Characteristic impedance, also known as features impedance, is the pure resistance of a circuit or transmission line per unit length when the frequency tends to infinity. It is an inherent characteristic of the transmission line and is not affected by factors such as the frequency, amplitude and phase of the signal. Usually expressed by the […]
HDI PCB is usually manufactured using the stackup method, the so-called ‘stackup’ refers to the formation of complex multilayer structures through the stacking and compression of multiple layers of circuit board materials. The more layers are stacked, the more difficult the board’s performance and process will be. HDI pcb stackup structure is usually expressed in
HDI Flex PCB is efficient and reliable circuit board with multiple electronic components. They offer better electrical performance in a smaller package size due to the use of thin, non-conductive substrate materials. HDI flex pcb primarily made from flexible substrates such as polyimide, which are lightweight and easily bendable to accommodate devices with complex shapes.
Flexible pcb board(FPC) is a flexible, thin and lightweight, bendable circuit connector made of polyimide, polytetrafluoroethylene and other polymer materials as the substrate, formed by chemical etching or laser stripping of wire graphics and holes. Due to its flexible, light and thin characteristics, it is widely used in mobile phones, tablet PCs, e-books, digital cameras
PCB board clamp usually refers to fixtures used to hold PCBs (printed circuit boards) in place. In the production of electronic equipment, PCB board clamps are used to ensure that circuit boards remain stable during assembly and soldering processes, preventing them from moving or being damaged. Such clamps can be simple plastic or metal structures
PCB circuit board printer, also known as circuit board printing machine or circuit board printing machine, is a device specially designed to print conductive patterns and components on circuit boards. It plays a key role in the electronics manufacturing industry and is widely used in the fields of circuit board manufacturing, electronic component production and
High Density Interconnect (HDI) pcb is widely used in modern high-end electronics due to their excellent performance and compact structural design. However, the manufacturing process of HDI PCBs is complex and involves numerous high-precision technologies and stringent process requirements. In particular, there are many technical difficulties and challenges in the production process, such as microvia
Aluminium PCBA is widely used in high power density electronic devices due to its superior thermal performance and mechanical strength, but there are a number of manufacturing difficulties in its production process, which require strict process control and optimization measures to ensure product quality and performance. Compared with the traditional FR-4 material printed circuit board
Energy harvesting pcb (Printed Circuit Board) is a circuit board applied in energy storage devices (e.g. batteries, supercapacitors) to manage, protect and control the charging and discharging process of the energy storage system. Energy Harvesting PCB Advantages.The high degree of integration enables it to be directly embedded in the motherboard of electronic devices, effectively saving
High multilayer circuit boards usually refer to circuit board structures with 10 to 20 or more layers. Compared with traditional multilayer circuit boards, the complexity of their processing processes has increased significantly, and the requirements for quality stability and long-term reliability are also more stringent. With excellent electrical performance and structural stability, these circuit boards
Conventional wave soldering is a mature and widely used mass welding technology, by inserting plug-in components into the PCB board, and then the whole through the solder wave to complete the welding, to achieve efficient mass production. This process is particularly suitable for soldering a large number of plug-in components, and the effect is particularly
Wave soldering as a key process widely used in the field of electronic manufacturing, the stability and precise control of the process is an important guarantee to ensure the quality of welding. Wave soldering process control:(1) flux (solder) sprayingDouble-sided tape is used to paste the paper on the surface of the printed circuit board (PCB)
High voltage pcb design has an important position in modern electronic equipment, especially in the fields of power electronics, industrial control and new energy vehicles. As it involves high voltage and current, the design must strictly control key parameters such as creepage distance and electrical clearance to ensure the safety and long-term stable operation of
High current pcb connector is an electrical connector that can be connected and disconnected under high current and high voltage conditions, and is mainly used for connecting high power supplies and loads that can transmit currents of tens to thousands of amperes. Its features include the ability to withstand high currents, high temperatures and high
Laser engraving pcb board is the process of processing and engraving circuit boards using laser technology. Laser engraving pcb board mainly uses the laser’s high energy density and precise control ability, through the laser beam directly on the circuit board for cutting, engraving and marking operations. Basic Principle of Laser engraving pcb board MarkingThe basic
Circuit board assembly machine is a very important equipment in the semiconductor industry, which is mainly used to automate the assembly of electronic components and circuit boards. According to its different assembly methods, circuit board assembly machine can be divided into two types: surface mount assembly machine and through-hole assembly machine. Surface mount assembly machine
In the field of electronic manufacturing, double-sided PCB board assembly by virtue of its high integration, small size and other advantages, widely used in various types of electronic products, from smart phones, tablet computers to industrial control equipment, automotive electronic systems, are inseparable from its figure. It can not only effectively save board space, but
Custom PCBA refers to the customised design and production of PCBA products according to customer requirements. This includes selecting the right components for the specific application, designing a board layout that meets the requirements, and adopting appropriate processing techniques. The advantage of custom PCBA is that it can meet the specific needs of customers and
High frequency pcb and high speed pcb belong to the same PCB circuit boards used for signal transmission, however, there are significant differences between the two in the actual application scenarios, mainly reflected in the following. Frequency band application differences: high frequency pcb focus on frequency bands above 500MHz, specifically to cope with high-frequency signal
The MSL (Moisture Sensitive Level) standard is a classification system used by the electronics industry to assess the sensitivity of components to moisture, which classifies components into eight different levels based on their sensitivity to moisture. These levels reflect the amount of time a component can be safely stored under specific temperature and humidity conditions
The fundamentals of RF circuit design include： RF Circuit Layout PrinciplesWhen designing an RF layout, priority must be given to meeting the following general principles: (1) As far as possible to isolate the high-power RF amplifier (HPA) and low-noise amplifier (LNA), in short, is to keep high-power RF transmitter circuits away from low-power RF receiver
Solder Joint Pillow, also known as the pillow effect (Head-in-Pillow, HIP), is an undesirable phenomenon in which the solder balls of BGAs, CSPs and other components fail to fully fuse with the solder, resulting in the failure to form good electrical connections and mechanical solder joints. This phenomenon is similar to the shape of a
As a key necessary step in the integrated circuit manufacturing process, chip packaging and testing plays a vital role. Specifically, this link will carry out a series of fine operations on the wafers that have passed the quality inspection, and complete the wafer cutting, chip welding and overall plastic sealing processes with the help of
BGA Test Fixture (Ball Grid Array Test Fixture) is a test tool for testing BGA chips, which can provide electrical test, signal acquisition and programming functions for the chip. In the design of the BGA test frame, you need to consider the PCB (Printed Circuit Board) with the design, because the layout of the PCB
