Electronic manufacturer

active rf circuits

Active rf circuits technology and applications

Active RF circuits are RF circuits that require an external power source to function properly. Such circuits usually contain components such as amplifiers, mixers, and voltage-controlled oscillators, and are capable of increasing the gain of the signal, modulating the frequency and amplitude of the signal, and are highly resistant to interference. Compared to passive circuits, […]

pcb material

Properties and Applications of Nelco N4000 13

Nelco N4000 13 is a very high quality multilayer sheet that is carefully crafted from glass fibre and epoxy resin, with the number of layers varying between approximately 8 and 16, while its thickness varies between 0.25 mm and 5.6 mm. The material’s high insulating ability, excellent thermal stability and strong mechanical strength make it

hard drive printed circuit board

Core functions of hard drive printed circuit board

The hard drive printed circuit board is a key component of a hard disc. It consists of one or more layers of glass fibre substrates stacked on top of each other and covered with various electronic components, such as integrated circuits, connectors, capacitors, and so on. In the operation of a hard disc, the circuit

high temperature soldering

SMT High Temperature Soldering Technology

SMT high temperature soldering technology is a soldering method that uses peak soldering temperatures in excess of 220°C in the SMT (or Surface Mount Technology) process. This technique is typically implemented in the 245 to 247°C temperature range to ensure that the solder paste and the BGA (ball grid array) solder balls are able to

cold solder joint

Cold solder joint problems and coping

A cold solder joint is a soldering phenomenon that occurs when the required minimum wetting temperature between the brazing material and the base metal is not reached, or when the metallurgical reaction fails to proceed adequately despite the fact that wetting occurs in some localised areas. When this phenomenon occurs, it means that there is

Dual In-line Package

Comparison of DIP and SMT technology

DIP package assembly, also known as Dual In-line Package (DIP), is an assembly method that requires the pins of an electronic component to be inserted into a through-hole of a printed circuit board (PCB), and then secured using soldering techniques such as wave soldering. The DIP package process is particularly suitable for larger electronic components

phone circuit board

Phone Circuit board RF layout strategy

A phone circuit board is a key component used for the connection and assembly of circuits inside a mobile phone. It is usually a thin board made of insulating material covered with a conductive layer that is used to connect and support the various electronic components inside a mobile phone, such as processors, memory, sensors,

backdrill

PCB backdrill technology analysis

PCB backdrill, also known as controlled depth drilling, is simply the process of drilling a hole from the back side of an already manufactured multilayer circuit board. However, this is not just playing, but to accurately trim some of the through-holes (we also call it PTH holes, that is, plated through-holes) in those unwanted ‘little

stamp hole

Printed circuit boards depaneling technology

In the mass production of printed circuit boards (PCBs), manufacturers often combine multiple individual boards into one large board, a process known as boardmixing, where multiple small boards are combined into one large board. The aim is to feed these boards more efficiently into the automated machines of the SMT (surface mount technology) production line,

hot plate for pcb soldering

Efficient application of ​hot plate for pcb soldering

Hot plate for pcb soldering is an advanced soldering technique that is primarily used to securely attach electronic components to printed circuit boards (PCBs). This method utilises the heating function of the hot plate to provide uniform temperature control, thus ensuring an efficient and stable soldering process. The hot plate for pcb soldering process achieves

pcb circuit board

Parasitic Resistance Factors Affecting Circuit Performance

Parasitic resistances are resistances that are not intentionally designed into a circuit, but are created due to circuit layout or component characteristics, for example. They are usually unavoidable and affect the performance and stability of the circuit. Parasitic resistors have the following characteristics: Parasitic resistors are often considered the ‘enemy’ of circuit design due to

hdi technology

HDI technology changes the future of the PCB

HDI technology is a cutting-edge PCB (Printed Circuit Board) manufacturing process that offers the significant benefits of high-density layout, high reliability and high integration, with the PCB serving as the cornerstone of electronic component interconnectivity, carrying and solidly connecting all types of electronic assemblies. Through the application of high-density integration HDI technology, can promote the

