Its outstanding mechanical and electrical properties make it suitable for complex microwave structures, including intricate multilayer board configurations.
Characteristics:
Dielectric Constant (Dk): 2.94 ± 0.04, typical value at 10GHz is 2.94.
Thermal Coefficient of Dielectric Constant (TCDk): Typical value of 12 ppm/°C between -50°C and 150°C.
Dissipation Factor (Df): Measured value at 10GHz is 0.0012.
Z-axis thermal expansion coefficient: Typical value of 24 ppm/°C.
Advantages:
Low loss: Exhibits low loss characteristics.
High-frequency performance: Delivers exceptional high-frequency performance.
Dimensional stability: In-plane expansion coefficient is similar to copper.
Outgassing rate: Low outgassing rate.
Complex structures: Suitable for complex multilayer board structures.
RT/duroid 6006 and 6010.2LM Laminates
Rogers RT duroid 6006 and 6010.2LM laminates are ceramic-filled PTFE composites engineered for RF/microwave circuit applications requiring high dielectric constant. Their elevated dielectric constant (Dk) facilitates circuit miniaturisation. Both materials exhibit low loss characteristics, making them highly suitable for operation at frequencies below the X-band. Furthermore, stringent dielectric constant and thickness control facilitate repeatable circuit performance.
Characteristics:
RT/duroid 6006 laminate:
Dielectric constant (Dk): 6.15 ± 0.15.
Loss factor (Df): 0.0027 at 10GHz.
RT/duroid 6010.2LM laminate:
Dielectric constant (Dk): 10.2 ± 0.25.
Dissipation factor (Df): 0.0023 at 10GHz.
Copper Foil: Standard electrolytic copper and reverse copper available.
Advantages:
High Dielectric Constant: Facilitates miniaturisation of circuit dimensions.
Low Loss: Exceptionally well-suited for operation below the X-band.
Performance Repeatability: Rigorous dielectric constant and thickness control ensures consistent circuit performance.
Low Moisture Absorption: Exhibits minimal moisture uptake.
High reliability: Suitable for multilayer boards and high-reliability plated-through holes.
Thermal conductivity: Approximately 2.4 times that of standard RT/duroid 6000 products.
RT/duroid 6035HTC Laminate
Rogers RT duroid 6035HTC high-frequency circuit material is a ceramic-filled PTFE composite engineered for high-power RF and microwave applications. With thermal conductivity approximately 2.4 times that of standard RT/duroid 6000 series products and exceptional long-term thermal stability for copper foil (electrolytic copper and reverse copper), this laminate is ideal for high-power RF applications. Rogers’ advanced filler system confers outstanding drilling characteristics, significantly reducing drilling costs compared to standard high-thermal-conductivity materials using hard alumina fillers.
Characteristics:
Dielectric Constant (Dk): 3.50 ± 0.05.
Dissipation Factor (Df): 0.0013 at 10GHz.
Thermal Conductivity: 1.44 W/m/K at 80°C.
Copper Foil: Features low-roughness, reverse-processed copper foil with outstanding thermal stability.
Advantages:
High Thermal Conductivity: Enhanced dielectric thermal conductivity significantly reduces operating temperatures in high-power applications.
High-Frequency Performance: Delivers exceptional high-frequency performance.
Insertion Loss: Exhibits low insertion loss.
Thermal Stability: Circuits exhibit outstanding thermal stability.
Drilling Costs: Drill tool life is substantially extended compared to materials containing alumina fillers, reducing drilling expenses.
RT/duroid 6202 Laminate
Rogers RT duroid 6202 high-frequency circuit material is a low-loss, low-dielectric constant glass-fibre reinforced laminate. This material delivers outstanding electrical and mechanical properties to meet the demands of complex microwave structure designs requiring high mechanical reliability and electrical stability. Limited glass fibre reinforcement achieves exceptional dimensional stability (0.05 to 0.07 mils/inch), typically eliminating the need for double etching and enabling tight positional tolerances.
Characteristics:
Dielectric constant (Dk): 2.94 ± 0.04 to 3.06 ± 0.04, depending on thickness.
Loss factor (Df): 0.0015 at 10GHz.
Thermal Coefficient of Dielectric (TCDk): 5 ppm/°C.
Thickness: Strictly controlled thickness.
Advantages:
Low Loss: Exhibits low loss characteristics.
High-Frequency Performance: Delivers outstanding high-frequency performance.
Coefficient of Expansion: In-plane coefficient of expansion is similar to copper.
Electrical and Mechanical Properties: Possesses excellent electrical and mechanical properties.
Etch Shrinkage: Extremely low etch shrinkage.
RT/duroid 6202PR Laminate
Rogers RT duroid 6202PR high-frequency circuit material is a low-loss, low-dielectric constant laminate suitable for planar resistor applications. This material delivers outstanding electrical and mechanical properties, meeting the demands of complex microwave structure designs requiring high mechanical reliability and electrical stability. Limited glass fibre reinforcement achieves outstanding dimensional stability (0.05 to 0.07 mils/inch), enabling the design of planar resistors with stringent tolerances. The unique properties of RT/duroid 6202PR material are particularly suited for applications involving planar and non-planar structures, such as antennas and multilayer circuits with complex inner layer interconnections.
Characteristics:
Dielectric constant (Dk): 2.94 ± 0.04 to 2.98 ± 0.04, depending on thickness.
Dissipation factor (Df): 0.002 at 10GHz.
Thermal Coefficient of Dielectric (TCDk): 13 ppm/°C.
Advantages:
Dimensional Stability: Exhibits outstanding dimensional stability.
Expansion Coefficient: In-plane expansion coefficient is comparable to copper, ensuring reliable assembly.
High-Frequency Performance: Delivers exceptional high-frequency performance.
Temperature Sensitivity: Highly suitable for applications sensitive to temperature variations.
The Rogers RT duroid family of high-frequency circuit materials offers extensive diversity. Each variant, with its unique advantages and characteristics, precisely matches diverse high-frequency application scenarios. From aerospace to high-power RF, and complex microwave structures, it continues to provide robust support and powerful momentum for the high-frequency advancement of the electronics industry.
