Burn in board is a common test method to evaluate the performance and reliability of circuit boards by simulating the conditions of long-time use or harsh environments. The circuit board aging process is the specific steps and procedures to carry out circuit board aging test. In practice, the standardisation and optimisation of the circuit board […]
In the field of modern electronics manufacturing, SMT (surface mount technology) and burn in board is inextricably linked, and their synergistic effect is a key link to ensure the stability and reliability of electronic product performance.SMT technology, as the basic process for manufacturing aging boards, enhances the durability and accuracy of burn in boards in
The body to body clearance for smt parts is the minimum distance that must be maintained between two neighboring components in surface mount technology (SMT). This distance is required to ensure board performance and reliability while avoiding electromagnetic interference and thermal conduction problems. Minimum body to body clearance for smt parts StandardIPC-7351B is an industry
SMT connectors are connectors assembled using SMT technology. In specific use, SMT connectors like SMT components, for the connector pads, are directly affixed to the surface of the circuit board, and no longer need to be like the traditional TH connectors need to be pierced to install. SMT connectors are divided into: lying paste connector
RO4350B is a commonly used high-frequency printed circuit board (PCB) material produced by Rogers Corporation in the United States. This material is used in wireless communications, radar systems, medical devices and other high frequency electronic equipment.The dielectric constant of RO4350B is approximately 3.48.This value was measured at a frequency of 1 GHz.Typically, the dielectric constant
HDI circuit boards are highly integrated printed circuit boards with high density, miniaturization, and light weight, which can significantly improve the performance and functional density of electronic products. HDI board design specifications usually cover the following aspects: Number of Layers and Thickness: HDI circuit boards usually use a multi-layer structure to accommodate more signal and
BGA packages is solder ball array package, is an integrated circuit using an organic carrier board packaging method. With the continuous development of society, in order to meet the demand for electronic products light, thin, short, small and functional diversification, production of green and other aspects of the BGA package began to be applied to
Rogers material is a specialised laminate used in the manufacture of high frequency, high performance Printed Circuit Boards (PCBs) and is manufactured by Rogers Corporation. Rogers materials typically do not contain glass fibres, but rather a ceramic foundation or hydrocarbon ceramic composite substrate, which gives them excellent dielectric properties, low dielectric constants and low loss
PCB prepreg is a soft material, similar to the black tape, also called ‘semi-glue’ or ‘film’, commonly used in the production of circuit boards. In the PCB PP is sandwiched between the core board and copper foil or two core boards before the dielectric layer to play an insulating role. It is made of polymer
The laminated construction of PCB circuit boards refers to the stacking of multiple layers of circuit boards together to form a single structure. Electronic components can be arranged on each layer of the pcb circuit board, and the components are connected between the layers by means of wires and jacks. The laminated structure can provide
Rogers ceramic pcb is a kind of circuit board using ceramic material as the substrate, which has the advantages of high thermal conductivity, high insulation, corrosion resistance and high temperature resistance. This type of circuit board is suitable for use in a variety of electronic products that require high performance and reliability, such as aerospace,
Rogers RO4003C substrate is known for its dielectric constant Dk of 3.38+/-0.05 and low dielectric loss Df of 0.0027 at 10 GHz. It is a unique glasscloth-reinforced, ceramic-filled hydrocarbon composite that combines the excellent electrical properties of PTFE/glasscloth with the superior processability of epoxy resin/glasscloth. processability. RO4003C laminates are available in two different configurations with
PCB plating to fill vias is a treatment performed to connect different layers of circuits during the manufacturing process. In the manufacturing of High Density Interconnect (HDI) boards and multilayer boards, the treatment of microvias (via) is a key aspect. Conventional mechanical drilling methods can no longer meet the high precision requirements of microvias, and
In electronic circuit design, pcb circuit board line width is closely related to its current carrying capacity. Wire width directly determines the cross-sectional area of the wire, thus affecting the maximum current it can withstand. The proper design of the line width not only ensures the normal operation and safety of the circuit, but also
Through-hole assembly, also known as through-hole technology, is a mounting method for electronic components. It consists of inserting components into existing holes in printed circuit boards (PCBs) using the component’s pins and soft brazing of electronic components by hand assembly or automatic insertion loaders. Advantages of through hole assemblyThrough hole assembly technology, or THT for
A radio frequency circuit board (RF PCB) is a type of circuit board specifically designed to handle high frequency and radio frequency signals. Compared to ordinary PCBs, RF PCBs have unique design requirements for efficient signal transmission in the high frequency range. Impedance matching and signal integrity are important in RF circuit board design and
Heavy copper flex PCB refers to circuit boards with thicker copper layers in the flexible circuit board, which are usually between 100 and 400 microns thick, far exceeding the 35 micron copper thickness of standard PCBs. This design not only improves the current-carrying capacity of the board, but also greatly enhances its thermal performance. Flexible
With the rapid development of automotive electronics technology, automotive PCB assembly as a key electronic manufacturing link, its reliability is directly related to the safety and performance stability of the vehicle system. Enhancing the reliability of automotive PCB assembly not only reduces the failure rate and rework cost, but also effectively improves the overall quality
Automotive circuit board, full name of automotive printed circuit board, is a kind of electronic products using printing technology to print the copper foil line on the insulated substrate. It connects various electronic components such as resistors, capacitors, chips, etc. together through specific circuit patterns to achieve the transmission and processing of electronic signals, thus
Automotive pcb assembly is the process of assembling automotive printed circuit boards, which has more stringent quality requirements than PCBA in other fields. This is mainly because the automotive electronic system is directly related to the performance and safety of the vehicle. Automotive pcb assembly process:Raw material preparationAccording to the special needs of automotive electronics,
Printed circuit boards are the bearers of electronic components, which provide a master for connecting the various components in a circuit. Structurally, PCBs are mainly classified into single-sided, double-sided and multilayer boards. The parts and wires of a single panel are concentrated on each side of the substrate. This type of printed circuit board is
A flex pcb edge connector is an electrical connector designed for flexible printed circuit boards (FPCs) to provide a reliable electrical connection between the circuit leads of a flexible circuit board and the contact pads on other circuit boards, such as rigid PCBs. It is usually mounted on a rigid circuit board (PCB) to secure
The flex pcb thickness varies depending on the material, manufacturing process and application requirements, typically ranging from 0.1mm to 1.6mm. Choosing the right thickness is critical to ensure product performance and longevity. Factors affecting the flex pcb thickness Flex pcb thickness in different applications Flex pcbs are classified as single layer, double layer, multilayer and
Printed circuit board (PCB) as a core component of modern electronic equipment, its quality and reliability of the performance of the entire electronic system plays a vital role. However, during the manufacturing, storage and use of PCBs, they are affected by various factors such as temperature, humidity, contaminants and process operations, and often suffer from
