What is a substrate in semiconductor?A semiconductor substrate is a key material used in the manufacture of integrated circuits. It is usually made of monocrystalline silicon and is characterized by high purity and absence of impurities. The surface of the substrate is coated with a layer of photoresist to create graphics by photolithography. Oxide and […]
Thick film ceramic pcb is printed metal wiring layer by screen printing process, and then degreased and sintered (generally 850~900℃) to form a circuit. Depending on the viscosity of the metal paste and screen mesh size, the thickness of the prepared metal wiring layer is generally 10μm to 20μm (increasing the thickness of the metal
Flexible Copper Clad Laminate (FCCL) refers to a kind of flexible insulating materials such as film on one or both sides, through a specific process, and copper foil bonded together with the formation of copper cladding board, FCCL is a flexible circuit board (Flexible Printed Circuit, FPC) processing substrate, according to the structure of the
Coplanarity, or the degree of co-planarity of the pins, refers to the deviation of the ends of the pins of an SMT component relative to an ideal plane. Ideally, all pins should be completely coplanar so as to ensure good contact with the PCB pads during the placement process. Insufficient coplanarity may lead to poor
Do you know what ipc electronics standards are?For those who work in the electronics industry or PCB assembly may wonder if there is a fixed standard to ensure the quality of my products and if there is a common language for this industry. The solution to all these problems is the IPC standard. So what
In the design and manufacture of circuit boards, pcb dimensions tolerance is a very critical issue that directly affects the effectiveness and performance of the circuit board.PCB board dimensional tolerances refer to the range of deviations allowed on the basis of set standard dimensions.Usually the dimensional tolerances of pcb plates are categorized into maximum and
What is solder flux? Flux is a substance that helps soldering of electronic components, and at the same time protects the soldered parts and prevents oxidation. Common fluxes are rosin-based mixtures that remove oxides from the solder and the soldered surface, thereby reducing surface tension and improving solderability. Solder flux according to its form can
Flexible aluminum pcb refers to the aluminum as the substrate, through a variety of ways to enhance the flexibility of the material of a material. The addition of other elements, the modulation of the organizational structure and the treatment of the surface can improve the flexibility of the aluminum substrate without affecting its thermal conductivity
Flex PCB coverlay is an insulating protective layer covering the surface of the flexible printed circuit board, playing a role in protecting the surface conductors and increasing the strength of the substrate. The protective material of the outer layer of graphics, there are generally two types to choose from. The first type is dry film
How to remove bga chip? Removing BGA chip is a delicate and intricate process that requires precision, patience, and the right tools. BGA chips are widely used in modern electronic devices due to their high density and efficient thermal performance. However, their removal and replacement pose a significant challenge due to their complex structure and
Aluminum substrate pcb is a kind of metal-based copper cladding board with good heat dissipation function. Generally, the single panel consists of three layers of structure, which are circuit layer (copper foil), insulation layer and metal base layer. For high-end use, there are also designed for double-sided boards, the structure of the circuit layer, insulation
Soldering tinning is an important industrial raw material for connecting electronic components in soldered circuits. It is a kind of solder with a low melting point, mainly referring to the solder made of tin-based alloy. The production method of soldering tin is to melt the ingot first, and then pressure processed into material. An important
What is pcba manufacturing? It is a critical process in the production of electronic devices. It involves the assembly of electronic components onto a printed circuit board (PCB) to create functional electronic circuits. This process is intricate, requiring precision, attention to detail, and adherence to quality standards to ensure the reliability and performance of the
Circuit boards are an integral part of modern electronic equipment, and they are usually subjected to a variety of processes during production, such as drilling, surface treatment, gold sinking, soldering, etc., as well as being exposed to a variety of contaminants and chemicals. Therefore, cleaning circuit boards is necessary to remove surface contaminants and improve
IC chip is the abbreviation of Integrated Circuit Chip, also known as chip or integrated circuit. It is a highly integrated and miniaturized electronic component that is widely used in electronic devices. Integrated circuit is a miniature electronic device or component, using a certain process, a circuit required transistors, diodes, resistors, capacitors and inductors and
Teflon material is polytetrafluoroethylene, the Chinese name Teflon, Teflon is a resin, the chemical name is called polytetrafluoroethylene, is the ethylene (C2H4) in the four hydrogen (H) are replaced by fluorine (F), into tetrafluoroethylene (C2F4), and then formed by polymerization. Since Teflon is made of carbon and fluorine atoms and does not contain hydrogen, it
In the rapidly evolving field of electronics, the advent of 3D printed circuit boards (PCBs) represents a significant technological advancement. Traditional PCB manufacturing, involving multiple complex and costly steps, has long dominated the industry. However, 3D printing technology is now poised to revolutionize this process, offering numerous benefits including increased design flexibility, reduced production times,
Waterproofing electronic circuit boards means that the environment around and within water can prevent the equipment from being damaged by moisture or immersion in water. Generally, the waterproofing of circuit boards is realized by applying waterproof coatings. At the same time, in the design and installation of circuit boards, it is also necessary to consider
A 4 layer PCB, or four-layer printed circuit board, adds two internal copper layers to form a signal layer and a power layer compared to a double-layer PCB. As a result, the components on the PCB can be arranged more densely, resulting in smaller packages, higher levels of integration, and better immunity to interference. At
In recent years, the demand for customizable and high-performance bluetooth mechanical keyboard pcb has surged, fueled by enthusiasts, gamers, and professionals alike. One of the key components that determine the functionality and performance of these keyboards is the PCB (Printed Circuit Board). When it comes to wireless capabilities, a specific variant known as the Bluetooth
What is a heat sink in PCB? A heat sink is a component made of a thermally conductive metal with a large surface area. It is usually connected to pcb components, including power transistors and switching devices. The function of this part is to absorb and dissipate heat. PCB heat sinks work through the principle
What is LTCC?LTCC is Low temperature cofired ceramic, low temperature cofired ceramic technology. Low temperature cofired ceramic technology (LTCC: low temperature cofired ceramic) is a multilayer circuit made by stacking unfired cast ceramic materials together, with printed interconnect conductors, components, and circuits inside, and sintering the structure into an integrated ceramic multilayer material. LTTC utilizes
Flip chip technology, also known as controlled collapse chip connection (C4), represents a revolutionary approach in the field of electronic packaging. It involves mounting a semiconductor device or integrated circuit (IC) face down directly onto the substrate or circuit board, with the electrical connections made through solder bumps. This method has been instrumental in driving
SIP (System in Package) and SOC (System on Chip) as two important trends in PCB design, their development not only affects the performance and size of the product, but also has a far-reaching impact on the future direction of the entire electronics industry. SoC is System on Chip. From a narrow perspective, SoC is the
