Heavy copper pcb is a printed circuit board (PCB) with a layer of copper foil bonded to its glass epoxy substrate, and when the thickness of the copper foil is greater than or equal to 2 ounces (i.e., ≥ 2oz), it is referred to as a PCB thick copper board. PCBs are widely used in […]
As a popular choice for meeting the needs of flexible electronic circuits, FPC flexible circuit boards are designed to replace traditional wire harnesses for a variety of complex electronic design solutions. While the performance of flexible PCBs is influenced by multiple factors, one of the key elements is undoubtedly the constituent materials. So, what exactly
Circuit board resistors are one of the most basic components used in PCBs. They are passive devices that block the flow of current in a circuit.PCB resistors control, divide, stabilize, connect circuits, etc. They come in a variety of resistance values, sizes, and tolerances to meet different circuit requirements. They come in a variety of
2step hdi board (High-Density Interconnect) is a high-density interconnect technology used primarily in electronic devices to achieve higher signaling speeds and smaller sizes. 2step HDI board further increases the number of layers and the outer layer of copper from the basic first-order HDI structure, which gives second-order HDI a higher line density than first-order HDI.
Electroplated nickel gold (Electrolytic Nickel/Gold) is the originator of the PCB surface treatment process and has been around since the advent of PCBs. It is the process of plating a layer of nickel on the PCB surface conductor before plating a layer of gold. Refers to the way through the plating, so that the gold
PCB Gold Finger, as a key component of a printed circuit board, refers to the gold-plated conductive posts that connect the edges. Its central role is to ensure that the auxiliary PCB can be smoothly connected to the computer motherboard or other devices to achieve accurate signal transmission. Whether it’s a smartphone, smartwatch or other
PCB copper thickness refers to the thickness of the copper foil in the printed circuit board (PCB), is an important parameter of the circuit board. It is used for PCB conductive, is precipitated in the circuit board substrate layer of a thin, continuous layer of metal foil. PCB copper thickness is divided into the inner
The temperature to melt solder is the point at which the solder changes from a solid to a liquid during the heating process. The selection of this temperature point needs to take into account a number of factors, including the nature of the material to be soldered, the soldering environment, and the requirements of the
Circuit board corrosion can be extremely harmful to printed circuit boards, and while there are many reasons why printed circuit boards can corrode, how to clean corroded circuit boards? There are many ways to deal with corroded circuit boards, depending on the degree of corrosion and the specifics of the board. Common treatment methods include:
High speed PCB is mainly used in high-speed digital circuits where signal transmission integrity needs to be ensured. High-frequency PCBs are mainly used in high-frequency (frequency above 1GHz) and ultra-high-frequency (frequency above 10GHz) electronic devices, such as RF chips, microwave receivers, RF switches, air-space tuners, frequency selective networks and so on. Unlike high-frequency PCBs, the
Isolated circuits are circuits with different functions or signal paths that are separated on a printed circuit board by a specific design and layout to avoid interfering or affecting each other. The implementation of this isolation technique can significantly improve the reliability and stability of the circuit board and reduce failures or performance degradation due
Drilled holes are a critical part of the printed circuit board (PCB) manufacturing process, and the PCB drilled hole tolerance, i.e. the range of deviation between the drilled hole size and its design value, is directly related to the production accuracy and overall quality of the board. Therefore, the control of PCB drilling tolerances is
Electroplating copper is the key process of metallization of printed circuit board (printed circuit board, PCB) formation holes, which is an important part of the PCB production process. In order to make the quality and performance of the copper plating layer to meet the PCB requirements, it is often necessary to add some organic additives
A double sided PCB board is an electronic component carrier consisting of an insulated substrate and a metal conductive layer. It has two working layers that can be used for wiring and assembling electronic components, i.e. the top layer and the bottom layer. These two layers are connected by means of holes to form an
PCB copy board, also known as circuit board cloning, is to copy the circuit board to be copied, is a process from the physical to the PCB, that is, a ready-made PCB board into a PCB for mass production. PCB copy board is a kind of reverse research technology, that is, through a series of
What is resistance circuit? A resistance circuit is a circuit consisting solely of a power source and a linear resistor, and is the degree of obstruction encountered by the flow of current through the circuit, which is usually measured in ohms (Ω). A distinctive feature of resistance circuits is that the electrical energy is converted
Polyimide PCB is a printed circuit board made of polyimide as the main material, and its unique performance makes it occupy an important position in the electronics industry. Polyimide, this high-performance engineering plastics, with excellent high temperature resistance, chemical resistance and electrical properties, is the ideal choice for PCB boards in aerospace, defense and other
In the electronics industry, pcb solder mask material is an indispensable basis for the construction of electronic devices and systems. The quality and technical characteristics of these materials have a direct impact on the performance and reliability of the final product. Common pcb solder mask material When selecting circuit board soldering materials, focus on the
For electronic equipment, work will produce a certain amount of heat, so that the internal temperature of the device rises rapidly, if the heat is not promptly distributed, the device will continue to heat up, the device will fail due to overheating, and the reliability of the electronic equipment will decline. Therefore, PCB Thermal treatment
Round PCB Board is a printed circuit board whose shape is circular. It is commonly used in consumer electronics, wearable devices, etc. Compared to traditional rectangular boards, round PCB board has the following significant advantages:High space utilization: For devices that require tight integration and full use of internal space, such as miniature sensors, wearable devices,
Whether it is the production or removal and replacement time, will be left on the circuit board some of the solder left behind the slag, to clean up these slag will not affect the use of the circuit board. So how to remove solder from circuit board? The first:Clean up the circuit board on the
In the PCB prototyping process, PCB rework is the process of repairing or modifying a PCB that has already been produced. When a sample PCB has design errors, soldering problems, component failures, or other non-conformities, the rework process can help fix these problems so that the PCB meets the design requirements and works properly. Steps
PCB reflow soldering hot plate is a process that involves re-melting a paste solder that has been pre-coated on a printed circuit board pad to make a mechanical and electrical connection between the solder ends or pins of a surface-mounted component and a printed board pad. PCB reflow hot plates, as a method of soldering
PCB voltage clearance, usually refers to the minimum distance between different conductive parts of the PCB (such as alignments, pads, vias, etc.). This distance is to prevent electrical short circuits and ensure electrical insulation and set up, and is affected by a variety of factors, including PCB operating voltage, dielectric strength of the insulating material,
