Electronic manufacturer

Photoresist, also known as photo-resistive material, refers to an etch-resistant thin-film material whose solubility changes upon exposure to ultraviolet light, electron beams, ion beams, X-rays, or other forms of radiation. Photoresist comprises photosensitive resin, photoinitiators, solvents and additives: photoinitiators, also known as photopolymerisation materials (primarily including UV coatings, UV inks, UV adhesives, etc.), are materials

PCB jumper refers to spaces reserved on a printed circuit board for connecting circuits, achieved by adding conductive wires and connectors. They serve a broad purpose in circuit design, effectively resolving layout and routing challenges. Jumpers serve as ‘circuit shortcuts’ in PCB design, achieved through thickened conductors or special connection methods, specifically addressing the following

The surface treatment process of PCB circuit boards is crucial to their performance and environmental credentials. Among these, the tin-plating process is widely favoured for its cost-effectiveness and solderability. Tin-plating can be categorised into leaded and lead-free variants based on lead content, exhibiting significant differences in composition, soldering characteristics, environmental requirements, and application scenarios. What

What are leaded and leadfree processes? Leaded solder typically consists primarily of tin-lead (Sn-Pb) alloys, such as the classic Sn63/Pb37 (63% tin, 37% lead), which has a low melting point (approximately 183°C), stable soldering properties, and a mature process. Lead-free solder, conversely, primarily utilises alloys such as tin-silver-copper (e.g., SAC305) or tin-copper (Sn-Cu), which are

The encapsulation process, also known as the packaging process, involves the secure enclosure of semiconductor chips using specific materials. This provides effective defence against environmental degradation, ensuring stable chip operation. Beyond delivering crucial physical protection, the process is designed from the outset to fully account for the inherent characteristics of chips – namely their lightweight,

As electronic products demand increasingly diverse functionalities, pcb board structures have grown ever more complex. Constrained by spatial limitations, PCB circuit boards have progressively “evolved” from single-layer to double-layer and ultimately multi-layer designs. What, then, distinguishes the manufacturing processes of multi-layer PCB boards from those of double-layer PCBs? A multilayer pcb board is a type

Ionic cleanliness testing serves as a critical quality control measure for evaluating ionic contaminant levels on pcb boards surfaces. Its primary objective is to prevent electrical faults such as short circuits and corrosion caused by ionic residues, thereby enhancing the reliability of electronic products. Employing techniques such as chemical extraction and conductivity measurement, this test

FR1 pcb is constructed from glass fiber-reinforced epoxy resin laminates. FR1 PCBs are rigid, flat materials composed of thin copper layers on a non-conductive phenolic resin substrate. FR1, fully known as Flame Retardant 1, is a PC film with high insulation and flame-retardant properties. This material not only exhibits excellent flame resistance but also possesses

In electronic manufacturing, circuit boards must be divided into distinct sections to meet the design requirements of various electronic products. Traditional mechanical cutting and punching techniques struggle to satisfy modern production standards. The advent of PCB laser depaneling machines has made this process efficient and precise, not only boosting production efficiency but also ensuring the

OSP (Organic Solderability Preservative) is a surface treatment process for PCBs (Printed Circuit Boards). It involves coating the copper foil surface with an extremely thin organic protective film (approximately 0.2-0.5μm thick) to prevent copper oxidation and maintain solderability. During soldering, high temperatures cause the protective film to decompose, exposing the copper surface to bond with

What does FPC stand for? FPC stands for Flexible Printed Circuit, known in Chinese as a flexible printed circuit board, commonly abbreviated as a flexible board. FPC is a highly reliable, exceptionally flexible printed circuit board manufactured using polyimide or polyester film as the substrate material, also referred to as a flexible circuit board or

Component spacing design on PCBA represents a pivotal aspect of electronic product development, where precision directly influences circuit electrical performance, thermal efficiency, manufacturing feasibility, and the stable operation of the final product. Component spacing is not merely a matter of spatial allocation, but rather an art form that comprehensively considers electrical safety, thermodynamics, signal integrity,

LED lighting products’ efficiency, energy-saving properties and extended lifespan have driven their increasing market prevalence. At the core of these products, LED light pcb design is pivotal in ensuring luminaire performance, thermal management and reliability. This article delves into each stage of the LED PCB design process to assist you in creating an outstanding LED

In electronic manufacturing, PCB board quality forms the cornerstone for ensuring device performance and reliability. However, within complex production processes, multiple factors may induce various defects in PCBA, thereby compromising the final product’s functionality. This article delves into four prevalent defect categories in PCBA manufacturing: delamination, plated-through-hole copper fractures, pcb board warping and buckling, and

PCB chamfering, simply put, involves bevelling the edges of printed circuit boards. This process is typically carried out after the boards have been cut, using specialised chamfering machinery or hand tools to transform the board’s right-angled edges into bevelled surfaces at a specific angle. This treatment not only enhances the aesthetic appearance of the circuit

The definition of PCBA contaminants refers to any surface deposits, impurities, inclusions, or adsorbed substances that reduce the chemical, physical, or electrical performance of the PCBA to an unacceptable level. The main aspects include the following: Classification of PCBA Contaminants Typical PCBA cleaning processes Solvent Cleaning Semi-Aqueous Solutions Water-based cleaning PCB ion cleanliness testing methods

UPS PCB, short for uninterruptible power supply printed circuit board, is the core control board of the UPS system. It is primarily responsible for providing emergency power to equipment when the main power supply is interrupted. UPS PCBClassification ⑴ Offline Square Wave Output UPS Power Supply: Its single-unit output power is approximately 400–2000 VA. When

After the PCB circuitry is etched, a layer of ink (green ink, blue ink, black ink, etc.) needs to be applied. However, ink is liquid and has flowability. During the curing process after application, uneven ink distribution may occur, primarily around drill holes. In such cases, certain areas may appear under a magnifying glass to

In today’s highly integrated electronic product era, circuit boards serve as core components, and pcb manufacturing costs directly impact the market competitiveness of the final product. Accurately understanding the composition of PCB expenses, mastering their calculation methods, and effectively implementing cost optimisation strategies are key to manufacturers and design engineers maintaining a competitive edge in

What is a presensitized PCB board?A presensitized pcb board is a special type of printed circuit board with a photosensitive surface. It supports photolithography technology and can be adjusted using ultraviolet light. Despite common misconceptions, presensitized PCBs are similar to standard copper-clad PCBs, but essentially involve transferring graphics onto the board. Presensitized printed circuit boards

PCB board serves as the core components of electronic products, and their quality directly impacts the performance and reliability of the final product. With the rapid advancement of electronic technology, PCB design has become increasingly complex, with higher density and integration levels. This has led to higher demands on PCB inspection, rendering traditional inspection methods