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Transparent flexible PCBs, possessing both flexibility and light transmission properties, hold immense application potential across multiple fields. Their design necessitates balancing material performance with routing strategies. This article systematically outlines core design considerations from two perspectives: material selection and routing optimisation. Common Materials for Transparent Flexible PCBsSubstratesPolyimide (PI): High-temperature resistance (400°C transient), high tear strength […]

AI servers, as the pivotal infrastructure for computational power, face unprecedented challenges in their hardware design and manufacturing processes. High layer PCBs and flip-chip ball grid array (FC-BGA) carrier boards, serving as core components of AI servers, play a decisive role in system performance, reliability, and integration. However, the manufacturing of these two components involves

In the ongoing advancement of artificial intelligence technology, the development trajectory of chips—as the critical hardware foundation—has drawn significant attention. Traditional chips and AI chips exhibit distinct characteristics when addressing different computational tasks. Designed to meet the specific demands of artificial intelligence, AI chips differ markedly from traditional chips in terms of performance, design, and

AI server PCBs are high-performance boards specifically engineered to meet the demanding requirements of artificial intelligence and machine learning workloads. Serving as the server’s central nervous system, they interconnect critical components such as GPUs, CPUs, high-bandwidth memory (HBM), and high-speed network interfaces, facilitating the massive data exchange essential for complex computations. Unlike standard server PCBs,

PCB impedance control technology for optical modules pcb is central to ensuring signal integrity in high-speed optical communication modules. Its key lies in precisely controlling the physical parameters of transmission lines on printed circuit boards (such as line width and dielectric thickness) through meticulous design and manufacturing processes, enabling precise impedance matching with system requirements

In the era of rapid advancement in artificial intelligence technology, AI servers are playing an increasingly pivotal role as the core infrastructure underpinning its operations. As the “nerve centre” of AI servers, the design and performance of PCBs (printed circuit boards) directly determine the overall efficiency and stability of the servers. However, AI server PCB

AI server PCBs form the physical foundation and neural hub of artificial intelligence servers. They host and interconnect processors, high-bandwidth memory (HBM), high-speed network interfaces, and power supply systems, providing reliable, high-speed, low-latency signal and power transmission pathways for massive parallel computing. In today’s era of large-scale model training and inference, the complexity, manufacturing difficulty,

In the ongoing evolution of optical module technology, PCB circuit boards face immense pressures across multiple dimensions—signalling, spatial constraints, thermal management—which continuously challenge their performance in material selection, process precision, and design logic. Specifically, core challenges manifest in the following four critical areas: (1) The Integrity Dilemma of High-Speed Signal TransmissionAs signal rates increase exponentially—soaring

In the present era of rapid and unprecedented advancements in artificial intelligence technology, AI servers have emerged as the pivotal infrastructure underpinning computational power, their significance growing ever more pronounced. High layer PCBs and flip-chip ball grid array (FC-BGA) substrates, serving as critical components within AI server PCBs, function akin to the heart and neural

As a core component in optical communications, the stability and reliability of optical modules are paramount. The optical modules pcb design not only determines their electrical performance but also plays a decisive role in thermal management, signal protection, and manufacturability. In the evolution of optical modules, PCBs predominantly adopt HDI structures—whether mechanical blind-via HDI, laser

The drone antenna is a multifunctional component that facilitates video transmission, remote control, GPS reception, data transfer, FPV experience, signal range extension, and signal quality enhancement. Its importance in ensuring the drone’s smooth operation and functionality cannot be overstated. How the Drone Antenna FunctionsThe drone antenna essentially receives and transmits electromagnetic waves, acting as the

In single-sided board designs, only one side features copper foil traces (i.e., the solder side), with electronic components placed exclusively on the opposite side (i.e., the component side). In double-sided and multilayer boards, both sides contain copper foil traces and can accommodate surface-mount devices (SMDs). Here, the ‘component side’ typically denotes the side housing the

In the field of pcb board manufacturing, the precision and stability of processes directly impact product quality and performance. From substrate pre-treatment to the lamination and forming of multilayer boards, through to the fabrication of special structures such as step grooves and the control of board warpage, each stage involves intricate technical considerations and rigorous

PCB blistering refers to localised swelling or bulging occurring within or on the surface of printed circuit boards (PCBs) during production or use. This phenomenon typically manifests as separation between the substrate and copper foil, solder mask, or other layers, forming bubbles or voids. Causes of PCB BlisteringSubstrate Processing IssuesParticularly concerning thinner substrates (generally below

PCB blue glue is a blue viscous adhesive classified as a peelable solder resist material. Applied to PCB surfaces via screen printing or foil printing, it cures to form a protective film that effectively isolates non-target areas during processes like soldering and electroplating. This prevents solder, chemicals, and other substances from adhering, thereby safeguarding pads,

A breadboard is a reusable platform for building and testing electronic circuits without soldering. It consists of a grid of interconnected holes that allow for quick insertion and rearrangement of components and wires. Breadboards are ideal for preliminary circuit design and experimentation because they enable easy modification and troubleshooting. Basic Steps for Using a BreadboardTo

Within the physical infrastructure of electronic circuits, PCB circuit boards and FPCBs (flexible printed circuit boards) stand as the two core types supporting electronic components. Leveraging their distinct material properties and functional advantages, they span applications from traditional industrial equipment to cutting-edge consumer electronics. PCBs provide stable support through rigid structures, while FPCBs achieve breakthroughs

What is a flexible LED PCB? A flexible LED PCB is a circuit board that can be bent and twisted without damage. Its flexibility stems from the use of flexible plastic substrates such as polyimide, replacing the rigid fibreglass employed in traditional PCBs. This pliability makes it an ideal choice for applications with limited space