allflex pcb

AllFlex PCB Design and Applications

Allflex PCB, also known as Flexible Printed Circuit Board (FPC), is a type of circuit board that can be completely bent. Folded or curled circuit board. It consists of one or more layers of polyimide film as a substrate, covered with a copper foil layer and a cover film, and the circuit pattern is formed

bending radius

Flexible PCB Bending Radius Consideration

What is the bend radius of a flexible circuit board? The bending radius of a Flexible Printed Circuit Board (FPC) refers to the fact that when the FPC is bent, the two sides of its centre line are subjected to different types of stress, pressure on the inside and tension on the outside. The magnitude

hdi circuit board

HDI circuit board technology and material challenges

The stacked construction technique of HDI circuit boards allows multiple circuit layers to be interconnected by means of precisely tuned blind and buried vias, which are significantly smaller in diameter than the through-holes found in conventional PCBs. This fine interconnect mechanism not only reduces board size, but also significantly increases routing density, allowing more electronic

elic pcb

High technology and cost for ELIC PCB

ELIC PCB is one of the HDI products, the full name is every layer interconnection, is the highest end of the HDI products. ELIC boards are commonly stacked for 8 to 14 layers. Any layer interconnection (ALIVH) technology, as the name suggests, is a multi-layer printed circuit board (PCB) can be achieved in any two

circuit board labels

Cirucit board labels and Labelled circuit boards

Circuit board labels are the PCB (Printed Circuit Board, Printed Circuit Board) technology based on the manufacture of high-frequency RFID tags. PCB tags can be divided into a variety of types according to power, size, frequency and other factors, according to the frequency distinction between ultra-high-frequency PCB anti-metal tags, high-frequency PCB anti-metal tags and so

pcb layout rules

PCB layout rules and guidance

When designing a printed circuit board (PCB), following basic pcb layout rules is essential to ensure the functionality and performance of the circuit. The basic rules of PCB layout:1.According to the layout strategy of ‘major priority, complexity first’, i.e., the key unit circuits and core components should be arranged first.2.In the layout process, should refer

pcb edge plating

PCB Edge Plating Technology

PCB side plating, also known as pcb edge plating, is a copper plating that is applied from the top to the bottom surface of the board and along (at least) one of the peripheral edges. PCB edge plating is the process of allowing a metallised layer to extend up to the edge of the board

circuit card assembly testing

Importance of circuit card assembly testing

In the production process of electronic products, circuit card assembly testing is a crucial step, which is directly related to the performance and reliability of the product. Circuit card, as a carrier connecting various electronic components, the quality of its assembly directly affects the function of the whole system to achieve. Therefore, a reasonable assembly

custom pcb cost per unit

Custom pcb cost per unit impact factors

In modern electronic equipment manufacturing, the cost of printed circuit boards (PCBs) represents a significant portion of the total product cost. The custom pcb cost per unit fluctuates due to diverse market demands and technological developments. This article will analyse in detail the main factors affecting the custom pcb cost per unit. 1.Material CostThe material

circuit card assembly

Circuit Card Assembly Manufacturing Process

Circuit card assembly (CCA) is thin, flat board of dielectric material with conductive paths or tracks etched on their surface. In order to automate the production of CCAs, surface mount technology (SMT) and through-hole assembly machines are often used. Those responsible for the layout design and assembly of this form of manufacturing must have extensive

insulate metal substrate

Insulate Metal Substrate Design and Manufacturing

Insulate Metal Substrate, as a type of computer motherboard, aims to improve thermal efficiency and mechanical strength by applying metallisation to a thick substrate. It is also known as aluminium substrate, aluminium cladding or metal clad PCB (MC PCB), and even thermally conductive PCB (in fact, all PCBs are thermally conductive). Compared to the regular

insulate metal substrate

Innovative applications for insulate metal substrate

Insulate metal substrates are made using a unique insulating material that presses the copper foil of the circuit board to the metal substrate. The metal substrate is specially treated to increase adhesion and resilience, which allows the board to withstand the mechanical and thermal stresses of many applications. The insulating material is a special blend