PCB pad is a critical component of printed circuit boards, serving as the interface between electronic components and the circuit board for establishing electrical connections and mechanical support. The quality of pad design directly impacts component soldering reliability, overall product performance, and manufacturing process efficiency. PCB pad widthThe width of the PCB pad should be […]
The pcb aspect ratio, which is the ratio of the length to the width of the circuit board, is a critical parameter in electronic design. The aspect ratio refers to the ratio of the length to the width of the circuit board, and it not only affects the physical dimensions and layout of the circuit
Introduction – Understanding Round PCBs In modern electronic product design, PCBs (Printed Circuit Boards) have evolved from their original simple rectangular form to encompass a variety of shapes and structures. Round PCB Board, due to their unique shape, structure, and adaptability, are gaining increasing attention in applications such as wearable devices, smart lighting, medical sensors,
Electroplating via filling is a key technology in the field of modern high-density electronic packaging. It not only greatly enhances the design flexibility and performance of PCB boards, but also demonstrates significant advantages in product reliability, heat dissipation capabilities, and production efficiency. This article will explore the many advantages of electroplating via filling in depth
RF pcbs are core components in electronic devices, and their performance stability directly affects the overall operational effectiveness of the device. However, in complex electromagnetic environments, RF circuit boards are easily susceptible to various electromagnetic interferences, leading to performance degradation or even failure. Therefore, effective RF PCB shielding is particularly important. Basic Principles of RF
IntroductionAs electronic devices increasingly move toward higher density, higher performance, and smaller form factors, the manufacturing requirements for printed circuit boards (PCBs) are also increasing. As the foundation of electronic systems, the stability and reliability of PCB processes directly impact the overall performance of the product. Solder mask, a crucial component of PCB surface treatment,
What is a PCB teardrop? A PCB teardrop is an additional copper pad, either straight or circular, located at the connection point between a pad or via and a trace, or when a trace transitions between different widths. For example, if part of your trace width changes from 10 mil to 4 mil, a teardrop
EMI coating is a thin film made from materials that shield electromagnetic interference signals, capable of blocking the propagation of electromagnetic waves. EMI coating is typically made from conductive materials and can be applied via adhesion or spraying to the external surfaces or internal structures of various electronic devices. EMI signal shielding coatings can be
A graphics card circuit board, also known as a graphics card motherboard or graphics card PCB, is a circuit board used to transmit signals from the graphics processing unit (GPU). It is a very important component inside a computer, working in conjunction with the CPU and memory to ensure that the computer can handle high-load
On a graphics card pcb, the power supply section is just as critical as the graphics processing unit (GPU). If the GPU is the ‘brain’ of the graphics card, then the power supply section is its ‘heart.’ Without a robust ‘heart’ providing foundational support, even the most powerful ‘brain’ cannot function properly. Additionally, the design
Definition and Function of Solder Mask Material in PCB Design In the printed circuit board (PCB) manufacturing process, solder mask is a crucial protective coating. It’s typically green, hence the nickname “green board,” but PCBs can also come in red, blue, black, white, and other colors. The solder mask material not only impacts the board’s
What is coverlay in fpc?FPC coverlay is polymer film made from materials such as polyimide (PI), primarily used to protect and insulate the external circuits of flexible PCB. FPC coverlay is the earliest and most widely used technology in the application of cover layers for flexible printed circuit boards. FPC coverlay primarily serves to protect
PCB overmolding is a technique that involves coating printed circuit boards (PCBs) with protective polymer resin. This process is designed to protect PCBs from external factors such as humidity, dirt, and temperature fluctuations. During the pcb overmolding process, the polymer resin is injected and cured around the PCB circuitry, forming a tight and secure seal.
PCB warping is a common quality issue in surface mount technology (SMT) processing, severely affecting the performance and reliability of electronic products. This phenomenon is not caused by a single factor but rather the combined effect of multiple factors. Gaining a deep understanding of these underlying causes is key to effectively preventing and resolving PCB
In the field of electronic product manufacturing, solder contamination on PCB gold fingers is a common and challenging issue that significantly impacts product performance and reliability. Especially during critical processes such as solder paste printing and reflow soldering, even minor operational errors or environmental factors can cause solder paste to accidentally adhere to the gold
The production process for high-frequency microwave pcb is complex and requires extremely high precision, encompassing multiple critical stages from engineering data processing to final forming. To ensure product quality and performance, manufacturers must strictly adhere to specific operational procedures and control points at every stage of the process. Challenges in high-frequency microwave pcb processing: Key
Definition and Development Background of HDI Flexible Circuit Boards Driven by the trend toward increasingly thinner, smaller, and highly integrated electronic products, traditional rigid circuit boards are no longer able to meet the diverse product forms and complex circuit design requirements. In particular, in high-end sectors such as consumer electronics, medical devices, aerospace, and automotive
The manufacturing of microwave pcb has multiple distinctive features, primarily manifested in the diversity of substrate materials, stringent requirements for design precision, computer-controlled manufacturing processes, specialised graphic production, diverse surface coating options, CNC-controlled shape processing, and automated batch production inspection equipment. Substrate Material DiversityThe miniaturisation and integration of microwave devices have imposed higher demands on
RF connectors are electrical connectors used for transmitting radio frequency signals. They are also referred to as coaxial connectors within the industry, as RF connectors are typically connected to coaxial cables and also have a coaxial structure. Classification of RF connectors:By connection interface structure:Threaded connection: Uses series such as SMC, SMA, TNC, N, UHF, 7/16,
Microstrip patch antennas and their arrays may not be seen much but are the most widely used form of antenna. They are simple in structure and can be formed by a dielectric, a metal conductor patch on top of the dielectric, and a ground plane. Even the intervening dielectric can be an air structure. The
High frequency pcb is special circuit board dedicated to higher electromagnetic frequencies, applicable to high-frequency (frequency over 300MHz and wavelength less than 1 metre) and microwave (frequency higher than 3GHz, wavelength less than 0.1 metre) fields. This type of PCB is usually in the microwave substrate copper-clad board, through part of the use of ordinary
What is a high-Tg PCB? What are the advantages of using high Tg PCBs? When the temperature of a high Tg printed circuit board rises to a certain range, the substrate transitions from a ‘glass state’ to a ‘rubber state,’ and this temperature is referred to as the board’s glass transition temperature (Tg). In other
What is 94v-0 on a pcb? The 94v-0 standard is a standard set for the combustion characteristics of plastic materials in electronic and electrical products. It was established by Underwriters Laboratories (UL), a highly authoritative insurance laboratory in the United States. This standard specifies the specific behaviour of plastic materials when exposed to flames, with
In the fields of mechanical processing, PCB design and product assembly, the design of holes is far more than just a round hole. Different types of hole structures have a direct impact on assembly accuracy, mechanical properties and even product appearance. Counterbore vs countersink are the two most common finishing hole types. Many technicians, purchasers,
