A breadboard is a reusable platform for building and testing electronic circuits without soldering. It consists of a grid of interconnected holes that allow for quick insertion and rearrangement of components and wires. Breadboards are ideal for preliminary circuit design and experimentation because they enable easy modification and troubleshooting. Basic Steps for Using a BreadboardTo […]
Within the physical infrastructure of electronic circuits, PCB circuit boards and FPCBs (flexible printed circuit boards) stand as the two core types supporting electronic components. Leveraging their distinct material properties and functional advantages, they span applications from traditional industrial equipment to cutting-edge consumer electronics. PCBs provide stable support through rigid structures, while FPCBs achieve breakthroughs
What is a flexible LED PCB? A flexible LED PCB is a circuit board that can be bent and twisted without damage. Its flexibility stems from the use of flexible plastic substrates such as polyimide, replacing the rigid fibreglass employed in traditional PCBs. This pliability makes it an ideal choice for applications with limited space
In modern wireless communication systems, antennas serve as the “bridge” connecting electromagnetic waves with electronic devices, their performance directly determining signal transmission efficiency and stability. With technological evolution, ceramic antennas have gradually become core components in high-frequency communications and satellite navigation, leveraging dual advantages in materials science and process innovation. Meanwhile, traditional metal antennas continue
Ceramic antennas are not conventional ‘ceramic products’ but rather miniature antennas formed by integrating metal conductors (such as silver or copper) with ceramic dielectric materials through precision manufacturing processes. Their core principle leverages the propagation characteristics of electromagnetic waves within ceramic media: ceramic materials possess high dielectric constants and low loss properties, enabling significant reduction
Onboard antennas are built directly into the vehicle’s electronics system. Unlike traditional external antennas that protrude from the vehicle, onboard antennas are seamlessly integrated within the vehicle’s design. This integration not only enhances the vehicle’s aesthetics but also improves its functionality. Types of Onboard AntennasPCB Antennas: These are compact antennas printed directly onto a circuit
Onboard antenna refer to antennas directly integrated onto a printed circuit board (PCB). Compared to traditional external antennas, they offer advantages such as compact size, low cost, and manufacturing flexibility. The operating principle of onboard antenna involves designing and routing conductive traces or metal lines on the PCB to enable wireless signal transmission and reception.
Ceramic circuit boards utilise ceramic as the substrate material, upon which metallic circuits are constructed and conductive vias formed. Ceramics encompass a diverse range of materials, with commonly employed types including aluminium oxide, aluminium nitride, zirconium oxide, silicon carbide, and silicon nitride – all classified as inorganic non-metallic materials. The fabrication of ceramic discs or
An 8-layer pcb features one circuit layer on each of the top and bottom surfaces, with six intermediate ground and power planes. This structure enhances the board’s stability and reliability while significantly reducing electromagnetic noise and interference. In practical applications, 8-layer pcbs are primarily employed for high-speed signal transmission and complex circuit designs. An 8-layer
The PCB laminate structure primarily comprises three key base materials: copper foil, prepreg (semi-cured sheet), and core board (also known as substrate). Taking a common 8-layer PCB laminate structure as an example, the uppermost layer is the surface copper foil, followed sequentially by prepreg, core, with prepreg and core alternately stacked, and the bottom layer
Within the field of electronic components, ceramic capacitors occupy a significant position, with multilayer ceramic capacitor (MLCC) and single-layer ceramic capacitors (SLCC) being two common and widely applied types. Although both fall under the category of ceramic capacitors, they exhibit numerous significant differences in structure, performance, manufacturing processes, and material selection. MLCC and SLCC are
Multilayer ceramic capacitor (MLCC) is constructed by stacking extremely thin ceramic dielectric layers with electrodes (typically nickel) printed upon them in an offset arrangement. Composition of multilayer ceramic capacitor:Ceramic dielectric: Under an electric field, polarised dielectric materials store energy. Their polarisation constant changes with variations in the electric field. Different dielectric types exhibit varying response
High-layer printed circuit boards typically refer to boards exceeding four layers. Compared to traditional double-layer boards, they enable more complex circuit designs by embedding multiple conductive layers internally. For instance, an eight-layer board may comprise four signal layers, two power layers, and two ground layers. These layers are separated by insulating materials (such as prepreg)
In electronic manufacturing, flexible printed circuits are widely utilised, with HASL being a common PCB surface finishing process. So, is HASL suitable for flexible circuit boards? HASL, standing for Hot Air Solder Leveling, is an extremely prevalent surface treatment technology within the PCB (printed circuit board) sector. Its core function lies in establishing a uniform
The copper layer on a circuit board serves as a conductive foil, primarily functioning to interconnect electronic components. These components are typically connected to one another or to power circuits via this copper layer, facilitating current and signal transmission throughout the circuit. On the board, the solder joints of component pins connect to other pins
During PCB circuit boards manufacturing, copper peeling represents a relatively common issue that significantly impacts product quality. This phenomenon refers to the separation of copper foil from the substrate on a printed circuit board, potentially causing faults such as open circuits and interrupted signal transmission. Consequently, it compromises the performance and reliability of the entire
The flexural durability of FPC (Flexible Printed Circuit) is a critical metric for assessing its ability to maintain circuit integrity and electrical conductivity under repeated bending, folding, and mechanical motion. Flexural durability refers to the FPC’s capacity to withstand environmental stresses such as winding, bending, folding, or repetitive motion without circuit breakage, cracking, or significant
The PCBA assembly and soldering process for FPCs differs significantly from that of rigid circuit boards. Due to their insufficient rigidity and flexibility, FPCs cannot be secured or transported without specialized carrier boards, rendering essential SMT processes like printing, component placement, and reflow soldering impossible. PC Pre-TreatmentFPC boards are flexible and typically not vacuum-sealed upon
Integrated circuit boards, also known as printed circuit boards (PCBs), are indispensable components in modern electronic equipment. They secure electronic components onto an insulating substrate via surface mounting or through-hole insertion, connecting each component through conductive pathways to realise circuit functionality. The operating principle of integrated circuit boards involves connecting power supply voltages, signal currents,
Printed circuit boards, serving as the carrier platform for electronic components and also known as PCBs, are extensively utilised in various electronic devices. Conductive pathways and electronic components are arranged upon the board substrate to facilitate interconnection and control functions between circuits. Integrated circuit chips, as the core components of modern electronic technology, integrate circuit
The design of flexible printed circuits (FPC) is a complex and intricate process that requires consideration not only of the flexibility demands of the application scenario but also of multiple technical factors to ensure product reliability and manufacturing feasibility. This guide aims to detail the key considerations in flexible board design and provide effective strategies
Flexible printed circuits, with their exceptional flexibility and lightweight, slim form factor, seamlessly integrate into the intricate internal structures of various precision electronic devices. They have become a pivotal element driving the advancement of electronic equipment towards multifunctional integration and extreme miniaturisation. Within the structural framework of flexible printed circuits, copper foil occupies a pivotal
Among the numerous components of flexible circuits, flexible films serve as the core substrate, playing a decisive role in determining the performance of the entire circuit. Flexible circuits, also known as Flexible Printed Circuits (FPC), have emerged as a pivotal technology in meeting the evolving demands of electronic devices. This is due to their ability
The surface mount technology (SMT) process for flexible printed circuit board (FPC) differs significantly from conventional rigid PCB SMT solutions. The key to successful FPC SMT lies in precise positioning. Due to the flexible nature and insufficient rigidity of FPC substrates, specialised carrier boards are essential for securing and handling the boards during fundamental SMT
