Anylayer HDI, as one of the most advanced processes in PCB manufacturing, enables interconnections between any layers within the board via laser blind vias, thereby achieving ultra-high routing density. The core of this process lies in the repeated execution of ‘Stacked Via’ and ‘Filled Via’ operations. Consequently, compared to conventional second-level HDI, its production complexity […]
uHDI PCBs (ultra High-Density Interconnect PCB) represent a further advancement of high-density interconnect printed circuit boards (HDI PCBs). As electronic products evolve towards miniaturisation, slimness, and enhanced performance, uHDI PCBs have become a crucial foundation for next-generation electronics—particularly in smartphones, wearable devices, and high-performance computing—due to their superior routing density, smaller aperture sizes, and narrower
Optoelectronic circuit boards integrate circuits and optical components into a single unit, yet manufacturing such PCBs using existing processes presents significant challenges. 3D (additive) printing technology offers a novel approach for producing these boards, enabling smaller, lighter, and more intricate designs compared to traditional PCB fabrication methods, whilst consuming less power and generating lower pollution.
3D printed pcb boards are spearheading a disruptive transformation in manufacturing processes. Unlike traditional fabrication methods—which commence with copper-clad laminates and progressively remove excess material through subtractive techniques such as chemical etching—3D printing employs an additive approach, building circuits layer by layer from scratch. This shift not only reconfigures PCB production logic but also signifies
The layer of paint on the PCB surface is called solder resist ink, also known as PCB solder mask ink. Solder mask ink is the most common and primary ink used in PCB circuit boards. Typically, 90% of solder resist ink is green, though other colors exist, such as red, blue, black, white, and yellow,
In the production of HDI boards, solder mask bridges within BGA areas and between fine-pitch pads serve as crucial micro-isolation barriers despite their minute dimensions. Measuring merely 0.1–0.2mm in width, they must separate adjacent pads to prevent soldering short circuits. However, following selective OSP treatment, solder mask bridges frequently exhibit cracking, detachment, or erosion, leading
Smartphones predominantly utilise black PCB, not for electrical performance considerations, but as a strategic decision driven by aesthetic appeal, advanced manufacturing processes, and brand positioning. Given the highly compact internal structures of modern smartphones, the significance of PCB colour extends far beyond mere aesthetic enhancement. Whilst green PCBs remain predominant across broader electronics applications, smartphone
The IPC-A-600G standard, entitled Acceptability of Printed Circuit Boards, stands as the most comprehensive and visually detailed guide to PCB quality assessment within the electronics industry. Meticulously developed by the Association for the Electronics Industry (IPC), it serves as an indispensable reference for manufacturers, inspectors, and engineers throughout PCB production and procurement processes. As the
Transparent flexible PCBs, possessing both flexibility and light transmission properties, hold immense application potential across multiple fields. Their design necessitates balancing material performance with routing strategies. This article systematically outlines core design considerations from two perspectives: material selection and routing optimisation. Common Materials for Transparent Flexible PCBsSubstratesPolyimide (PI): High-temperature resistance (400°C transient), high tear strength
AI servers, as the pivotal infrastructure for computational power, face unprecedented challenges in their hardware design and manufacturing processes. High layer PCBs and flip-chip ball grid array (FC-BGA) carrier boards, serving as core components of AI servers, play a decisive role in system performance, reliability, and integration. However, the manufacturing of these two components involves
In the ongoing advancement of artificial intelligence technology, the development trajectory of chips—as the critical hardware foundation—has drawn significant attention. Traditional chips and AI chips exhibit distinct characteristics when addressing different computational tasks. Designed to meet the specific demands of artificial intelligence, AI chips differ markedly from traditional chips in terms of performance, design, and
AI server PCBs are high-performance boards specifically engineered to meet the demanding requirements of artificial intelligence and machine learning workloads. Serving as the server’s central nervous system, they interconnect critical components such as GPUs, CPUs, high-bandwidth memory (HBM), and high-speed network interfaces, facilitating the massive data exchange essential for complex computations. Unlike standard server PCBs,
