Electronic manufacturer

smt connectors

Explanation of SMT connectors

SMT connectors are connectors assembled using SMT technology. In specific use, SMT connectors like SMT components, for the connector pads, are directly affixed to the surface of the circuit board, and no longer need to be like the traditional TH connectors need to be pierced to install. SMT connectors are divided into: lying paste connector […]

RO4350B

RO4350B vs RO4835 Material Comparison

RO4350B is a commonly used high-frequency printed circuit board (PCB) material produced by Rogers Corporation in the United States. This material is used in wireless communications, radar systems, medical devices and other high frequency electronic equipment.The dielectric constant of RO4350B is approximately 3.48.This value was measured at a frequency of 1 GHz.Typically, the dielectric constant

hdi circuit boards

HDI board Design

HDI circuit boards are highly integrated printed circuit boards with high density, miniaturization, and light weight, which can significantly improve the performance and functional density of electronic products. HDI board design specifications usually cover the following aspects: Number of Layers and Thickness: HDI circuit boards usually use a multi-layer structure to accommodate more signal and

bga packages

BGA packages on flexible circuit boards

BGA packages is solder ball array package, is an integrated circuit using an organic carrier board packaging method. With the continuous development of society, in order to meet the demand for electronic products light, thin, short, small and functional diversification, production of green and other aspects of the BGA package began to be applied to

rogers material

Why is Rogers material not FR4?

Rogers material is a specialised laminate used in the manufacture of high frequency, high performance Printed Circuit Boards (PCBs) and is manufactured by Rogers Corporation. Rogers materials typically do not contain glass fibres, but rather a ceramic foundation or hydrocarbon ceramic composite substrate, which gives them excellent dielectric properties, low dielectric constants and low loss

pcb prepreg

The role of pcb Prepreg

PCB prepreg​ is a soft material, similar to the black tape, also called ‘semi-glue’ or ‘film’, commonly used in the production of circuit boards. In the PCB PP is sandwiched between the core board and copper foil or two core boards before the dielectric layer to play an insulating role. It is made of polymer

pcb circuit board

PCB circuit board Layer Stacking Structure Optimisation Strategies

The laminated construction of PCB circuit boards refers to the stacking of multiple layers of circuit boards together to form a single structure. Electronic components can be arranged on each layer of the pcb circuit board, and the components are connected between the layers by means of wires and jacks. The laminated structure can provide

rogers ceramic pcb

Advantages and Processes of Rogers Ceramic PCB

Rogers ceramic pcb is a kind of circuit board using ceramic material as the substrate, which has the advantages of high thermal conductivity, high insulation, corrosion resistance and high temperature resistance. This type of circuit board is suitable for use in a variety of electronic products that require high performance and reliability, such as aerospace,

Rogers Ro4003 substrate

Rogers RO4003C Substrate Performance and Design Points

Rogers RO4003C substrate​ is known for its dielectric constant Dk of 3.38+/-0.05 and low dielectric loss Df of 0.0027 at 10 GHz. It is a unique glasscloth-reinforced, ceramic-filled hydrocarbon composite that combines the excellent electrical properties of PTFE/glasscloth with the superior processability of epoxy resin/glasscloth. processability. RO4003C laminates are available in two different configurations with

pcb plating

PCB plating hole filling process

PCB plating to fill vias is a treatment performed to connect different layers of circuits during the manufacturing process. In the manufacturing of High Density Interconnect (HDI) boards and multilayer boards, the treatment of microvias (via) is a key aspect. Conventional mechanical drilling methods can no longer meet the high precision requirements of microvias, and

pcb circuit board

Relationship between pcb circuit board line width and current-carrying capacity

In electronic circuit design, pcb circuit board line width is closely related to its current carrying capacity. Wire width directly determines the cross-sectional area of the wire, thus affecting the maximum current it can withstand. The proper design of the line width not only ensures the normal operation and safety of the circuit, but also

