As an upgraded next-generation PCB interconnect technology, UHDI has comprehensively surpassed the process and performance limits of traditional HDI boards, precisely meeting the evolving demands of today’s high-speed electronics industry. The rapid deployment of 5G and 6G communications, the Internet of Things (IoT), High-Performance Computing (HPC), Artificial Intelligence, and high-end medical electronics is driving electronic […]
What is a glass substrate? Why has it become the core material for advanced packaging in the post-Moore’s Law era? Today, as the computing power of AI chips continues to rise and the number of transistors reaches the trillion-unit mark, traditional organic packaging substrates are approaching their physical limits in terms of transmission speed, wiring
In the AI computing hardware ecosystem, PCB boards serve as the cornerstone connecting chips to clusters. Whether it’s training large models with hundreds of billions of parameters or performing millisecond-level edge inference, these precision circuit boards are indispensable. The following is an overview of the main types of AI PCB boards in this field: Core
Optical modules are the core interconnection units in computing infrastructure such as data centres and 5G communications. As optical module speeds rapidly evolve from 100G to 400G, 800G and even 1.6T, the PCB boards that house their circuit and optoelectronic core components are undergoing a comprehensive technological overhaul. Today, PCB boards have long transcended their
High Frequency, high speed copper clad laminates (referred to as High Frequency copper clad laminates) are core PCB substrate materials designed for High Frequency signal transmission applications. The core manufacturing principle involves bonding a copper foil layer to the surface of an insulating substrate, thereby enabling the smooth and efficient conduction of electromagnetic waves. The
RF cable assembly is essential fundamental transmission components in RF and microwave systems. Their primary function is to enable low-loss, highly stable transmission of RF signals between different devices and modules. They are widely used in fields such as communication base stations, radar systems, satellite navigation, precision test equipment and wireless terminals. The complete assembly
With the rapid evolution of 5G/6G communications, optoelectronic displays, high-end microelectronics and aerospace technology, traditional PCB substrates are no longer able to meet the stringent requirements of high-end equipment, such as high-temperature resistance, high-frequency stability, optical transparency and high dimensional accuracy. Thanks to their unique physical, chemical and optical properties, glass substrates have become the
In the wireless communications industry, RF test cables are a core consumable in high-precision test systems, primarily used to connect test instruments to the device under test (DUT) to ensure high-fidelity signal transmission and measurement. Within the overall test architecture, the DUT is positioned between the signal generator and the signal analyser, whilst test accessories
PCB circuit boards can be categorised by structure into single-sided, double-sided and multilayer boards. Among these, the design of multilayer boards offers a high degree of flexibility, with no strict upper limit on the number of layers. Currently, high-end precision PCBs can exceed 100 layers and are widely used in high-end servers, aerospace and high-end
HDI PCB (High-Density Interconnect printed circuit boards) and conventional multilayer printed circuit boards are two types of PCB products in the electronics manufacturing sector that differ significantly in terms of application scenarios and technical standards. As electronic devices rapidly evolve towards miniaturisation, slimness, high performance and high integration, the limitations of traditional multilayer PCB manufacturing
Thanks to their superior physical properties and advantages in large-scale mass production, glass substrates have emerged as the key alternative solution in the advanced packaging sector for next-generation high-bandwidth, high-computing-power AI chips. As high-end AI chip processes continue to evolve, with increasing chip sizes and significantly higher integration levels, the physical limitations and process bottlenecks
The PCBA manufacturing process encompasses several core stages, including substrate pre-treatment, solder paste printing, component placement, reflow soldering, through-hole insertion, wave soldering, functional testing and final product inspection.The appropriate production processes vary significantly depending on the specifications and structure of the PCB;manufacturers select the appropriate manufacturing processes based on the PCB design, component types and
As the core component responsible for computing power transmission, signal exchange and power distribution within AI server PCB, high-layer-count, high-performance PCBs directly determine model training efficiency, system stability and data transmission limits. Among these, high-end PCBs featuring a 44-layer ultra-high-density architecture and utilising M9 ultra-low-loss speciality substrate have become the standard core hardware for the
Multilayer microwave circuit boards are specialised printed circuit boards designed for high-frequency applications. Through a composite structure of multiple layers of insulating substrate and conductive copper foil, they enable the efficient transmission of electromagnetic waves and functional integration. Their core lies in the use of microwave transmission structures such as microstrip lines and striplines to
As the functionality of electronic products continues to evolve, the number of components mounted on PCBs is constantly increasing, component pin pitches are becoming increasingly fine, and circuit design is gradually shifting from conventional wide-pitch surface-mount technology to ultra-fine-pitch BGA layouts. Thanks to their high-density integration, excellent electrical performance and thermal management advantages, BGA (Ball
As a core foundational material in the high-end chip packaging process, the classification of IC substrates essentially follows a tiered matching principle of ‘material properties → structural form → application requirements’. Different types of IC substrates exhibit significant differences in key aspects such as wiring density, temperature resistance and production costs; these differences directly determine
In the field of RF and microwave electronics, the performance of substrate materials directly determines the potential for circuit miniaturisation, signal integrity and environmental adaptability. Thanks to its outstanding comprehensive properties, aluminium oxide ceramic substrate has become one of the most widely used core substrate materials in this field. Its high dielectric constant facilitates circuit
Following surface-mount soldering (reflow soldering), BGA devices typically undergo several post-process steps to enhance their environmental adaptability, mechanical strength and reliability. In accordance with industry practice, these primarily comprise three types of processes: conformal coating, underfill and adhesive reinforcement, and PCB depanelling. The technical requirements and key implementation points for these processes are outlined below.
What is reflow soldering? Reflow soldering is a core soldering process in surface-mount technology (SMT), used to establish a mechanical connection and electrical continuity between the terminals or leads of surface-mount devices (SMDs) and the pads on a printed circuit board (PCB); it is a type of soft soldering. The basic principle involves remelting the
In the printed circuit board industry, the OSP process is widely used. Thanks to its outstanding advantages—including low cost, a simple manufacturing process and excellent solder joint reliability—it has become the preferred process for many PCB manufacturers. OSP, or Organic Solderable Protective Coating, involves the chemical deposition of a thin organic protective film onto the
Semiconductor packaging and testing (commonly referred to as ‘packaging and testing’) is a critical final stage in the chip manufacturing supply chain. It involves the post-processing that follows wafer fabrication, protecting the chip’s core circuitry through packaging and establishing electrical interconnections. Through multi-dimensional testing, it screens for good products and verifies performance stability. As such,
Aluminum PCBs (Aluminum substrates) are a core product within the category of high-performance metal-clad copper-clad laminates (MCPCBs). Their most notable advantage lies in their exceptional thermal conductivity, which is the key distinction from standard PCBs and makes them widely used in high-power applications. Compared to copper-based PCBs, while the thermal conductivity of pure aluminum (approximately
With the continuous advancement of communication technologies and the shift towards intelligent automotive electronics, market demand for high-power printed circuit boards and high frequency microwave pcbs continues to rise, becoming a key driver of growth in the printed circuit board industry. Microwave pcbs are manufactured using specialised microwave-grade copper-clad laminates in conjunction with conventional rigid
As electronic products evolve towards higher integration and miniaturisation, Ball Grid Array (BGA) packaging has become an indispensable component type in modern PCB design, thanks to its high-density interconnections and excellent electrical and thermal performance. However, the pad design, routing planning and reliability verification of BGA packaging directly determine the manufacturing yield and long-term stability
