Wire bonding is a method of connecting metal leads to pads, i.e., it is a technique for connecting internal and external chips. Structurally, the metal leads act as a bridge between the chip’s pads (primary bonding) and the carrier pads (secondary bonding). In the early days, lead frames (lead frame) were used as the carrier […]
The circuit board on ac unit is a key component that ensures the efficient operation of the system. It acts as the central nervous system, controlling and coordinating the various functions of the AC unit. The core function of the circuit board is to receive and process data from various sensors. These sensors, which usually
PCB manufacturing is a complex and delicate process that involves numerous matching points,and the slightest mishap can lead to defects in the board, which in turn affects the quality of the entire PCB.Common quality problems such as short circuits and open circuits often stem from multiple factors. Common causes of defects in PCB manufacturing include:Short
The board edge connector is an important electronic component that plays an indispensable role in modern electronic equipment. Its main function is to provide electrical connection and signal transmission, usually used to connect the motherboard with other peripheral devices or modules. The board edge connector usually consists of multiple metal contacts, insulating material, and a
Wireless charger pcb, as the name suggests, is a circuit board used for wireless charging of mobile phones. It adopts advanced wireless charging technology, which transmits electricity to the mobile phone battery through electromagnetic induction, realising a charging method without plugging and unplugging. This technology is not only convenient and fast, but also effectively avoids
Microphone PCB is a key component of audio equipment, mainly used to support the microphone’s electronic components and circuit connections. A microphone is a device that converts sound signals into electrical signals, and microphone circuit boards can be divided into two main types: dynamic and condenser. Moving Coil Microphone PCBA moving coil microphone vibrates the
Selective soldering is a soldering technique used to connect electronic components to circuit boards, primarily to achieve precise solder joints, often in complex circuit designs. This method of soldering is characterised by the fact that only specific parts are soldered, rather than the entire assembly being fully heated, thus minimising the effect of heat on
Flip Chip Bonding is a highly efficient semiconductor packaging method widely used in high performance electronic devices. This technique achieves compact package design and excellent electrical performance by inverting the chip and soldering it to the substrate.Flip chip soldering usually uses solder balls or solder joints to fix the chip to the printed circuit board
PCB terminal strip refers to the connection terminals on the PCB board, usually used to connect to other circuits or devices. It is connected to other electronic components through various interfaces (such as pins, terminals, etc.). This design not only improves the stability of the connection, but also facilitates maintenance and replacement at a later
In the field of electronic engineering technology, breadboard vs pcb is two widely used tools in different stages of circuit design and development. Breadboards serve as a recyclable platform for building and testing electronic circuits without soldering. Its structure consists of a grid of interconnected holes that allow for the quick insertion, removal and relocation
Transistor surface mount, also known as chip transistors, are developed from conventional plug-in transistors, which have the same core, only the package is different, and most of them follow the plug-in transistor’s prototype number. Transistors are smaller in size and lower in profile than traditional through-hole transistors. Transistors are one of the crucial semiconductor components
The PCB Bus Bar is one of the key components of a printed circuit board (PCB) and is primarily responsible for the transmission of current on the board. It is often presented as a flat metal bar with excellent conductivity and is widely used in electronic devices, circuit boards and electrical systems to transmit power,
High Current PCB is circuit board designed specifically for the needs of high current applications. Compared to standard boards,they are characterised by thicker layers of copper, wider wires and excellent thermal conductivity, which allows for more efficient management and distribution of high-current loads. These boards are used in a wide range of applications such as
PCB board is often designed for small-current applications, so what can be done to enhance PCB boards to withstand larger currents? After all, the current demand of the electronic products we use daily is usually only between tens of milliamps to a few amps, and if we suddenly encounter a high current of tens of
Hot swappable pcb is a technical operation in which circuit boards are inserted or removed from a system that operates under power. This technology allows users to replace or upgrade circuit boards without powering down or disconnecting the system, thereby improving system reliability, quick repairs, redundancy, and timely recovery from disasters. Hot-plugging is a way
A pcb battery is a small battery on a circuit board that is used to store the board’s setup or calibration data to ensure that the board can be restored to its original operating state after a long period of inactivity. In some special cases, such as temperature sensors,the pcb battery can also provide power
Ceramic semiconductor materials are made up of a range of compounds which mainly include metal oxides, nitrides and carbides. Among the common ceramic semiconductor materials, zinc oxide (ZnO), barium titanate (BaTiO3) and silicon nitride (Si3N4) occupy an important position. These materials are made by sintering ceramic raw materials under high temperature conditions. As a result
A circuit diagram is a pictorial representation of the connections of a circuit using graphical symbols and lines. It is a combination of specific symbols and lines that clearly shows how the electronic components Q are connected, where the current flows, and how the circuit works. Circuit diagrams can be divided into different types such
Active RF circuits are RF circuits that require an external power source to function properly. Such circuits usually contain components such as amplifiers, mixers, and voltage-controlled oscillators, and are capable of increasing the gain of the signal, modulating the frequency and amplitude of the signal, and are highly resistant to interference. Compared to passive circuits,
Nelco N4000 13 is a very high quality multilayer sheet that is carefully crafted from glass fibre and epoxy resin, with the number of layers varying between approximately 8 and 16, while its thickness varies between 0.25 mm and 5.6 mm. The material’s high insulating ability, excellent thermal stability and strong mechanical strength make it
The hard drive printed circuit board is a key component of a hard disc. It consists of one or more layers of glass fibre substrates stacked on top of each other and covered with various electronic components, such as integrated circuits, connectors, capacitors, and so on. In the operation of a hard disc, the circuit
SMT high temperature soldering technology is a soldering method that uses peak soldering temperatures in excess of 220°C in the SMT (or Surface Mount Technology) process. This technique is typically implemented in the 245 to 247°C temperature range to ensure that the solder paste and the BGA (ball grid array) solder balls are able to
A cold solder joint is a soldering phenomenon that occurs when the required minimum wetting temperature between the brazing material and the base metal is not reached, or when the metallurgical reaction fails to proceed adequately despite the fact that wetting occurs in some localised areas. When this phenomenon occurs, it means that there is
DIP package assembly, also known as Dual In-line Package (DIP), is an assembly method that requires the pins of an electronic component to be inserted into a through-hole of a printed circuit board (PCB), and then secured using soldering techniques such as wave soldering. The DIP package process is particularly suitable for larger electronic components
