Rigid Flex PCB Stackup refers to the combination of rigid PCBs and flexible PCBs to form a stack of circuit boards with a multi-layer structure. This technology combines the stability of rigid PCBs with the flexibility of flexible PCBs, allowing for better bending and folding properties while maintaining structural strength. Typical flexible circuit boards or […]
In the electronics manufacturing industry, soldering is a critical process, and the electronics soldering temperature is a key factor affecting the quality and effectiveness of soldering. The selection and control of soldering temperature is not only directly related to the firmness and stability of the soldering point, but also affects the performance and reliability of
Surface mount technology is an electronic assembly technology that mounts components directly onto the top surface of a printed circuit board. In contrast, through-hole assembly technology, the traditional method, requires components to be inserted into pre-drilled holes in the PCB and then connected via bottom wave soldering. While the differences between the two methods may
Transistor circuit board is a common type of circuit board used in electronic products, using transistors as the main component, and can be used for a variety of circuit applications such as amplification, switching, and modulation. A transistor is a semiconductor device that is special in that it can control the flow of large signals
SMD soldering paste is a kind of soldering material specially used in surface mount technology (SMT). In the SMT process, solder paste plays the role of adhering to components, promoting solder wetting, removing oxides and impurities, protecting the surface from re-oxidation, and forming a strong metallurgical bond. Solder paste printing is the first process of
What is electrostatic coating?It is a coating method that uses a high voltage electrostatic field to cause negatively charged paint particles to move in the opposite direction of the field and adsorb the paint particles on the surface of the workpiece. A thicker coating can be obtained in a single application. Spraying equipment consists of
PCB corrosion is a major cause of electronic product failure. Initially the effect of corrosion is to increase the resistance of the copper traces on the board, but as the level of corrosion increases, the PCB becomes less efficient or even stops working. Corrosion is an oxidizing process that occurs when oxygen combines with metal,
Applying a metallic/organic coating to bare pads is called surface finishing. The surface finish protects the copper pads from scratches and oxidation while promoting soldering in the reflow oven. While there are several types of surface finishes, ENIG vs ENEPIG are the two common types. Manufacturers typically use them on ceramic PCBs, flex boards, and
In the manufacturing process of electronic products, flux, as an important soldering auxiliary material, plays a key role in connecting electronic components with circuit boards. However, while flux brings convenience, its residue problem has also become a challenge that cannot be ignored. Excessive flux residue not only affects the appearance and quality of the product,
SMT production line, full name surface assembly technology (Surface Mount Technology), is a modern electronic assembly technology. A new generation of electronic assembly technology developed from hybrid integrated circuit technology, characterized by the use of component surface mount technology and reflow soldering technology, has become a new generation of assembly technology in the manufacture of
PCB soldering temperature is a crucial parameter in the electronics manufacturing process. It not only affects the quality of soldering, but also directly relates to the performance and reliability of electronic products. Therefore, precise control of PCB soldering temperature is a key step to ensure the quality of electronic products.The proper pcb soldering temperature is
Red Glue is a polyolefin compound, a special adhesive used for fixing and protecting electronic components in the surface mount (SMT) process. Property CharacteristicsViscosity fluidity, temperature characteristics and wettability. By the characteristics so decided to red glue in smt chip processing in the role is to make the parts firmly affixed to the PCB surface,
FFC connectors are used to mate ribbon flat flexible cables (FFC) to PCB circuits in wire-to-board applications. They are also available in cable-to-cable configurations. These connectors have a high density, very narrow form factor and fit into tight spaces. They are typically used in consumer applications such as laptops, cameras, computer peripherals, appliances, and telephones.
PCB reflow soldering refers to the heating and melting of pre-painted in the pad above the paste (paste is generally composed of tin powder and flux mixture), so that it returns to the liquid state of the flow (this process is reflow), so that the devices placed above the pad in advance and the full
Solder paste is the core material in SMT mounting, it is a kind of material used to connect the electrode of parts and the pad of circuit board, mainly used for the welding of PCB surface resistance, capacitance, IC and other electronic components in SMT industry. It is made of solder powder, flux and other
What is decoupling capacitor?It is a capacitor installed in the power supply side of the component in the circuit, this capacitor can provide a more stable power supply, but also can reduce the component coupled to the power supply side of the noise, and indirectly can reduce the other components by the impact of the
PFC circuit is a power factor correction circuit that is an important component used in electronic equipment to improve the power factor of the AC power supply, reducing the negative impact on the network and the power plant, as well as improving the energy efficiency of the equipment. It consists of three main components: an
Traditionally, Through Hole Technology (THT) has been used to build most printed circuit boards (PCBs).However,in recent years,the use of surface mount technology (SMT) has become increasingly popular and is gradually replacing through-hole mount technology. What is through-hole insertion technology?Through-hole insertion technology inserts components with tails or leads into pre-drilled holes in the PCB. These components
FPGA, or Field Programmable Gate Array, is an integrated chip composed of digital circuits, which belongs to a kind of Programmable Logic Device (PLD). It appears in the form of semi-customized circuits in the field of Application Specific Integrated Circuits (ASIC), which not only solves the shortage of customized circuits, but also breaks through the
What is chassis ground?Chassis ground is the metal chassis in the enclosure and establishes a connection to the chassis. Chassis ground is usually connected to earth at the point where power enters the power supply and can provide noise absorption or safety protection for parts of the system. What are the types of PCB grounds?Depending
PCB circuit boards play a pivotal role in electronic equipment, not only carrying various types of electronic components, but also responsible for their precise connection to ensure stable and reliable operation of the circuit. So, in the design and production of PCB circuit boards, how to connect components on pcb？ The most common method of
What is a PCB antenna? As the name suggests, it is a PCB printed on an alignment, which can be drawn as a straight line alignment, reversed F-shaped alignment, snake or circular alignment, etc., the length of a quarter wavelength can basically form an antenna to radiate electrical signals out or receive signals. Design elements
Since the copper layer on the PCB board is easily oxidized, the resulting copper oxide layer can seriously degrade the soldering quality and thus the reliability and effectiveness of the final product. In order to avoid this situation, the need for pcb surface treatment. Some information will be talking about the surface molding, board factory
A pewter bead is a small, round ball-like substance that forms when tin is extruded between the pad and the component foot during the soldering process. The generation of solder beads is mainly related to the soldering temperature, flux and the surface condition of the printed wiring board. Reflow soldering in the tin bead generation
