Technology Blog

Ceramic pcb, also known as ceramic printed circuit board, is circuit board manufactured using ceramic materials. Compared to conventional fibreglass-reinforced plastic (FR-4) substrates, ceramic PCBs utilise ceramic substrates, offering significant performance advantages. These include superior temperature stability, enhanced mechanical strength, improved dielectric properties, and extended service life. They are primarily employed in high-temperature, high-frequency, and […]

What is chip packaging? Chip packaging involves securing a bare die onto a specific substrate through a series of intricate processes, such as dicing, cleaning, bonding, wire bonding or flip-chip soldering. The die is then encapsulated using plastic materials (such as epoxy resin) while leads or solder balls are exposed to facilitate connection with external

Integrated Circuits (ICs) are semiconductor microdevices originating in the 1950s. Through precision manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, and aluminium deposition, semiconductor elements, resistors, capacitors, and interconnecting conductors are fully integrated onto a miniature silicon wafer. This forms circuits with specific functions, ultimately resulting in soldered and encapsulated electronic microdevices. Based on product

The PCB lamination process primarily involves stacking multiple layers of copper foil and dielectric materials (typically FR4, polyimide, or other composites) in a specific sequence. Under high temperature and pressure conditions, an adhesive binds these layers together tightly. The resulting multilayer PCB is a robust and fully functional circuit board capable of reliable operation within

The solder mask is an indispensable component in the manufacture of printed circuit boards, serving primarily to shield metallic components on the board from environmental corrosion, particularly oxidation, while effectively preventing unintended electrical short circuits between pads, known as bridging. During soldering processes such as reflow or wave soldering, where precise control of solder placement

Understanding Semiconductor Substrates In the semiconductor industry, semiconductor substrates play a crucial and fundamental role. Whether it’s microprocessors, memory, power devices, or RF modules, substrates are the physical support platform upon which these electronic devices rely. They not only support the physical structure of the device but also directly influence its electrical performance, heat dissipation,

As a core material for high-reliability electronic components, the production process of multilayer aluminium substrates integrates precision machining with materials science, with each step directly impacting the product’s electrical performance and mechanical stability. From substrate surface pre-treatment to final packaging, every stage must strictly adhere to process specifications to ensure the multilayer aluminium substrates meet

Low Temperature Co-fired Ceramic (LTCC), as an advanced electronic packaging technology, employs a thick-film material system to co-fire electrode materials, substrates, and electronic components in a single process through a pre-designed structure. This technology, with its high integration and superior performance, has become a key pathway for achieving miniaturisation and multifunctionality in electronic systems. The

As electronic products accelerate towards lighter, slimmer, smaller and higher-density designs, traditional rigid PCBs struggle to meet specific structural and performance demands. Flexible PCB (FPC), however, shine across numerous sectors including mobile phones, cameras, wearables, medical electronics and automotive electronics, owing to their unique ability to bend, fold and stretch. Particularly in critical areas such

Flexible printed circuits (FPC), owing to their pliable nature, have found exceptionally widespread application within the electronics sector, proving particularly well-suited to scenarios where space is at a premium. As electronic devices continue their trajectory towards miniaturisation, the scope of FPC utilisation grows ever broader. In the assembly stages of numerous consumer products, constrained by

High-speed pcb board circuits typically refer to digital circuits operating at very high speeds, which is related to the clock pulse frequency required by digital circuits. These pulses are rectangular waveforms. High-frequency circuits generally denote radio wave frequencies, which are sinusoidal waves. Both the transmission and reception circuits for radio waves are typically termed high-frequency

Transparent PCBs are circuit boards manufactured using transparent substrates (such as glass, polyimide or plastic) and transparent conductive materials (such as ITO or silver nanowires), combining electrical conductivity with light transmission. They find extensive application in flexible displays, smart touchscreens and medical devices. Within this manufacturing process, metal masks particularly high-precision laser-cut masks—play a critical

In today’s era of increasingly miniaturised and multifunctional electronic devices, flexible printed circuits (FPC) have become vital bridges connecting critical internal components. However, as technological aesthetics and application scenarios continue to expand, a novel type of flexible circuit board—the transparent flexible printed circuit (Transparent FPC)—is emerging. It not only inherits the flexibility of traditional FPC

With the advancement of modern electronic technology, the trend towards high-frequency signal transmission and high-speed digitalisation has become mainstream, making high frequency PCB design a crucial field of research. High frequency circuit boards are typically defined as boards handling electromagnetic frequencies exceeding 1GHz, imposing heightened demands on substrate properties, routing, and overall design. In high-frequency

Flexible printed circuits (FPC), also known as flexible circuit boards, stand out in the electronics sector due to their high wiring density, lightweight and slim profile, and exceptional bending performance, making them highly favoured within the industry. These unique advantages enable FPCs to adapt flexibly to various complex shapes and size requirements, proving particularly suitable

In the field of high frequency pcb circuit design, the quality of material properties directly determines signal transmission efficiency and stability. With the rapid advancement of technologies such as 5G communications, millimeter-wave radar, and industrial IoT, the demand for low-loss, high-reliability circuit materials is increasingly urgent. The RO4000® series hydrocarbon ceramic laminates, leveraging their unique

In RF circuit design, signal interference, power supply noise, and mutual interference between components often become critical factors limiting system performance. Through scientific and rational partitioning design, effectively separating circuit modules with different functions can not only significantly reduce signal interference but also greatly enhance system stability and reliability. High-frequency component separation: Isolate high-frequency components

The laminate structure of RF PCB must consider not only the impedance of RF signal traces but also heat dissipation, current, components, EMC, structural integrity, and skin effect. When layering and stacking multilayer printed circuit boards, we typically adhere to the following fundamental principles: A) Each layer of an RF PCB should feature a large

The CCL (Copper Clad Laminate) lamination process utilizes high-temperature and high-pressure conditions to achieve a tight and robust bond between the copper foil and substrate within the laminate. This process is centered on producing high-quality, high-performance PCBs (Printed Circuit Boards), ensuring the CCL meets the electrical, mechanical, and chemical properties required for PCBs. CCL Laminating

Connections between pcb circuit boards are primarily achieved through conductive connectors, wires, flexible printed circuits (FPC), board-to-board connectors, and soldering techniques. Among these, flexible printed circuits (FPC) serve as a widely adopted connection method, excelling in the creation of reliable, high-density electronic products. Their lightweight, thin profile and excellent flexibility make them highly suitable for

SMT stencils, commonly referred to as ‘templates’, are an indispensable component of the SMT (Surface Mount Technology) process; they serve as the template for printing solder paste onto the PCB (Printed Circuit Board) during the initial stage of surface mounting. In the first stage of the SMT process, this smt stencil is employed to precisely

PCB trace impedance refers to the total resistance encountered by electrical signals during transmission across a PCB board. In layman’s terms, it represents the ‘resistance’ encountered by electrical signals as they traverse the PCB. PCB trace impedance matching denotes the adjustment and alignment of trace impedance to ensure more stable and reliable signal transmission across

Semi flex pcb is essentially “standard” multilayer PCBs manufactured using specific grades of FR4. The thickness of the FR4 is subject to particular tolerances, enabling thinner sections to provide the flexible/bendable portions traditionally achieved with rigid FR4. Semi flex pcb is suitable for static applications (where the flexible section aids assembly) or scenarios involving minimal

High speed PCB design specifically refers to systems that utilise high speed digital signals to transmit data between components. The boundary between high-speed digital design and simpler circuit boards employing slower digital protocols is not always clear cut.Typically,the key indicator determining whether a system qualifies as ‘high-speed’ is the edge rate (or rise time) of