With the rapid development of the electronics industry, the demand for printed circuit boards is also growing. In this efficient and precise market environment, “fast-turn printed circuit boards” has become a manufacturing model that has attracted much attention. This article will conduct an in-depth analysis of quick turn printed circuit boards from the aspects of […]
In the field of modern electronic manufacturing, with the widespread application of high-density, multi-layer PCBs, solder plugging technology has become one of the important processes to improve the performance and reliability of circuit boards. This technology has attracted much attention because it can effectively avoid potential problems in the manufacturing and use of circuit boards.
One day in the future, self-driving vehicles may be safer than the motor vehicles driven by drivers today. But before drivers start to let go of the steering wheel, some electronic functional components must become standard in commercial vehicles, including millimeter-wave radar systems, cameras and automotive radar antennas. Radar seems to be more easily associated
Copper oxydation pcb no solder mask is a special type of printed circuit board that protects the copper conductors by forming a stable copper oxide film instead of a solder mask. This oxide layer not only enhances the corrosion resistance of the pads, but also improves solder wetting, ensuring that the solder material adheres better
What is tin plating?Tin plating is the application of a layer of tin to a copper foil. In the circuit board manufacturing process, the surface of the copper foil is immersed in a solution containing tin salts,and a uniform layer of tin grows on the surface of the copper foil through an electrolytic reaction. Tin
In PCB (Printed Circuit Board) manufacturing, an ounce (OZ) is essentially a unit of weight, which converts to grams (g) roughly as follows: 1 OZ equals approximately 28.35 g. The term 1 OZ refers specifically to the thickness of 1 OZ of copper uniformly covered over an area of 1 square foot (FT2). The term
Solder flux residue is generally defined as the residual material left on the surface of a circuit board or other workpiece during a soldering operation or electronics manufacturing process due to the use of soldering materials (e.g., solder or solders), through-hole soldering, and by-products generated during the soldering process. These residual components may include solder
Can I cut PCB with scissors? Why do I need to cut PCBs?Cutting PCBs is an important process for customizing and optimizing electronic projects. There are several reasons for cutting PCBs.Personalizing Boards from Panel ArraysWhen you work with PCBs, you often come across PCB panelization, where multiple smaller boards are mass-produced and connected together to
What is industry standard PCB thickness?The standard PCB thickness for 2 layers is 1.6mm.Depending on the specific requirements of the design, measurements other than the standard measurements are used in the PCB design. Typically PCB thicknesses range from 0.2mm to 3.2mm. 0.2mm PCB standard thickness is used for thin and flexible PCBs, but on the
With the rapid development of electronic technology, more and more industries have continuously increased their requirements for product quality, especially in the production process of electronic products. How to test efficiently and accurately has become a major challenge for technicians. In order to meet this demand, custom test fixtures have gradually become one of the
A normal keyboard PCB, also known as a printed circuit board (PCB), is an essential component of the keyboard’s internal structure. It plays the role of receiving the user’s instructions and converting them into electronic signals that are recognized by the computer. When the user touches any key on the keyboard, the corresponding switch is
Flying probe testing is a method of testing electronic circuits, primarily for testing printed circuit boards (PCBs). It utilizes a system of movable probes that actually “fly” across the board, making electrical contact with specific test points on the PCB. Ultimately, it identifies defects and verifies the electrical performance of the circuit. A flying probe
Solder mask is a key technology in the manufacture of PCBs (Printed Circuit Boards), designed to protect the metal components of the board from oxidation and to avoid the formation of conductive bridges between the pads. Soldermask is particularly important in processes such as reflow or wave soldering, where it is difficult to precisely control
Generally speaking, when designing ordinary single-sided and double-sided boards, there is no need to consider the pcb board stack up problem. Usually, copper clad boards with copper thickness and board thickness that meet the design requirements are directly selected for direct processing. However, when designing PCBs with more than 4 layers, the stacking design directly
Glass pcb and their derivatives, glass through hole (TGV) carrier board,has become indispensable core components for various high-tech electronic products. They are not only widely used in liquid crystal display (LCD),organic light-emitting diodes (OLED) and other display technologies,but also play an important role in semiconductor packaging, integrated circuit interconnections and other aspects. Mainstream manufacturing techniques
A countersunk hole is a semi-penetrating hole in a circuit board made with a flat head drill or gong cutter, characterised by the fact that the hole does not run through the entire circuit board. Between the outer edge of the hole (i.e., the location of the largest hole diameter) and the wall of the
PCBA (Printed Circuit Board Assembly) integrated circuit lead forming process is an important technology in modern electronics manufacturing, which involves adapting the pins of integrated circuits to the specific shape and requirements of the board. This process plays a key role in ensuring pin soldering and product performance, which not only affects production efficiency, but
Semiconductor IC design (Integrated Circuit Design) refers to the design process of integrating multiple devices and functional modules on a wafer and connecting and interconnecting them efficiently based on semiconductor processes and in accordance with certain circuit design rules and principles. Typically, semiconductor IC design involves a number of sub-fields,including digital circuit logic design.Analogue circuit
Hot bar soldering is the use of heat and pressure to press-weld a wire to a metal weld area. Hot bar soldering is an umbrella term that covers a wide range of soldering methods such as pneumatic, calcined and roll welding. Depending on the method of heating, hot bar soldering can be divided into three
Parasitic inductance is an inductance that is not intended to be introduced by the design,but occurs naturally as an additive effect on certain objects.In short, it is always present wherever a wire is located,but its magnitude varies depending on the characteristics of the wire.For example,straight wires usually produce less parasitic inductance than coiled wires.In the
The outlook for the global chip contract industry will remain stable by 2024. TSMC ranks first with a market share of about 60%, followed by Samsung, Taiwan’s UMC, the United States’ GlobalFoundries, China’s SMIC IC, and Huahong. The list has not changed for many years. Among them, the highest ranking in mainland China is SMIC,
In modern materials science, pre-impregnated glass fiber, as an important composite material, is widely applied in various fields. Whether in aerospace, the automotive industry, or electronic products, glass fiber materials play an irreplaceable role. Among them, pre-impregnated glass fiber, due to its excellent performance and flexible applications, has become a key direction in current composite
Printed Circuit Board (PCB) is an indispensable component of electronic equipment, which is made of insulating material in accordance with a predetermined design of conductive graphics, including printed circuit, printed components or a combination of both. This insulating substrate to provide electrical connections between the components of the conductive pattern, that is, known as the
PCB card edge connector/contact is an electronic component whose function is to connect and stabilise various components on a circuit board, especially important in those highly integrated and component-dense electronic devices. It is generally assembled on the edge of the circuit board, with the help of snap-fastening or soldering technology and another circuit board or
