Mounting holes refers to the holes used to install the circuit board in PCB. These holes are usually located in the four corners of the PCB or along the edge, and are used to fix the position of the circuit board in the device, as well as to connect to the mechanical bracket or fixture […]
Parasitic capacitance is virtual capacitance (usually unnecessary) between two conductive structures separated by an insulator. It is an effect in PCB layout, where the propagating signal behaves as if it is a capacitor, but it is not a real capacitor. Parasitic capacitance usually occurs between any pair of conductors separated by a dielectric. These capacitances
During the PCBA processing process, some electronic components with poor welding are often encountered. Desoldering is required during the adjustment and maintenance process, or when electronic components are replaced due to incorrect welding. In the face of such electronic components, we generally remove the wrongly welded electronic components without damaging the PCB board. If the
Metal Core PCB is a special type of printed circuit board, whose substrate material is metal instead of common glass fiber reinforced plastic. Metal Core PCBs are usually made of aluminum, copper or magnesium alloy, among which aluminum and copper are the most commonly used materials. Metal Core PCBs have been increasingly used in hybrid
Definition of copper corrosion:It is a phenomenon in which copper reacts with chemicals or gases in the surrounding environment under specific conditions, resulting in oxidation, corrosion or deterioration of the copper surface. This reaction may lead to a reduction in the surface quality of the copper material, a decrease in electrical conductivity, or even an
Wafer Level Packaging (WLP) is an advanced packaging technology that has developed rapidly in recent years due to its advantages of small size, excellent electrical performance, good heat dissipation and low cost. Different from the traditional packaging process, wafer level packaging is in the chip is still on the wafer when the chip is encapsulated,
