VIPPO process in PCB application
VIPPO (Via in Pad Plated over) is an over-hole technology, mainly used in PCB boards.POFV is Plating Over Filled Via abbreviation, refers to the PCB on the over-electrical holes, in order to meet the needs of the soldering and over-hole internal conduction, the first over-hole resin plugging holes, and then copper-plated to cover the holes […]























