Electronic manufacturer

Chip packaging technology constitutes a critical component within the semiconductor industry, directly influencing the performance, reliability, and lifespan of electronic devices. In recent years, as electronic products have evolved towards miniaturisation and enhanced performance, traditional packaging materials have progressively revealed their limitations. Against this backdrop, glass substrates, owing to their unique physicochemical advantages, are increasingly […]

TGV (Through Glass Via) technology evolved from 2.5D/3D integrated TSV interposer technology. Since its inception in 2008, it has focused on overcoming the dielectric loss bottleneck in high-frequency, high-speed signal transmission inherent to traditional silicon substrates, while addressing industry pain points such as the high cost and complex manufacturing processes associated with silicon materials. This

Cold solder joints refer to instances during the soldering process where an inadequate metallic bond forms between the solder and the workpiece. While appearing connected, such joints exhibit poor contact, severely compromising the performance and reliability of electronic products and potentially causing product failure. Accurate detection and effective remediation of cold solder joints are crucial

Microwave radio frequency technology refers to techniques utilising radio waves within the frequency range of 300MHz to 300GHz for information transmission, processing, or application. Radio frequency (RF) typically denotes electromagnetic waves across a broad spectrum, while microwaves constitute the higher-frequency, shorter-wavelength segment within this range. Owing to characteristics such as high frequency, rapid transmission, substantial

Microwave RF PCB refers to microwave components manufactured using conventional rigid PCB fabrication methods on specific microwave-grade copper-clad laminates. In printed circuit board wiring for high-speed signal transmission lines, products can currently be categorised into two main types: one category comprises electronic products for high-frequency signal transmission. These products relate to radio electromagnetic waves and

4D millimeter-wave radar represents an upgrade from conventional millimetre-wave radar, with “4D” denoting four dimensions: velocity, distance, horizontal angle, and vertical height. Compared to conventional 3D millimeter-wave radar, 4D millimetre-wave radar incorporates the detection of ‘height’, integrating this fourth dimension into traditional systems. This enables 4D millimeter-wave radar to: 1) Acquire information across richer dimensions,

The significance of high-frequency PCB materials in 77 GHz automotive radar applications. Within the high-frequency spectrum, although numerous novel PCB materials have been developed, not all are suitable for such elevated frequencies. At millimetre-wave frequencies, which PCB material characteristics prove most critical? Understanding these properties facilitates the simplification of millimetre-wave applications, particularly concerning the selection

Flexible printed circuit boards (FPCs), serving as core components for interconnecting electronic devices, have their layer count design directly impacting product performance, cost, and application scenarios. Based on the number of conductive layers, FPCs can be categorised into single-layer, double-layer, and multi-layer (three layers and above) structures. Flexible pcb with different layer counts exhibit significant

Flexible LED strip lights, also known as flexible ribbon lights, utilise FPC as the substrate circuit board and are assembled with surface-mount LEDs, resulting in a product thickness of merely 0.1cm that occupies minimal space. Common specifications include 30 LEDs per metre, 60 LEDs per metre, 120 LEDs per metre, 144 LEDs per metre, and

Multilayer flex pcb is formed by laminating three or more layers of single-sided or double-sided flexible circuit boards together. Through-holes are created via drilling and plating, establishing conductive pathways between different layers. This eliminates the need for complex soldering processes. Whilst the number of conductive layers in such flexible designs can be virtually unlimited, layout

Photoresist, also known as photo-resistive material, refers to an etch-resistant thin-film material whose solubility changes upon exposure to ultraviolet light, electron beams, ion beams, X-rays, or other forms of radiation. Photoresist comprises photosensitive resin, photoinitiators, solvents and additives: photoinitiators, also known as photopolymerisation materials (primarily including UV coatings, UV inks, UV adhesives, etc.), are materials

PCB jumper refers to spaces reserved on a printed circuit board for connecting circuits, achieved by adding conductive wires and connectors. They serve a broad purpose in circuit design, effectively resolving layout and routing challenges. Jumpers serve as ‘circuit shortcuts’ in PCB design, achieved through thickened conductors or special connection methods, specifically addressing the following

The surface treatment process of PCB circuit boards is crucial to their performance and environmental credentials. Among these, the tin-plating process is widely favoured for its cost-effectiveness and solderability. Tin-plating can be categorised into leaded and lead-free variants based on lead content, exhibiting significant differences in composition, soldering characteristics, environmental requirements, and application scenarios. What

What are leaded and leadfree processes? Leaded solder typically consists primarily of tin-lead (Sn-Pb) alloys, such as the classic Sn63/Pb37 (63% tin, 37% lead), which has a low melting point (approximately 183°C), stable soldering properties, and a mature process. Lead-free solder, conversely, primarily utilises alloys such as tin-silver-copper (e.g., SAC305) or tin-copper (Sn-Cu), which are

The encapsulation process, also known as the packaging process, involves the secure enclosure of semiconductor chips using specific materials. This provides effective defence against environmental degradation, ensuring stable chip operation. Beyond delivering crucial physical protection, the process is designed from the outset to fully account for the inherent characteristics of chips – namely their lightweight,

As electronic products demand increasingly diverse functionalities, pcb board structures have grown ever more complex. Constrained by spatial limitations, PCB circuit boards have progressively “evolved” from single-layer to double-layer and ultimately multi-layer designs. What, then, distinguishes the manufacturing processes of multi-layer PCB boards from those of double-layer PCBs? A multilayer pcb board is a type

Ionic cleanliness testing serves as a critical quality control measure for evaluating ionic contaminant levels on pcb boards surfaces. Its primary objective is to prevent electrical faults such as short circuits and corrosion caused by ionic residues, thereby enhancing the reliability of electronic products. Employing techniques such as chemical extraction and conductivity measurement, this test

FR1 pcb is constructed from glass fiber-reinforced epoxy resin laminates. FR1 PCBs are rigid, flat materials composed of thin copper layers on a non-conductive phenolic resin substrate. FR1, fully known as Flame Retardant 1, is a PC film with high insulation and flame-retardant properties. This material not only exhibits excellent flame resistance but also possesses

In electronic manufacturing, circuit boards must be divided into distinct sections to meet the design requirements of various electronic products. Traditional mechanical cutting and punching techniques struggle to satisfy modern production standards. The advent of PCB laser depaneling machines has made this process efficient and precise, not only boosting production efficiency but also ensuring the

OSP (Organic Solderability Preservative) is a surface treatment process for PCBs (Printed Circuit Boards). It involves coating the copper foil surface with an extremely thin organic protective film (approximately 0.2-0.5μm thick) to prevent copper oxidation and maintain solderability. During soldering, high temperatures cause the protective film to decompose, exposing the copper surface to bond with