Red Glue is a polyolefin compound, a special adhesive used for fixing and protecting electronic components in the surface mount (SMT) process. Property CharacteristicsViscosity fluidity, temperature characteristics and wettability. By the characteristics so decided to red glue in smt chip processing in the role is to make the parts firmly affixed to the PCB surface, […]
FFC connectors are used to mate ribbon flat flexible cables (FFC) to PCB circuits in wire-to-board applications. They are also available in cable-to-cable configurations. These connectors have a high density, very narrow form factor and fit into tight spaces. They are typically used in consumer applications such as laptops, cameras, computer peripherals, appliances, and telephones.
PCB reflow soldering refers to the heating and melting of pre-painted in the pad above the paste (paste is generally composed of tin powder and flux mixture), so that it returns to the liquid state of the flow (this process is reflow), so that the devices placed above the pad in advance and the full
Solder paste is the core material in SMT mounting, it is a kind of material used to connect the electrode of parts and the pad of circuit board, mainly used for the welding of PCB surface resistance, capacitance, IC and other electronic components in SMT industry. It is made of solder powder, flux and other
What is decoupling capacitor?It is a capacitor installed in the power supply side of the component in the circuit, this capacitor can provide a more stable power supply, but also can reduce the component coupled to the power supply side of the noise, and indirectly can reduce the other components by the impact of the
PFC circuit is a power factor correction circuit that is an important component used in electronic equipment to improve the power factor of the AC power supply, reducing the negative impact on the network and the power plant, as well as improving the energy efficiency of the equipment. It consists of three main components: an
Traditionally, Through-Hole Technology (THT) has been used to build most printed circuit boards (PCBs). However, in recent years, the use of surface mount technology (SMT) has become increasingly popular and is gradually replacing through-hole mount technology. What is through-hole insertion technology?Through-hole insertion technology inserts components with tails or leads into pre-drilled holes in the PCB.
FPGA, or Field Programmable Gate Array, is an integrated chip composed of digital circuits, which belongs to a kind of Programmable Logic Device (PLD). It appears in the form of semi-customized circuits in the field of Application Specific Integrated Circuits (ASIC), which not only solves the shortage of customized circuits, but also breaks through the
What is chassis ground?Chassis ground is the metal chassis in the enclosure and establishes a connection to the chassis. Chassis ground is usually connected to earth at the point where power enters the power supply and can provide noise absorption or safety protection for parts of the system. What are the types of PCB grounds?Depending
PCB circuit boards play a pivotal role in electronic equipment, not only carrying various types of electronic components, but also responsible for their precise connection to ensure stable and reliable operation of the circuit. So, in the design and production of PCB circuit boards, how to connect components on pcb？ The most common method of
What is a PCB antenna? As the name suggests, it is a PCB printed on an alignment, which can be drawn as a straight line alignment, reversed F-shaped alignment, snake or circular alignment, etc., the length of a quarter wavelength can basically form an antenna to radiate electrical signals out or receive signals. Design elements
Since the copper layer on the PCB board is easily oxidized, the resulting copper oxide layer can seriously degrade the soldering quality and thus the reliability and effectiveness of the final product. In order to avoid this situation, the need for pcb surface treatment. Some information will be talking about the surface molding, board factory
A pewter bead is a small, round ball-like substance that forms when tin is extruded between the pad and the component foot during the soldering process. The generation of solder beads is mainly related to the soldering temperature, flux and the surface condition of the printed wiring board. Reflow soldering in the tin bead generation
PCB circuit board blind vias are holes in multilayer circuit boards that are used to connect different levels of internal lines, but do not run through the entire plate. Blind vias play an important role in increasing line density, reducing board size and enhancing circuit performance. Blind buried blind holes is a multilayer circuit board,
Resin Plug Hole refers to the use of resin material to fill holes and defects in circuit boards to repair functional defects in circuits. Holes and defects in a circuit board may be created by processes such as drilling, plating, pressing, etc., or they may be designed to achieve specific electrical properties. For example, Via
Virtual Welding is a common wiring fault, it refers to the solder joints at the solder joints are not completely effective welding together, resulting in poor contact, may appear on and off. Virtual soldering refers to the component pins, soldering ends, PCB pads at the tin is not sufficient, the wetting angle of the solder
Automated optical inspection (automatedopticalinspection,AOI) technology, also known as machine vision inspection (machinevisioninspection,MVI test) technology or automatedvisualinspection (automatedvisualinspection,AVI) technology. In some industries, such as flat panel display, semiconductor, solar and other manufacturing industries, the term AOI is more popular and known. However, there are still subtle differences between AOI and MVI/AVI in terms of concept and
SOP Package is a form of packaging used in the manufacture and assembly of electronic components.SOP package is a surface mount technology (Surface Mount Technology, SMT), which solder the pins of electronic components to the surface of a printed circuit board (Printed Circuit Board, PCB) instead of connecting them through a perforated hole. SOP package
PCB cutter is a mechanical equipment specialized in cutting circuit boards. It cuts circuit boards accurately and quickly by means of a high-speed rotating cutting tool to meet the needs of different electronic products on the size and shape of circuit boards. Cutting is the first step in material analysis. The choice of cutter as
In the electronics manufacturing industry, Through Hole vs SMD (Surface Mount Device) are two commonly used ways of mounting circuit board components, which play an indispensable role in the design and manufacturing of electronic products. Although they have their own characteristics and advantages, in many cases they are complementary, and together they contribute to the
FFC connectors and FPC connectors are often confused. Although both are flexible cable connectors, but FFC connectors and FPC connectors are still a certain degree of difference. FFC is a flexible flat cable (Flexible Flat Cable) connectors, FPC is a flexible printed circuit (Flexible Print Circuit). In terms of the manufacturing of the two, the
Copper Through Hole Filling (THF) technology is a major technological breakthrough that addresses the challenges of high-frequency thermal management and signal integrity while improving wiring density and interconnect reliability.Comparing THF and Conductive Paste Fill Through-Hole process, Conductive Paste Fill Through-Hole process involves multiple steps that are difficult to control, high production cost, and the fill
AOI, or Automatic Optical Inspection, is a device based on optical principles to detect common defects encountered in welding production. AOI is a newly emerging new testing technology, but it is developing rapidly, and many manufacturers have introduced AOI test equipment. When AOI is used, the machine automatically scans the PCB with a camera, captures
What is the difference between SiP VS SoC?SiP package ( System In a Package) is a single standard package that assembles multiple active electronic components with different functions and optional passive devices to realize a certain function. SOC chips, on the other hand, are a type of system-level integration that achieves greater efficiency by integrating
