Electronic manufacturer

FR1 pcb is constructed from glass fiber-reinforced epoxy resin laminates. FR1 PCBs are rigid, flat materials composed of thin copper layers on a non-conductive phenolic resin substrate. FR1, fully known as Flame Retardant 1, is a PC film with high insulation and flame-retardant properties. This material not only exhibits excellent flame resistance but also possesses […]

In electronic manufacturing, circuit boards must be divided into distinct sections to meet the design requirements of various electronic products. Traditional mechanical cutting and punching techniques struggle to satisfy modern production standards. The advent of PCB laser depaneling machines has made this process efficient and precise, not only boosting production efficiency but also ensuring the

OSP (Organic Solderability Preservative) is a surface treatment process for PCBs (Printed Circuit Boards). It involves coating the copper foil surface with an extremely thin organic protective film (approximately 0.2-0.5μm thick) to prevent copper oxidation and maintain solderability. During soldering, high temperatures cause the protective film to decompose, exposing the copper surface to bond with

What does FPC stand for? FPC stands for Flexible Printed Circuit, known in Chinese as a flexible printed circuit board, commonly abbreviated as a flexible board. FPC is a highly reliable, exceptionally flexible printed circuit board manufactured using polyimide or polyester film as the substrate material, also referred to as a flexible circuit board or

Component spacing design on PCBA represents a pivotal aspect of electronic product development, where precision directly influences circuit electrical performance, thermal efficiency, manufacturing feasibility, and the stable operation of the final product. Component spacing is not merely a matter of spatial allocation, but rather an art form that comprehensively considers electrical safety, thermodynamics, signal integrity,

LED lighting products’ efficiency, energy-saving properties and extended lifespan have driven their increasing market prevalence. At the core of these products, LED light pcb design is pivotal in ensuring luminaire performance, thermal management and reliability. This article delves into each stage of the LED PCB design process to assist you in creating an outstanding LED

In electronic manufacturing, PCB board quality forms the cornerstone for ensuring device performance and reliability. However, within complex production processes, multiple factors may induce various defects in PCBA, thereby compromising the final product’s functionality. This article delves into four prevalent defect categories in PCBA manufacturing: delamination, plated-through-hole copper fractures, pcb board warping and buckling, and

PCB chamfering, simply put, involves bevelling the edges of printed circuit boards. This process is typically carried out after the boards have been cut, using specialised chamfering machinery or hand tools to transform the board’s right-angled edges into bevelled surfaces at a specific angle. This treatment not only enhances the aesthetic appearance of the circuit

The definition of PCBA contaminants refers to any surface deposits, impurities, inclusions, or adsorbed substances that reduce the chemical, physical, or electrical performance of the PCBA to an unacceptable level. The main aspects include the following: Classification of PCBA Contaminants Typical PCBA cleaning processes Solvent Cleaning Semi-Aqueous Solutions Water-based cleaning PCB ion cleanliness testing methods

UPS PCB, short for uninterruptible power supply printed circuit board, is the core control board of the UPS system. It is primarily responsible for providing emergency power to equipment when the main power supply is interrupted. UPS PCBClassification ⑴ Offline Square Wave Output UPS Power Supply: Its single-unit output power is approximately 400–2000 VA. When

After the PCB circuitry is etched, a layer of ink (green ink, blue ink, black ink, etc.) needs to be applied. However, ink is liquid and has flowability. During the curing process after application, uneven ink distribution may occur, primarily around drill holes. In such cases, certain areas may appear under a magnifying glass to

In today’s highly integrated electronic product era, circuit boards serve as core components, and pcb manufacturing costs directly impact the market competitiveness of the final product. Accurately understanding the composition of PCB expenses, mastering their calculation methods, and effectively implementing cost optimisation strategies are key to manufacturers and design engineers maintaining a competitive edge in

What is a presensitized PCB board?A presensitized pcb board is a special type of printed circuit board with a photosensitive surface. It supports photolithography technology and can be adjusted using ultraviolet light. Despite common misconceptions, presensitized PCBs are similar to standard copper-clad PCBs, but essentially involve transferring graphics onto the board. Presensitized printed circuit boards

PCB board serves as the core components of electronic products, and their quality directly impacts the performance and reliability of the final product. With the rapid advancement of electronic technology, PCB design has become increasingly complex, with higher density and integration levels. This has led to higher demands on PCB inspection, rendering traditional inspection methods

EMI radiation consists of electric and magnetic fields, which disrupt the normal operation of electronic devices. These electromagnetic waves propagate within electronic devices and interfere with electrical components, with their ratio referred to as wave impedance. To reduce EMI, we use metal cans (Faraday cages) to encapsulate electronic circuits on printed circuit boards (PCBs), which

The pcb grounding plane on a PCB is typically a large metal area connected to the circuit ground. This metal area may only occupy a small portion of the board or, in multi-layer designs, it can span an entire layer. Depending on design requirements, it may even span multiple layers. Grounding, in simple terms, is

A PCB board layer typically refers to the number of conductive layers within a printed circuit board (PCB). These conductive layers are made of copper foil and are a critical component for establishing electrical connections between electronic components. The design of the number of layers in a PCB directly impacts its performance, cost, and application

Conductive via holes, also known as through holes, pcb via must be filled to meet customer requirements. After extensive testing, the traditional aluminium plate filling process has been replaced with a white mesh to complete the solder mask and filling of the PCB surface. This ensures stable production and reliable quality. Via holes serve to

PCB pad is a critical component of printed circuit boards, serving as the interface between electronic components and the circuit board for establishing electrical connections and mechanical support. The quality of pad design directly impacts component soldering reliability, overall product performance, and manufacturing process efficiency. PCB pad widthThe width of the PCB pad should be

The pcb aspect ratio, which is the ratio of the length to the width of the circuit board, is a critical parameter in electronic design. The aspect ratio refers to the ratio of the length to the width of the circuit board, and it not only affects the physical dimensions and layout of the circuit

Electroplating via filling is a key technology in the field of modern high-density electronic packaging. It not only greatly enhances the design flexibility and performance of PCB boards, but also demonstrates significant advantages in product reliability, heat dissipation capabilities, and production efficiency. This article will explore the many advantages of electroplating via filling in depth