What is the difference between SiP VS SoC?
SiP package ( System In a Package) is a single standard package that assembles multiple active electronic components with different functions and optional passive devices to realize a certain function.
SOC chips, on the other hand, are a type of system-level integration that achieves greater efficiency by integrating different functional modules, such as processors, memories, and interfaces, into a single chip.
SOC, along with SIP, is the integration of a system containing logic components, memory components, and even passive components, into a single unit. The difference is that SOC is from the perspective of design, the components required by the system are highly integrated into a chip; SIP is from the standpoint of packaging, different chips are packaged side-by-side or stacked in a way to achieve a certain function of a single standard package. In a way we can say: SiP = SoC + other (not integrated into the SoC chip and components).
The main technical difference:
SiP package is one of the technologies of the Semiconductor chip. The main difference between SOC chip and SiP chip is that SOC chip is designed and manufactured as a whole, while SiP chip is integrated into a chip based on ready-made chips, electronic components and modules.
SiP belongs to secondary development. It is based on the semiconductor chip that has been made, adding more chips or auxiliary parts to make it a semiconductor product with more complex functions or better performance.
SiP reduces the design and manufacturing threshold of large and complex chips and shortens the development cycle of system level chips. Accelerates the development process of system-on-chip. The diversity of system-level chips provides great convenience.
China’s chip manufacturing started late, the semiconductor manufacturing process is relatively backward, the development of SiP can be very good to avoid the shortcomings. Both as soon as possible to manufacture advanced functionality of the chip, but not because of the lack of design and manufacturing capacity to stop.
SiP manufacturing process is almost miniaturized PCBA processing. The process is more or less the same, but the processing technology is N times more stringent, and basically automated production.
Combined seal chip and SOC chip in the manufacturing process there are also some differences. It is made in the semiconductor chip on the basis of the chip, adding more chips or auxiliary parts, so that it becomes a more complex function or performance of the semiconductor product.
SOC chip needs to go through several steps, including chip design in the early stage, process development, packaging test in the later stage, etc. SOC chip integrates all functional modules in one chip, so the manufacturing process is relatively more complicated.
SOC chip technology features:
Highly integrated: SOC chip integrates all functional modules in one chip, which has a high degree of integration.
High performance: Since all functional modules are integrated in one chip, faster processing speed and higher data transmission efficiency can be realized.
Low power consumption: SOC chips can reduce power loss by integrating all functional modules within a single chip, thus extending the life of electronic devices.
Miniaturization: Smaller package sizes can be achieved, thus making electronic devices lighter and more compact.
Hopper chip, SOC chip are very important chip packaging technology in the field of current electronic equipment. They have some differences in the integration method, application areas and technical characteristics, but their goal is to improve the performance, stability and power efficiency of the system, to provide strong support for the efficient operation of electronic equipment.
