DIP package assembly, also known as Dual In-line Package (DIP), is an assembly method that requires the pins of an electronic component to be inserted into a through-hole of a printed circuit board (PCB), and then secured using soldering techniques such as wave soldering. The DIP package process is particularly suitable for larger electronic components […]
A phone circuit board is a key component used for the connection and assembly of circuits inside a mobile phone. It is usually a thin board made of insulating material covered with a conductive layer that is used to connect and support the various electronic components inside a mobile phone, such as processors, memory, sensors,
The use of teflon pcb laminate has increased dramatically recently. There are many reasons for this change. One of the reasons is the rapid development of the electronics industry and the increasing demand for high-frequency boards.What is teflon pcb laminateTeflon is a chemical substance that can be simply called polytetrafluoroethylene or PTFE. It is widely
PCB backdrill, also known as controlled depth drilling, is simply the process of drilling a hole from the back side of an already manufactured multilayer circuit board. However, this is not just playing, but to accurately trim some of the through-holes (we also call it PTH holes, that is, plated through-holes) in those unwanted ‘little
In the mass production of printed circuit boards (PCBs), manufacturers often combine multiple individual boards into one large board, a process known as boardmixing, where multiple small boards are combined into one large board. The aim is to feed these boards more efficiently into the automated machines of the SMT (surface mount technology) production line,
A pcb microscope is a microscope specifically designed to observe printed circuit boards (pcbs). In the modern electronics industry, pcb microscopes play a key role in helping engineers and technicians inspect and analyze tiny and delicate circuit structures in electronic devices. As a pcb manufacturer, efficient and reliable pcb quality control (QC), rework, failure analysis,
Hot plate for pcb soldering is an advanced soldering technique that is primarily used to securely attach electronic components to printed circuit boards (PCBs). This method utilises the heating function of the hot plate to provide uniform temperature control, thus ensuring an efficient and stable soldering process. The hot plate for pcb soldering process achieves
Parasitic resistances are resistances that are not intentionally designed into a circuit, but are created due to circuit layout or component characteristics, for example. They are usually unavoidable and affect the performance and stability of the circuit. Parasitic resistors have the following characteristics: Parasitic resistors are often considered the ‘enemy’ of circuit design due to
In the field of modern electronic manufacturing, the welding process is an important step to realize the functions of electronic equipment. In the welding process, soldering pins, as one of the core tools, undertake multiple functions such as connection, testing, and signal transmission. In the welding process, soldering pins, as one of the core tools,
HDI technology is a cutting-edge PCB (Printed Circuit Board) manufacturing process that offers the significant benefits of high-density layout, high reliability and high integration, with the PCB serving as the cornerstone of electronic component interconnectivity, carrying and solidly connecting all types of electronic assemblies. Through the application of high-density integration HDI technology, can promote the
Allflex PCB, also known as Flexible Printed Circuit Board (FPC), is a type of circuit board that can be completely bent. Folded or curled circuit board. It consists of one or more layers of polyimide film as a substrate, covered with a copper foil layer and a cover film, and the circuit pattern is formed
What is the bend radius of a flexible circuit board? The bending radius of a Flexible Printed Circuit Board (FPC) refers to the fact that when the FPC is bent, the two sides of its centre line are subjected to different types of stress, pressure on the inside and tension on the outside. The magnitude
The stacked construction technique of HDI circuit boards allows multiple circuit layers to be interconnected by means of precisely tuned blind and buried vias, which are significantly smaller in diameter than the through-holes found in conventional PCBs. This fine interconnect mechanism not only reduces board size, but also significantly increases routing density, allowing more electronic
ELIC PCB is one of the HDI products, the full name is every layer interconnection, is the highest end of the HDI products. ELIC boards are commonly stacked for 8 to 14 layers. Any layer interconnection (ALIVH) technology, as the name suggests, is a multi-layer printed circuit board (PCB) can be achieved in any two
Circuit board labels are the PCB (Printed Circuit Board, Printed Circuit Board) technology based on the manufacture of high-frequency RFID tags. PCB tags can be divided into a variety of types according to power, size, frequency and other factors, according to the frequency distinction between ultra-high-frequency PCB anti-metal tags, high-frequency PCB anti-metal tags and so
Common pcb panel sizes (which can be considered industry standards) include: 24” x 18”, 12” x 18”, and 24” x 9”. Note that these panels have 0.5” margins on all sides and 0.1” space between the individual boards that make them up. It is also worth noting that the 24 x 18” panel is the
When designing a printed circuit board (PCB), following basic pcb layout rules is essential to ensure the functionality and performance of the circuit. The basic rules of PCB layout:1.According to the layout strategy of ‘major priority, complexity first’, i.e., the key unit circuits and core components should be arranged first.2.In the layout process, should refer
PCB side plating, also known as pcb edge plating, is a copper plating that is applied from the top to the bottom surface of the board and along (at least) one of the peripheral edges. PCB edge plating is the process of allowing a metallised layer to extend up to the edge of the board
In the production process of electronic products, circuit card assembly testing is a crucial step, which is directly related to the performance and reliability of the product. Circuit card, as a carrier connecting various electronic components, the quality of its assembly directly affects the function of the whole system to achieve. Therefore, a reasonable assembly
What is pcb coating material?PCB coating is a thin, polymer film (about 12-200 microns) applied to the populated board. It provides electrical insulation and protects the board from external components or the adverse conditions of the environment in which it is used. Harsh factors include (but are not limited to) the following: Benefits of Conformal
In modern electronic equipment manufacturing, the cost of printed circuit boards (PCBs) represents a significant portion of the total product cost. The custom pcb cost per unit fluctuates due to diverse market demands and technological developments. This article will analyse in detail the main factors affecting the custom pcb cost per unit. 1.Material CostThe material
Flexible printed circuit board (Flexible PCB) has become one of the core components of contemporary electronic devices with its lightness and bendability. Flexible PCB is suitable for smart wearable devices, mobile devices, medical instruments and other fields, and has strong application prospects. However, due to the differences in structure and material properties, the impedance control
Circuit card assembly (CCA) is thin, flat board of dielectric material with conductive paths or tracks etched on their surface. In order to automate the production of CCAs, surface mount technology (SMT) and through-hole assembly machines are often used. Those responsible for the layout design and assembly of this form of manufacturing must have extensive
Insulate Metal Substrate, as a type of computer motherboard, aims to improve thermal efficiency and mechanical strength by applying metallisation to a thick substrate. It is also known as aluminium substrate, aluminium cladding or metal clad PCB (MC PCB), and even thermally conductive PCB (in fact, all PCBs are thermally conductive). Compared to the regular
