In the PCB circuit board printing process, the transformation of a bare board into a finished product with clear circuit graphics requires a series of sophisticated physical and chemical reactions, collectively known as pcb etching. Specifically, the process begins by pre-coating the outer layers of the board with a lead-tin alloy resist layer on the […]
Photoresist pcb boards are printed circuit boards manufactured using photoresist technology.The photoresist used in Photoresist pcb boards is a light-sensitive material that is usually applied to the surface of the board in the form of a layer of photosensitive resin. In the production process of circuit boards, UV light is projected onto the photoresist, which
Active components are key components in electronic circuits that can be powered from an external source to perform functions such as signal amplification, conversion, and generation. Active high frequency components are usually semiconductor devices such as diodes and transistors that perform active operations such as amplifying, rectifying and converting current. Simply put, active devices are
What is a protoboard?A protoboard, also known as a ProtoType board, is essentially an early sample of a product that is designed to test a design idea and see if it works. While most prototypes are made just to test basic user functionality, PCB prototypes need to be functional in some way, as they are
Crazing pcb is the phenomenon of cracks or breaks in a circuit board, which can lead to impaired functionality or even complete failure of the board. The causes of crazing pcb analysis: In order to prevent crazing pcb, you can take the following measures: Preventing crazing pcb requires a multifaceted approach that includes selecting materials,
Selecting the right PCBA process is a strategic decision that can have a decisive impact on product quality, productivity and cost-effectiveness. In the face of a wide range of process options, it is important to consider several key factors to ensure that the selected process can fit the product requirements, while adapting to production conditions
The tin spraying process, also known as hasl, is a long-established technology for PCB (Printed Circuit Board) surface treatment. The process starts by immersing the PCB in molten solder, which is then applied to the copper surface, followed by the use of a hot air gun to blow away the excess solder material, resulting in
A board electronics with holes is a substrate used for the layout of electronic components and its function is to connect electronic components. It is a design element on a circuit board, which is a hole set up to facilitate the insertion, connection and soldering of circuit board components. The core principle behind the functioning
A circuit board enclosure is a material specifically designed to protect circuit boards from damage or contamination. It also enhances the mechanical strength and thermal resistance of the circuit board, ensuring that it is more robust and trustworthy. Choosing the right enclosure is an integral part of the design process as it directly affects the
A 6 layer pcb stackup structure is a design in which six layers of conductive and non-conductive materials are stacked together during the circuit board manufacturing process to achieve complex circuit connections. This type of structure is commonly used in electronic products that require high-density wiring and multifunctional integration. Common 6 layer pcb stackup: 2.GND-SIG-GND-PWR-SIG-GNDIt
Alumina ceramic substrates consist mainly of a white amorphous powder commonly known as aluminium oxide, or simply Al2O3. It has a density of between 3.9 and 4.0 g/cm3, a melting point of up to 2,050°C, and a boiling point of up to 2,980°C. It is also used in the manufacture of alumina ceramic substrates. Aluminium
As a core component, the design and layout of an integrated circuit board (IC board) has a direct impact on the performance, reliability, and productivity of the device.The layout of IC board components not only needs to meet the requirements of electrical performance, but also needs to take into account various factors such as manufacturing
The choice of moulding process for flexible board directly affects product quality and production efficiency. According to the product demand, accuracy requirements and production volume, manufacturers need to reasonably select the moulding method. In this article, we will introduce in detail the characteristics and application scenarios of the three main moulding processes. 1.Die-punching moulding processDie-punch
Flexible board, is the so-called flexible circuit board, in fact, also belongs to a kind of printed circuit boards, but with the traditional printed circuit boards and has a great difference, so it will be called flexible board, full name of the flexible circuit board. Flexible board generally use PI as a substrate, is a
IC board, i.e. packaging substrate, is a kind of circuit board used to carry chips, belongs to a branch of PCB, has the characteristics of high density, high precision, high performance, miniaturisation and thinness, which can provide support, heat dissipation and protection for the chip, and also provide electrical connection and physical support between the
As the core component of automotive electronic system, the manufacturing quality of automotive circuit board (PCBA) is directly related to the performance and safety of the whole vehicle. Due to the complexity of the automotive operating environment, PCBA production needs to meet the high reliability, high temperature resistance, vibration resistance and other stringent requirements. In
High speed pcb sheet has the characteristics of low dielectric constant and low dielectric loss, which helps to significantly reduce the energy loss and distortion during the signal transmission process, thus improving the transmission speed and stability of the signal. In the high-frequency and high-speed digital signal transmission scenarios, the appropriate choice of high-speed sheet
Although the field of radio frequency (RF) circuit board design is still full of unknowns, there are a number of guiding principles that can be followed. However, the main challenge encountered in the actual design process is how to make reasonable compromises when these principles cannot be fully followed due to various constraints. A few
PCB circuit boards are divided into single-sided, double-sided and multilayer type, which the number of layers of multilayer boards are not strictly limited, there are more than 100 layers of PCBs have been introduced, but four-layer and six-layer boards are more common. Many people will be puzzled, why the PCB multilayer board commonly used in
PCB lamination is a key process step in the manufacture of multilayer printed circuit boards (PCBs). In this process, multiple thin, pre-processed circuit board layers (including copper foils, insulating substrates, leadframes, etc.) are tightly bonded together under high temperature and pressure with a specific adhesive (usually epoxy) to form a monolithic multilayer structure. The purpose
Agnetic environments and the control of interference with other equipment. ESD protection is the key to ensure that the equipment is not damaged in the electrostatic environment. This article will delve into the role of capacitors in enhancing EMS performance and the key function of resistors in preventing ESD damage. From the perspective of EMS
Static electricity arises from the separation of charges that occurs when two different materials come into contact with each other or are rubbed together, causing an object to become electrically charged as a whole. For example, the constant friction of people wearing clothes, or even the simple act of tearing paper, can trigger the generation
What is pcb panelization?PCB panelization refers to the process of integrating several small PCB boards into one large board by the manufacturer. From the initial stage of PCB design until the final production link, the board assembly operation always plays a pivotal role. It is not only about the quality of the PCB board to
In the PCB manufacturing process, pcb warpage problem has been one of the key factors affecting product quality and productivity. Warped PCB boards are not only difficult to subsequent assembly and soldering, but may also be rejected because they do not meet the specifications, leading to increased production costs and delivery delays. In order to
