Electronic manufacturer

The tin spraying process, also known as hasl, is a long-established technology for PCB (Printed Circuit Board) surface treatment. The process starts by immersing the PCB in molten solder, which is then applied to the copper surface, followed by the use of a hot air gun to blow away the excess solder material, resulting in […]

A board electronics with holes is a substrate used for the layout of electronic components and its function is to connect electronic components. It is a design element on a circuit board, which is a hole set up to facilitate the insertion, connection and soldering of circuit board components. The core principle behind the functioning

A circuit board enclosure is a material specifically designed to protect circuit boards from damage or contamination. It also enhances the mechanical strength and thermal resistance of the circuit board, ensuring that it is more robust and trustworthy. Choosing the right enclosure is an integral part of the design process as it directly affects the

A 6 layer pcb stackup structure is a design in which six layers of conductive and non-conductive materials are stacked together during the circuit board manufacturing process to achieve complex circuit connections. This type of structure is commonly used in electronic products that require high-density wiring and multifunctional integration. Common 6 layer pcb stackup: 2.GND-SIG-GND-PWR-SIG-GNDIt

Alumina ceramic substrates consist mainly of a white amorphous powder commonly known as aluminium oxide, or simply Al2O3. It has a density of between 3.9 and 4.0 g/cm3, a melting point of up to 2,050°C, and a boiling point of up to 2,980°C. It is also used in the manufacture of alumina ceramic substrates. Aluminium

As a core component, the design and layout of an integrated circuit board (IC board) has a direct impact on the performance, reliability, and productivity of the device.The layout of IC board components not only needs to meet the requirements of electrical performance, but also needs to take into account various factors such as manufacturing

The choice of moulding process for flexible board directly affects product quality and production efficiency. According to the product demand, accuracy requirements and production volume, manufacturers need to reasonably select the moulding method. In this article, we will introduce in detail the characteristics and application scenarios of the three main moulding processes. 1.Die-punching moulding processDie-punch

Flexible board, is the so-called flexible circuit board, in fact, also belongs to a kind of printed circuit boards, but with the traditional printed circuit boards and has a great difference, so it will be called flexible board, full name of the flexible circuit board. Flexible board generally use PI as a substrate, is a

IC board, i.e. packaging substrate, is a kind of circuit board used to carry chips, belongs to a branch of PCB, has the characteristics of high density, high precision, high performance, miniaturisation and thinness, which can provide support, heat dissipation and protection for the chip, and also provide electrical connection and physical support between the

High speed pcb sheet has the characteristics of low dielectric constant and low dielectric loss, which helps to significantly reduce the energy loss and distortion during the signal transmission process, thus improving the transmission speed and stability of the signal. In the high-frequency and high-speed digital signal transmission scenarios, the appropriate choice of high-speed sheet

Although the field of radio frequency (RF) circuit board design is still full of unknowns, there are a number of guiding principles that can be followed. However, the main challenge encountered in the actual design process is how to make reasonable compromises when these principles cannot be fully followed due to various constraints. A few

PCB circuit boards are divided into single-sided, double-sided and multilayer type, which the number of layers of multilayer boards are not strictly limited, there are more than 100 layers of PCBs have been introduced, but four-layer and six-layer boards are more common. Many people will be puzzled, why the PCB multilayer board commonly used in

PCB lamination is a key process step in the manufacture of multilayer printed circuit boards (PCBs). In this process, multiple thin, pre-processed circuit board layers (including copper foils, insulating substrates, leadframes, etc.) are tightly bonded together under high temperature and pressure with a specific adhesive (usually epoxy) to form a monolithic multilayer structure. The purpose

Agnetic environments and the control of interference with other equipment. ESD protection is the key to ensure that the equipment is not damaged in the electrostatic environment. This article will delve into the role of capacitors in enhancing EMS performance and the key function of resistors in preventing ESD damage. From the perspective of EMS

Static electricity arises from the separation of charges that occurs when two different materials come into contact with each other or are rubbed together, causing an object to become electrically charged as a whole. For example, the constant friction of people wearing clothes, or even the simple act of tearing paper, can trigger the generation

What is pcb panelization?PCB panelization refers to the process of integrating several small PCB boards into one large board by the manufacturer. From the initial stage of PCB design until the final production link, the board assembly operation always plays a pivotal role. It is not only about the quality of the PCB board to

In the PCB manufacturing process, pcb warpage problem has been one of the key factors affecting product quality and productivity. Warped PCB boards are not only difficult to subsequent assembly and soldering, but may also be rejected because they do not meet the specifications, leading to increased production costs and delivery delays. In order to

Circuit board side plating, also known as edge copper plating, refers to copper plating applied to at least one of the side edges of a PCB board that extends from the top to the bottom of the board. This process is designed to enhance the robustness of the PCB connection and reduce the risk of

PCB Copper Layup is the process of filling areas of a PCB board that are not wired or unused spaces with solid copper skins. Copper plays multiple key roles in PCB design including, but not limited to, reducing ground impedance, enhancing interference immunity, connecting to ground to reduce loop area, and promoting heat dissipation. Copper

On a printed circuit board,board pitch refers to the distance between two pins or components,which is usually measured in millimetres. The correct layout of components is essential in the design of a circuit board.A smaller pitch means that the components are closer to each other,which makes the design more compact,but correspondingly more difficult to manufacture.Conversely,if

What is beveler in pcb?The PCB beveling machine is a specialised equipment for chamfering the edges of circuit boards.Beveling of circuit boards refers to a special treatment on the edges or corners of circuit boards, which is usually done by cutting or grinding to make the edges that are originally straight or sharp rounded. This

In the electronics manufacturing industry,wave soldering, as an important connection technology, is widely used in the assembly process of circuit boards. However, in practice, excessive tin impurities and the generation of tin dross after wave soldering have been a problem for manufacturers. These problems not only affect the soldering quality, but also increase the production