Multilayer PCB stackup technology, in short, is the process of stacking multiple circuit board layers together through specific connections to form a circuit board structure with higher integration and more complex functionality. By increasing the number of circuit board layers, this technology allows more electronic components and circuits to be accommodated in a limited space, […]
Water soluble solder paste is a kind of flux widely used in electronic soldering process, which can improve the wettability of solder, prevent oxidation, and clean the residue with water after soldering. Compared with traditional solder paste, water-soluble solder paste has the following characteristics: Classification of water-soluble solder pasteAccording to the composition classificationAcidic water-soluble flux:
What is bga? BGA meaning Ball Grid Array Package, known as Ball Grid Array, is a surface mount packaging technology for integrated circuits. Its pins are arranged in an array on the bottom of the package substrate, and ball contacts are made as pins to connect with the printed circuit board (PCB). BGA encapsulation process
LGA is an electronic component packaging technology based on the Land Grid Array (LGA) connector design principle for connecting IC chips to printed circuit boards (PCBs). LGA is an electronic component packaging technology based on the design principle of Land Grid Array (LGA) connector, which is used to connect IC chips to printed circuit boards
What is a circuit board? A circuit board is a thin sheet made of conductive material, on which are densely covered with a variety of electronic components and lines. It is the core component of electronic equipment, used to connect and support electronic components, to realize the electrical connection and signal transmission. There are many
OSP plating, as a printed circuit board copper foil surface treatment of a RoHS-compliant process, is an abbreviation of Organic Solderability Preservatives, which uses chemical methods to form a layer of organic skin film on the clean bare copper surface. This film not only prevents the copper surface from rusting in the normal environment, but
IC packaging is a method of protecting semiconductor components from external physical damage or corrosion by encapsulating them in an encapsulating material made of ceramic or plastic. There are many different types of integrated circuits that follow different circuit designs and enclosure requirements. This translates into different types of IC package types design. Why is
PCB blind via buried via technology realizes the precise connection between the inner layer of the circuit board and the surface layer of the circuit board with the help of a unique processing technology. This technology not only significantly increases the density of the circuit board wiring, but also effectively enhances the overall performance and
DIP packaging (Dual In-line Package), also known as dual in-line package technology, refers to the use of dual in-line form of integrated circuit chip package, the vast majority of small and medium-sized integrated circuits are used in this package form, the number of pins is generally no more than 100. DIP package CPU chip has
A PCB is a functional board that provides point-to-point connection of wires and printed components on an insulated substrate, according to a predetermined design.A PWB is a functional board that provides point-to-point connection of wires on an insulated substrate, according to a predetermined design, but does not contain printed components. PWBs, or printed wiring boards,
PCB thermal relief refers to the process of heat management and control for printed circuit boards (PCBs). As the PCB is integrated with a large number of electronic components, these components in the work will produce heat, if not timely and efficiently emitted, will lead to PCB temperature rise, which in turn affects the performance
Heavy copper pcb is a printed circuit board (PCB) with a layer of copper foil bonded to its glass epoxy substrate, and when the thickness of the copper foil is greater than or equal to 2 ounces (i.e., ≥ 2oz), it is referred to as a PCB thick copper board. PCBs are widely used in
As a popular choice for meeting the needs of flexible electronic circuits, FPC flexible circuit boards are designed to replace traditional wire harnesses for a variety of complex electronic design solutions. While the performance of flexible PCBs is influenced by multiple factors, one of the key elements is undoubtedly the constituent materials. So, what exactly
Circuit board resistors are one of the most basic components used in PCBs. They are passive devices that block the flow of current in a circuit.PCB resistors control, divide, stabilize, connect circuits, etc. They come in a variety of resistance values, sizes, and tolerances to meet different circuit requirements. They come in a variety of
2step hdi board (High-Density Interconnect) is a high-density interconnect technology used primarily in electronic devices to achieve higher signaling speeds and smaller sizes. 2step HDI board further increases the number of layers and the outer layer of copper from the basic first-order HDI structure, which gives second-order HDI a higher line density than first-order HDI.
Electroplated nickel gold (Electrolytic Nickel/Gold) is the originator of the PCB surface treatment process and has been around since the advent of PCBs. It is the process of plating a layer of nickel on the PCB surface conductor before plating a layer of gold. Refers to the way through the plating, so that the gold
PCB Gold Finger, as a key component of a printed circuit board, refers to the gold-plated conductive posts that connect the edges. Its central role is to ensure that the auxiliary PCB can be smoothly connected to the computer motherboard or other devices to achieve accurate signal transmission. Whether it’s a smartphone, smartwatch or other
PCB copper thickness refers to the thickness of the copper foil in the printed circuit board (PCB), is an important parameter of the circuit board. It is used for PCB conductive, is precipitated in the circuit board substrate layer of a thin, continuous layer of metal foil. PCB copper thickness is divided into the inner
The temperature to melt solder is the point at which the solder changes from a solid to a liquid during the heating process. The selection of this temperature point needs to take into account a number of factors, including the nature of the material to be soldered, the soldering environment, and the requirements of the
Circuit board corrosion can be extremely harmful to printed circuit boards, and while there are many reasons why printed circuit boards can corrode, how to clean corroded circuit boards? There are many ways to deal with corroded circuit boards, depending on the degree of corrosion and the specifics of the board. Common treatment methods include:
High speed PCB is mainly used in high-speed digital circuits where signal transmission integrity needs to be ensured. High-frequency PCBs are mainly used in high-frequency (frequency above 1GHz) and ultra-high-frequency (frequency above 10GHz) electronic devices, such as RF chips, microwave receivers, RF switches, air-space tuners, frequency selective networks and so on. Unlike high-frequency PCBs, the
Isolated circuits are circuits with different functions or signal paths that are separated on a printed circuit board by a specific design and layout to avoid interfering or affecting each other. The implementation of this isolation technique can significantly improve the reliability and stability of the circuit board and reduce failures or performance degradation due
Drilled holes are a critical part of the printed circuit board (PCB) manufacturing process, and the PCB drilled hole tolerance, i.e. the range of deviation between the drilled hole size and its design value, is directly related to the production accuracy and overall quality of the board. Therefore, the control of PCB drilling tolerances is
Electroplating copper is the key process of metallization of printed circuit board (printed circuit board, PCB) formation holes, which is an important part of the PCB production process. In order to make the quality and performance of the copper plating layer to meet the PCB requirements, it is often necessary to add some organic additives
