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In the field of PCB design and assembly, through hole PCBs remain a core technology—even though surface-mount technology (SMT) now dominates most modern devices. Many engineers still opt for through hole PCBs when designing products that require high mechanical strength, high power handling capacity, or ease of maintenance. In practice, you will find through hole […]

As electronic products continue to evolve towards lighter, thinner designs and higher levels of integration, hardware design is no longer confined to simple two- or four-layer boards. 6 layer PCBs (six-layer printed circuit boards), as a compromise solution that balances performance, size, cost and structural stability in complex circuit designs, have become one of the

Millimetre wave radar is a precision detection device operating in the 30–300 GHz millimetre wave band. Its wave length lies between that of microwaves (1–100 mm) and far-infrared waves (0.75–1 mm), combining characteristics of both. As one of the core sensors in intelligent driving perception systems, millimetre wave radar emits high-frequency millimetre-wave signals and receives

In millimetre wave radar systems, the antenna is the core component that determines system performance; its design and manufacturing process directly influence detection range, angular resolution, sensitivity and interference resistance, and form the foundation for achieving precise sensing and efficient response. From in-vehicle ADAS to industrial IoT and aerospace, the continuous expansion of millimetre wave

In printed circuit board (PCB) design, pcb thickness is a crucial parameter. Currently, 1.6 mm is the most commonly used standard thickness in the vast majority of general-purpose applications, such as consumer electronics and industrial control. However, as electronic products evolve towards miniaturisation, high performance and multifunctionality, PCB thickness must also be selected flexibly according

During the PCB manufacturing process, the darkening of the gold plating layer is a relatively common cosmetic defect. This not only affects the visual appearance of the product but may also indirectly impact its electrical conductivity and resistance to oxidation, resulting in unnecessary production losses. Based on practical production experience, this issue is not caused

High TG laminates refer to materials with a Tg value typically above 170°C; for example, common lead-free compatible laminates can have a Tg of around 185°C. Furthermore, the thermal decomposition temperature (Td) at which these laminates lose 5% of their mass is also higher—taking a standard FR4 laminate from a particular brand as an example,

In the electronic assembly process, the baking of FR4 PCBs may seem unremarkable, but it is in fact a critical step that determines the quality of the solder joints. Its primary purpose is to thoroughly remove any moisture absorbed by the board during storage, transport or whilst in the workshop environment. If moisture remains within

Rolled copper and electrolytic copper are the two main types of copper foil used in high frequency PCBs for lamination with PTFE boards. Due to differences in their manufacturing processes, there are significant variations between the two in terms of lamination strength, high-frequency performance, process compatibility and environmental resistance. Rolled copper is produced through a

Unlike standard PCB substrates, the thermal conductivity of PTFE PCBs is not determined solely by the substrate itself, but rather by the combined effects of substrate properties, filler modification, manufacturing processes and application scenarios. The core challenge in optimising thermal conductivity lies in enhancing thermal efficiency without compromising PTFE’s inherent advantages of low high-frequency loss.

What is a BGA? When dealing with high-density integrated circuits (ICs) – such as microprocessors or complex ASICs – you are likely to encounter ball grid arrays (BGAs). Unlike traditional pin-based packages, this surface-mount technology utilises a full array of solder balls on the underside of the chip, fundamentally resolving the issue of insufficient pin

Unlike standard PCBs, the core of multilayer RF PCB design lies in balancing signal integrity with manufacturability. High-frequency signals are prone to attenuation, reflection and crosstalk during transmission, and the complexity of multi-layer structures further exacerbates these issues. The core value of multilayer RF PCBs lies in utilising three-dimensional routing to overcome the performance limitations

Flexible printed circuit boards (FPCs), with their inherent properties of being bendable, foldable, lightweight, and compact, are ideally suited to the requirements of tight spaces and complex structural assemblies in sectors such as smartphones, wearable devices, automotive electronics, medical instruments and aerospace. They have become an indispensable core interconnect component in modern electronic products. The

The stack up design of a PCB (printed circuit board) directly determines its electrical performance, mechanical reliability, manufacturability and cost. Among these, Through Hole Board and HDI boards are the two main types, and there is a fundamental difference in the underlying logic of their stack up designs—this difference stems from the fundamental differences between

HDI PCB(High Density Interconnect) is a core PCB manufacturing process designed for high-density wiring, characterised primarily by the use of micro-blind vias and buried blind vias to achieve efficient interconnection between different copper layers within the circuit board. As electronic products rapidly evolve towards lighter, thinner and higher-performance designs, market demand for HDI boards continues

In the field of PCB manufacturing, the circuit patterning process is a critical factor in determining the performance and quality of the PCB. Among these, Tenting (subtractive process), SAP (semi-additive process) and mSAP (modified semi-additive process) are three core processes, each with its own unique characteristics and suitable applications. These three processes differ significantly in

High frequency PCBs for military radar serve as the core hardware platform within radar systems, undertaking critical tasks such as signal transmission, power amplification and processing; their performance directly determines the radar’s detection accuracy, anti-jamming capability and response speed. As military radars typically operate in the microwave to millimetre-wave bands (40–94 GHz), high frequency signals

Automated Optical Inspection (AOI) is a core quality inspection technology in the PCB manufacturing sector. It relies on machine vision and image recognition technologies, combining lighting systems, high-definition camera systems and image processing and recognition systems. By capturing images of the PCB’s surface and internal layers via high-definition cameras, and then analysing and comparing them

The design of thick copper PCBs differs significantly from that of conventional thin copper PCBs. The core challenge lies in ‘balancing high current-carrying capacity, efficient heat dissipation and manufacturing feasibility’—line width calculations must take into account both current-carrying capacity and etching processes, via design must avoid voids, and thermal management must utilise the advantages of

Underetching of PCB circuit traces primarily occurs during the etching process. Any deviation in the concentration, temperature, spray pressure or etching time of the etching solution will significantly increase the risk of underetching. Many PCB manufacturers encounter underetching issues because they adopt a ‘one-size-fits-all’ approach to parameter settings, failing to take into account the differing

Every improvement in the precision of flexible circuit formation drives the expansion of ceramic pcb into high-end applications such as 5G communications, medical electronics and aerospace. As the two core processes in the PCB manufacturing industry, subtractive and additive methods are not mutually exclusive; rather, they form a complementary and symbiotic technological landscape centred on

High-frequency, low-loss FPCs (flexible printed circuit boards) are the key medium for signal transmission in 5G communication equipment; their material properties directly determine the transmission speed, stability and coverage of 5G signals. As 5G technology evolves from the Sub-6GHz band to the millimetre-wave band, and application scenarios expand from consumer devices to industrial internet, aerospace

Metal Core PCB (MCPCBs), also known as Insulated Metal Substrate (IMS) PCBs or thermal PCBs, are a type of printed circuit board that uses a metal plate as the substrate instead of traditional FR4 fibreglass cloth, and are primarily used to address heat dissipation issues in high-power electronic components. MCPCBs consist of a three-layer structure: