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Multilayer ceramic capacitor (MLCC) is constructed by stacking extremely thin ceramic dielectric layers with electrodes (typically nickel) printed upon them in an offset arrangement. Composition of multilayer ceramic capacitor:Ceramic dielectric: Under an electric field, polarised dielectric materials store energy. Their polarisation constant changes with variations in the electric field. Different dielectric types exhibit varying response […]

High-layer printed circuit boards typically refer to boards exceeding four layers. Compared to traditional double-layer boards, they enable more complex circuit designs by embedding multiple conductive layers internally. For instance, an eight-layer board may comprise four signal layers, two power layers, and two ground layers. These layers are separated by insulating materials (such as prepreg)

In electronic manufacturing, flexible printed circuits are widely utilised, with HASL being a common PCB surface finishing process. So, is HASL suitable for flexible circuit boards? HASL, standing for Hot Air Solder Leveling, is an extremely prevalent surface treatment technology within the PCB (printed circuit board) sector. Its core function lies in establishing a uniform

The copper layer on a circuit board serves as a conductive foil, primarily functioning to interconnect electronic components. These components are typically connected to one another or to power circuits via this copper layer, facilitating current and signal transmission throughout the circuit. On the board, the solder joints of component pins connect to other pins

During PCB circuit boards manufacturing, copper peeling represents a relatively common issue that significantly impacts product quality. This phenomenon refers to the separation of copper foil from the substrate on a printed circuit board, potentially causing faults such as open circuits and interrupted signal transmission. Consequently, it compromises the performance and reliability of the entire

The flexural durability of FPC (Flexible Printed Circuit) is a critical metric for assessing its ability to maintain circuit integrity and electrical conductivity under repeated bending, folding, and mechanical motion. Flexural durability refers to the FPC’s capacity to withstand environmental stresses such as winding, bending, folding, or repetitive motion without circuit breakage, cracking, or significant

The PCBA assembly and soldering process for FPCs differs significantly from that of rigid circuit boards. Due to their insufficient rigidity and flexibility, FPCs cannot be secured or transported without specialized carrier boards, rendering essential SMT processes like printing, component placement, and reflow soldering impossible. PC Pre-TreatmentFPC boards are flexible and typically not vacuum-sealed upon

Integrated circuit boards, also known as printed circuit boards (PCBs), are indispensable components in modern electronic equipment. They secure electronic components onto an insulating substrate via surface mounting or through-hole insertion, connecting each component through conductive pathways to realise circuit functionality. The operating principle of integrated circuit boards involves connecting power supply voltages, signal currents,

Printed circuit boards, serving as the carrier platform for electronic components and also known as PCBs, are extensively utilised in various electronic devices. Conductive pathways and electronic components are arranged upon the board substrate to facilitate interconnection and control functions between circuits. Integrated circuit chips, as the core components of modern electronic technology, integrate circuit

The design of flexible printed circuits (FPC) is a complex and intricate process that requires consideration not only of the flexibility demands of the application scenario but also of multiple technical factors to ensure product reliability and manufacturing feasibility. This guide aims to detail the key considerations in flexible board design and provide effective strategies

Flexible printed circuits, with their exceptional flexibility and lightweight, slim form factor, seamlessly integrate into the intricate internal structures of various precision electronic devices. They have become a pivotal element driving the advancement of electronic equipment towards multifunctional integration and extreme miniaturisation. Within the structural framework of flexible printed circuits, copper foil occupies a pivotal

Among the numerous components of flexible circuits, flexible films serve as the core substrate, playing a decisive role in determining the performance of the entire circuit. Flexible circuits, also known as Flexible Printed Circuits (FPC), have emerged as a pivotal technology in meeting the evolving demands of electronic devices. This is due to their ability

The surface mount technology (SMT) process for flexible printed circuit board (FPC) differs significantly from conventional rigid PCB SMT solutions. The key to successful FPC SMT lies in precise positioning. Due to the flexible nature and insufficient rigidity of FPC substrates, specialised carrier boards are essential for securing and handling the boards during fundamental SMT

The white residue on PCB surfaces primarily originates from substances such as polymerised rosin, unreacted activators, and lead chloride or bromides formed by the reaction between flux and solder. Upon absorbing moisture, these substances expand in volume, with some undergoing hydration reactions with water. This leads to increasingly pronounced white residue that proves extremely difficult

Ceramic pcb, also known as ceramic printed circuit board, is circuit board manufactured using ceramic materials. Compared to conventional fibreglass-reinforced plastic (FR-4) substrates, ceramic PCBs utilise ceramic substrates, offering significant performance advantages. These include superior temperature stability, enhanced mechanical strength, improved dielectric properties, and extended service life. They are primarily employed in high-temperature, high-frequency, and

What is chip packaging? Chip packaging involves securing a bare die onto a specific substrate through a series of intricate processes, such as dicing, cleaning, bonding, wire bonding or flip-chip soldering. The die is then encapsulated using plastic materials (such as epoxy resin) while leads or solder balls are exposed to facilitate connection with external

Integrated Circuits (ICs) are semiconductor microdevices originating in the 1950s. Through precision manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, and aluminium deposition, semiconductor elements, resistors, capacitors, and interconnecting conductors are fully integrated onto a miniature silicon wafer. This forms circuits with specific functions, ultimately resulting in soldered and encapsulated electronic microdevices. Based on product

The PCB lamination process primarily involves stacking multiple layers of copper foil and dielectric materials (typically FR4, polyimide, or other composites) in a specific sequence. Under high temperature and pressure conditions, an adhesive binds these layers together tightly. The resulting multilayer PCB is a robust and fully functional circuit board capable of reliable operation within

The solder mask is an indispensable component in the manufacture of printed circuit boards, serving primarily to shield metallic components on the board from environmental corrosion, particularly oxidation, while effectively preventing unintended electrical short circuits between pads, known as bridging. During soldering processes such as reflow or wave soldering, where precise control of solder placement

As a core material for high-reliability electronic components, the production process of multilayer aluminium substrates integrates precision machining with materials science, with each step directly impacting the product’s electrical performance and mechanical stability. From substrate surface pre-treatment to final packaging, every stage must strictly adhere to process specifications to ensure the multilayer aluminium substrates meet

Low Temperature Co-fired Ceramic (LTCC), as an advanced electronic packaging technology, employs a thick-film material system to co-fire electrode materials, substrates, and electronic components in a single process through a pre-designed structure. This technology, with its high integration and superior performance, has become a key pathway for achieving miniaturisation and multifunctionality in electronic systems. The

As electronic products accelerate towards lighter, slimmer, smaller and higher-density designs, traditional rigid PCBs struggle to meet specific structural and performance demands. Flexible PCB (FPC), however, shine across numerous sectors including mobile phones, cameras, wearables, medical electronics and automotive electronics, owing to their unique ability to bend, fold and stretch. Particularly in critical areas such

Flexible printed circuits (FPC), owing to their pliable nature, have found exceptionally widespread application within the electronics sector, proving particularly well-suited to scenarios where space is at a premium. As electronic devices continue their trajectory towards miniaturisation, the scope of FPC utilisation grows ever broader. In the assembly stages of numerous consumer products, constrained by