through hole assembly

Advantages of through hole assembly

Through-hole assembly, also known as through-hole technology, is a mounting method for electronic components. It consists of inserting components into existing holes in printed circuit boards (PCBs) using the component’s pins and soft brazing of electronic components by hand assembly or automatic insertion loaders. Advantages of through hole assemblyThrough hole assembly technology, or THT for

rf pcb

Multilayer RF PCB Design Essentials

A radio frequency circuit board (RF PCB) is a type of circuit board specifically designed to handle high frequency and radio frequency signals. Compared to ordinary PCBs, RF PCBs have unique design requirements for efficient signal transmission in the high frequency range. Impedance matching and signal integrity are important in RF circuit board design and

heavy copper flex pcb

Advantages and Manufacturing Challenges of Heavy Copper Flex PCB

Heavy copper flex PCB refers to circuit boards with thicker copper layers in the flexible circuit board, which are usually between 100 and 400 microns thick, far exceeding the 35 micron copper thickness of standard PCBs. This design not only improves the current-carrying capacity of the board, but also greatly enhances its thermal performance. Flexible

automotive pcb assembly

Reliability of automotive pcb assembly

With the rapid development of automotive electronics technology, automotive PCB assembly as a key electronic manufacturing link, its reliability is directly related to the safety and performance stability of the vehicle system. Enhancing the reliability of automotive PCB assembly not only reduces the failure rate and rework cost, but also effectively improves the overall quality

automotive circuit board

Differences between automotive circuit boards and ordinary

Automotive circuit board, full name of automotive printed circuit board, is a kind of electronic products using printing technology to print the copper foil line on the insulated substrate. It connects various electronic components such as resistors, capacitors, chips, etc. together through specific circuit patterns to achieve the transmission and processing of electronic signals, thus

automative pcb assembly

Automotive PCB assembly and development outlook

Automotive pcb assembly is the process of assembling automotive printed circuit boards, which has more stringent quality requirements than PCBA in other fields. This is mainly because the automotive electronic system is directly related to the performance and safety of the vehicle. Automotive pcb assembly process:Raw material preparationAccording to the special needs of automotive electronics,

flex pcb edge connector

Flex PCB Edge Connectors Explained

A flex pcb edge connector is an electrical connector designed for flexible printed circuit boards (FPCs) to provide a reliable electrical connection between the circuit leads of a flexible circuit board and the contact pads on other circuit boards, such as rigid PCBs. It is usually mounted on a rigid circuit board (PCB) to secure

flex pcb thickness

Flex pcb thickness selection guide

The flex pcb thickness​ varies depending on the material, manufacturing process and application requirements, typically ranging from 0.1mm to 1.6mm. Choosing the right thickness is critical to ensure product performance and longevity. Factors affecting the flex pcb thickness​ Flex pcb thickness​ in different applications Flex pcbs are classified as single layer, double layer, multilayer and

printed circuit board

Common Defects in Printed Circuit Boards

Printed circuit board (PCB) as a core component of modern electronic equipment, its quality and reliability of the performance of the entire electronic system plays a vital role. However, during the manufacturing, storage and use of PCBs, they are affected by various factors such as temperature, humidity, contaminants and process operations, and often suffer from

pcba

PCBA mass production common problems and solutions

In the PCBA mass production process, due to the expansion of production scale and process complexity increases, often encounter some common problems. The following will explore these issues in depth and provide the corresponding solutions. Design and Material Preparation StageIgnoring the special needs of mass production during the design phase can lead to subsequent manufacturing

characteristic impedance

Difference and Calculation of Characteristic Impedance and Impedance

Characteristic impedance, also known as features impedance, is the pure resistance of a circuit or transmission line per unit length when the frequency tends to infinity. It is an inherent characteristic of the transmission line and is not affected by factors such as the frequency, amplitude and phase of the signal. Usually expressed by the

hdi pcb stackup

HDI pcb stackup structure and rational design

HDI PCB is usually manufactured using the stackup method, the so-called ‘stackup’ refers to the formation of complex multilayer structures through the stacking and compression of multiple layers of circuit board materials. The more layers are stacked, the more difficult the board’s performance and process will be. HDI pcb stackup structure is usually expressed in

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