PCB impedance control technology for optical modules pcb is central to ensuring signal integrity in high-speed optical communication modules. Its key lies in precisely controlling the physical parameters of transmission lines on printed circuit boards (such as line width and dielectric thickness) through meticulous design and manufacturing processes, enabling precise impedance matching with system requirements
In the era of rapid advancement in artificial intelligence technology, AI servers are playing an increasingly pivotal role as the core infrastructure underpinning its operations. As the “nerve centre” of AI servers, the design and performance of PCBs (printed circuit boards) directly determine the overall efficiency and stability of the servers. However, AI server PCB
AI server PCBs form the physical foundation and neural hub of artificial intelligence servers. They host and interconnect processors, high-bandwidth memory (HBM), high-speed network interfaces, and power supply systems, providing reliable, high-speed, low-latency signal and power transmission pathways for massive parallel computing. In today’s era of large-scale model training and inference, the complexity, manufacturing difficulty,
The optical module PCBA manufacturing process involves assembling optoelectronic devices and electronic components onto printed circuit boards. Through a series of processing steps, this manufacturing technique enables the conversion and transmission of optical signals into electrical signals. In optical module PCBA production, the surface mount technology (SMT) process demands exceptionally high placement accuracy. For components
In this era swept by the digital tide, the importance of data centres and communication networks as pivotal hubs for information flow is self-evident. High-frequency optical module pcbs (800G and above), akin to crucial “neurons” within these hubs, shoulder the responsibility of high-speed data transmission, serving as core components that ensure the efficient operation of
In the ongoing evolution of optical module technology, PCB circuit boards face immense pressures across multiple dimensions—signalling, spatial constraints, thermal management—which continuously challenge their performance in material selection, process precision, and design logic. Specifically, core challenges manifest in the following four critical areas: (1) The Integrity Dilemma of High-Speed Signal TransmissionAs signal rates increase exponentially—soaring
In the present era of rapid and unprecedented advancements in artificial intelligence technology, AI servers have emerged as the pivotal infrastructure underpinning computational power, their significance growing ever more pronounced. High layer PCBs and flip-chip ball grid array (FC-BGA) substrates, serving as critical components within AI server PCBs, function akin to the heart and neural
As a core component in optical communications, the stability and reliability of optical modules are paramount. The optical modules pcb design not only determines their electrical performance but also plays a decisive role in thermal management, signal protection, and manufacturability. In the evolution of optical modules, PCBs predominantly adopt HDI structures—whether mechanical blind-via HDI, laser
Drone antennas, in essence, are devices mounted on unmanned aerial vehicles for receiving and transmitting radio waves. They serve as the bridge enabling communication between the drone and the external environment, ensuring the precise transmission of flight commands and the real-time return of flight data. Depending on the application scenario, drone antennas can be categorised
AI server PCBs serve as the core electronic components within artificial intelligence servers, connecting and supporting critical elements such as processors, memory, accelerators, and power management systems. They enable high-speed signal transmission, high-power-density power delivery, and efficient thermal management to meet the demands of AI computing for large-scale data processing and high-speed operations. Amidst the
The optical module PCB serves as a pivotal component for achieving electro-optical conversion, playing a crucial role within communication systems. It facilitates the transformation of electrical signals into optical signals, or vice versa, thereby ensuring efficient, long-distance data transmission through optical fibres. When designing optical module PCBs, multiple factors must be thoroughly considered, including signal
The drone antenna is a multifunctional component that facilitates video transmission, remote control, GPS reception, data transfer, FPV experience, signal range extension, and signal quality enhancement. Its importance in ensuring the drone’s smooth operation and functionality cannot be overstated. How the Drone Antenna FunctionsThe drone antenna essentially receives and transmits electromagnetic waves, acting as the
