High frequency pcb and high speed pcb belong to the same PCB circuit boards used for signal transmission, however, there are significant differences between the two in the actual application scenarios, mainly reflected in the following. Frequency band application differences: high frequency pcb focus on frequency bands above 500MHz, specifically to cope with high-frequency signal […]
The MSL (Moisture Sensitive Level) standard is a classification system used by the electronics industry to assess the sensitivity of components to moisture, which classifies components into eight different levels based on their sensitivity to moisture. These levels reflect the amount of time a component can be safely stored under specific temperature and humidity conditions
The fundamentals of RF circuit design include： RF Circuit Layout PrinciplesWhen designing an RF layout, priority must be given to meeting the following general principles: (1) As far as possible to isolate the high-power RF amplifier (HPA) and low-noise amplifier (LNA), in short, is to keep high-power RF transmitter circuits away from low-power RF receiver
Solder Joint Pillow, also known as the pillow effect (Head-in-Pillow, HIP), is an undesirable phenomenon in which the solder balls of BGAs, CSPs and other components fail to fully fuse with the solder, resulting in the failure to form good electrical connections and mechanical solder joints. This phenomenon is similar to the shape of a
As a key necessary step in the integrated circuit manufacturing process, chip packaging and testing plays a vital role. Specifically, this link will carry out a series of fine operations on the wafers that have passed the quality inspection, and complete the wafer cutting, chip welding and overall plastic sealing processes with the help of
With the rapid development of science and technology, the impact of digital imaging technology in our lives is becoming more and more profound. From daily smartphones and tablets to high-precision industrial inspection equipment, medical imaging systems, and the drones, smart driving and wearable devices that have emerged in recent years, all kinds of products rely
BGA Test Fixture (Ball Grid Array Test Fixture) is a test tool for testing BGA chips, which can provide electrical test, signal acquisition and programming functions for the chip. In the design of the BGA test frame, you need to consider the PCB (Printed Circuit Board) with the design, because the layout of the PCB
A potentiometer circuit board is an analogue circuit element used in electronic circuits, usually to adjust the resistance of a circuit in order to control its performance and function. It usually consists of a rotary potentiometer, a potentiometer resistor, two connecting wires and two connectors. Potentiometer circuit board is mainly composed of a rotary potentiometer,
BGA pad diameter tolerance, that is, the maximum allowable deviation range of the diameter of the ball grid array package pad. In the manufacturing process of electronic components, the control of tolerance is crucial, which directly affects the quality of the pad and the reliability of electronic products. Reasonable tolerance range can ensure that the
Circuit boards are classified according to their self-extinguishing time after fire ignition, and are usually classified into three grades: UL94 V-0, UL94 V-1, and UL94 V-2. The evaluation of the flame retardancy of circuit boards is based on the UL94 standard. The test method covers both horizontal and vertical test situations. In the horizontal test,
A remote control circuit board is an electronic device used to remotely control equipment. It is based on wireless communication technology and uses wireless signal transmission between the transmitter and receiver to achieve remote control of equipment. The working principle of the remote control circuit board is as follows:Firstly, the key operation on the transmitter
High voltage pcb is circuit board that can withstand high voltages and are commonly used in high-voltage electronic equipment. It must not only be able to withstand high voltages, but must also have excellent insulation properties and high temperature resistance, so as to ensure that no failure or damage occurs in the high-voltage operating environment.
Flexible Printed Circuits (FPC) as electronic equipment thin and highly integrated core carrier, its welding technology directly affects product performance and reliability. Common soldering methods for flexible circuit boards:Thermocompression SolderingThermocompression Soldering as a FPC (Flexible Printed Circuits) flexible boards, a mainstream connection process, the core mechanism is the use of heat and mechanical pressure synergistic
The hard drive pcb board acts as a bridge between the internal hard drive and the motherboard of the computer, and its role is to convert the electrical signals received from the interface into magnetic information, which can be recorded on the hard drive platters (this is a write operation); at the same time, it
Why FPC SMT must use the fixture, FPC flexible board has a unique physical characteristics, so it can not be directly applied to the standardised SMT (surface mount technology) production process. The special carrier with its deformation suppression, thermal conduction optimisation, precise positioning, electrostatic protection and process compatibility and other five core functions, can effectively
Plating is an extremely critical step in the FPC manufacturing process. Plating not only strengthens the circuit’s conductivity, but also improves its corrosion resistance and appearance. FPC (Flexible Printed Circuit) is plated on the following levels:Optimisation of conductive propertiesMetallic gold has excellent conductive properties. When an FPC is coated with metallic gold, the conductivity of
Circuit board aging refers to the natural phenomenon of gradual changes in the properties, structure and performance of circuit board materials after long-term use of electronic equipment. The effects of circuit board aging: Preventive measures for circuit board aging Circuit board aging workflowExperiment preparation stageAging environment constructionNeed to plan a dedicated aging test space (aging
What is continuous tin? Continuous tin refers to the soldering of circuit board pads on the solder joints after the emergence of two and more solder joints. Pins of the solder connected to the phenomenon. Even tin is simply understood as solder has a connection, is a process abnormality. Defects, manifested in excessive solder bridges.
A power ic chip is a type of integrated circuit chip that is mainly used to control and manage functions such as power supply and protection. They are usually used in a variety of electronic devices, such as computers, mobile phones, digital cameras, automotive electronics and so on. Power IC Chip CharacteristicsIn the architecture of
Printed Circuit Board as a key component in the field of electronics, the principle of its work is in the conductive substrate precision etching or printing ‘circuit layout pattern’, as a carrier to fix all kinds of electronic components, and based on the electrical schematic diagram to build a complete circuit, to ensure that the
Burn in test is the process of running a circuit board or equipment for an extended period of time under tightly controlled environmental conditions to simulate actual circuit board usage scenarios in order to check the reliability and stability of the board. The aging test time is usually more than 24 hours, and can even
PCB Inspection is a comprehensive inspection of a printed circuit board that includes cosmetic, dimensional, solder joint, component mounting, electrical and functional testing. These steps ensure that the PCB is undamaged, meets design specifications, is well soldered, components are properly installed, circuits are properly connected, and overall functionality is proper. This helps to improve the
Semiconductor test boards, or ATE (Automatic Test Equipment) as we often call them, are an essential part of the semiconductor industry. Semiconductor test boards are specialised circuit boards used to evaluate, verify and test the performance of semiconductor devices. These test boards are precision designed to accommodate different types of semiconductor devices and to accurately
Test points are an important design element in printed circuit boards and can be used as locations to probe signals or apply test stimuli during development, verification, debugging, field service and repair. They provide easy access to critical nodes in a circuit without the need to connect probes directly to components or tracks that could
