SOP Package is a form of packaging used in the manufacture and assembly of electronic components.SOP package is a surface mount technology (Surface Mount Technology, SMT), which solder the pins of electronic components to the surface of a printed circuit board (Printed Circuit Board, PCB) instead of connecting them through a perforated hole. SOP package is a surface mount technology (Surface Mount Technology, SMT), which welds the pins of electronic components to the surface of the printed circuit board (Printed Circuit Board, PCB) instead of connecting them through perforations.
Structure
It is a surface mount package (SMT), its structure includes package body, pins and pads and other components.
Package Body: The package body is usually made of materials such as resin or plastic and can be square, rectangular or round in shape. The size and shape of the package body depends on the size and shape of the chip, and its main role is to protect the chip, provide structural support and fixed pins.
Pins: The number and arrangement of pins of SOP package depends on different specifications. The pins are usually metal or copper pins, which are soldered to the printed circuit board (PCB) through surface mount technology to connect the chip with the PCB and complete the function of circuit design.
Solder pads: The solder pads of SOP packages are metal sheets at the bottom of the package body, which cooperate with the pads on the PCB to connect the chip and the PCB through the soldering process and complete the connection of the circuit design. The size and shape of the pad depends on the size and number of pins of the package body, as well as the surface mount process requirements.
There are several chip packages derived from SOP:
SOIC
SOIC (Small Outline Integrated Circuit Package), the Chinese name is called Small Outline Integrated Circuit Package, is derived from the SOP, the two packages of the specific dimensions, including the length of the chip, width, pin width, pin spacing, etc. are basically the same, so the PCB design time package SOP and SOIC can be mixed.
SOIC is a surface mount integrated circuit package form, it is equivalent to the DIP package to reduce the space of about 30-50%, the thickness of about 70% reduction. It has the same pinout as the corresponding DIP package. The naming convention for these packages is to add the number of pins after SOIC or SO. For example, a 14-pin 4011 package would be named SOIC-14 or SO-14.
TSOP
TSOP is the abbreviation of Thin Small Outline Package, i.e. Thin Small Outline Package.A typical feature of TSOP memory packaging technology is to make pins around the packaged chip.TSOP is suitable for mounting and wiring on PCB (Printed Circuit Board) using SMT technology (Surface Mounting Technology).TSOP package form factor is characterized by a high level of parasitic parameters ( The parasitic parameters (output voltage perturbation caused by large changes in current) are reduced for high-frequency applications, easier operation, and higher reliability.
QFN Package
QFN is a leadless quad flat package that is a lead-free package with peripheral termination pads and a chip pad for mechanical and thermal integrity exposure.
The package can be square or rectangular. The package is configured with electrode contacts on all four sides of the package, and due to the absence of pins, the mounting footprint is smaller and the height is lower than that of a QFP.
Features of QFN package:
Surface mount package, pinless design;
The pinless pad design occupies a smaller PCB substrate area;
Very thin components (<1mm) to meet the strict requirements of space applications;
Very low impedance, self-inductance to meet high-speed or microwave applications;
Excellent thermal performance, mainly due to the large heat sink pads on the bottom;
Light weight for portable applications.
The small form factor characteristics of the QFN package can be used in portable consumer electronics such as notebook computers, digital cameras, personal digital assistants (PDAs), cellular phones and MP3s. From the market point of view, QFN packages are getting more and more attention from users. Considering the cost and volume factors, QFN packages will be a growth point in the next few years, and the development prospect is extremely optimistic.
Manufacturing process
Chip Mounting: Paste the chip on the substrate.
Lead bonding: Align and connect the pins of the chip with the pins of the substrate through hot pressing and ultrasonic methods.
Completion of the package: through the plastic sealing and other methods to complete the encapsulation of the chip to protect the chip and enhance its mechanical strength.
Test and inspection: Electrical performance test and appearance inspection of the packaged chip to ensure that it meets the quality standards.
Application Scenarios
Consumer electronics: In consumer electronics products, such as cell phones, TVs, computers, etc., SOP packages are widely used in a variety of integrated circuits. Due to its small size, low cost, excellent electrical performance and other characteristics, making it one of the commonly used packaging forms in consumer electronics.
Communication equipment: In communication equipment, such as base stations, switches, routers, etc., SOP packages are also widely used. Due to its high packing density and excellent electrical properties, it has become one of the ideal packaging forms in communication equipment.
Automotive electronics: in automotive electronics, due to its harsh operating environment and reliability requirements, SOP package is also widely used. Due to its low cost, easy to mass production and other characteristics, making it one of the commonly used packaging forms in automotive electronics.
Other fields: In addition to the above fields, SOP packages are also widely used in industrial control, medical equipment, aerospace and other fields.
As a common IC package form, SOP package has the advantages of small size, low cost, excellent electrical performance, but there are some disadvantages such as signal transmission limitations, reliability issues. When choosing to use SOP packages, it is necessary to make comprehensive considerations based on specific application scenarios and needs.
