What is decoupling capacitor?It is a capacitor installed in the power supply side of the component in the circuit, this capacitor can provide a more stable power supply, but also can reduce the component coupled to the power supply side of the noise, and indirectly can reduce the other components by the impact of the […]
PFC circuit is a power factor correction circuit that is an important component used in electronic equipment to improve the power factor of the AC power supply, reducing the negative impact on the network and the power plant, as well as improving the energy efficiency of the equipment. It consists of three main components: an
Traditionally, Through Hole Technology (THT) has been used to build most printed circuit boards (PCBs).However,in recent years,the use of surface mount technology (SMT) has become increasingly popular and is gradually replacing through-hole mount technology. What is through-hole insertion technology?Through-hole insertion technology inserts components with tails or leads into pre-drilled holes in the PCB. These components
FPGA, or Field Programmable Gate Array, is an integrated chip composed of digital circuits, which belongs to a kind of Programmable Logic Device (PLD). It appears in the form of semi-customized circuits in the field of Application Specific Integrated Circuits (ASIC), which not only solves the shortage of customized circuits, but also breaks through the
What is chassis ground?Chassis ground is the metal chassis in the enclosure and establishes a connection to the chassis. Chassis ground is usually connected to earth at the point where power enters the power supply and can provide noise absorption or safety protection for parts of the system. What are the types of PCB grounds?Depending
PCB circuit boards play a pivotal role in electronic equipment, not only carrying various types of electronic components, but also responsible for their precise connection to ensure stable and reliable operation of the circuit. So, in the design and production of PCB circuit boards, how to connect components on pcb？ The most common method of
What is a PCB antenna? As the name suggests, it is a PCB printed on an alignment, which can be drawn as a straight line alignment, reversed F-shaped alignment, snake or circular alignment, etc., the length of a quarter wavelength can basically form an antenna to radiate electrical signals out or receive signals. Design elements
Since the copper layer on the PCB board is easily oxidized, the resulting copper oxide layer can seriously degrade the soldering quality and thus the reliability and effectiveness of the final product. In order to avoid this situation, the need for pcb surface treatment. Some information will be talking about the surface molding, board factory
A pewter bead is a small, round ball-like substance that forms when tin is extruded between the pad and the component foot during the soldering process. The generation of solder beads is mainly related to the soldering temperature, flux and the surface condition of the printed wiring board. Reflow soldering in the tin bead generation
PCB circuit board blind vias are holes in multilayer circuit boards that are used to connect different levels of internal lines, but do not run through the entire plate. Blind vias play an important role in increasing line density, reducing board size and enhancing circuit performance. Blind buried blind holes is a multilayer circuit board,
Resin Plug Hole refers to the use of resin material to fill holes and defects in circuit boards to repair functional defects in circuits. Holes and defects in a circuit board may be created by processes such as drilling, plating, pressing, etc., or they may be designed to achieve specific electrical properties. For example, Via
Virtual Welding is a common wiring fault, it refers to the solder joints at the solder joints are not completely effective welding together, resulting in poor contact, may appear on and off. Virtual soldering refers to the component pins, soldering ends, PCB pads at the tin is not sufficient, the wetting angle of the solder
Automated optical inspection (automatedopticalinspection,AOI) technology, also known as machine vision inspection (machinevisioninspection,MVI test) technology or automatedvisualinspection (automatedvisualinspection,AVI) technology. In some industries, such as flat panel display, semiconductor, solar and other manufacturing industries, the term AOI is more popular and known. However, there are still subtle differences between AOI and MVI/AVI in terms of concept and
SOP Package is a form of packaging used in the manufacture and assembly of electronic components.SOP package is a surface mount technology (Surface Mount Technology, SMT), which solder the pins of electronic components to the surface of a printed circuit board (Printed Circuit Board, PCB) instead of connecting them through a perforated hole. SOP package
PCB cutter is a mechanical equipment specialized in cutting circuit boards. It cuts circuit boards accurately and quickly by means of a high-speed rotating cutting tool to meet the needs of different electronic products on the size and shape of circuit boards. Cutting is the first step in material analysis. The choice of cutter as
In the electronics manufacturing industry, Through Hole vs SMD (Surface Mount Device) are two commonly used ways of mounting circuit board components, which play an indispensable role in the design and manufacturing of electronic products. Although they have their own characteristics and advantages, in many cases they are complementary, and together they contribute to the
FFC connectors and FPC connectors are often confused. Although both are flexible cable connectors, but FFC connectors and FPC connectors are still a certain degree of difference. FFC is a flexible flat cable (Flexible Flat Cable) connectors, FPC is a flexible printed circuit (Flexible Print Circuit). In terms of the manufacturing of the two, the
Copper Through Hole Filling (THF) technology is a major technological breakthrough that addresses the challenges of high-frequency thermal management and signal integrity while improving wiring density and interconnect reliability.Comparing THF and Conductive Paste Fill Through-Hole process, Conductive Paste Fill Through-Hole process involves multiple steps that are difficult to control, high production cost, and the fill
AOI, or Automatic Optical Inspection, is a device based on optical principles to detect common defects encountered in welding production. AOI is a newly emerging new testing technology, but it is developing rapidly, and many manufacturers have introduced AOI test equipment. When AOI is used, the machine automatically scans the PCB with a camera, captures
What is the difference between SiP VS SoC?SiP package ( System In a Package) is a single standard package that assembles multiple active electronic components with different functions and optional passive devices to realize a certain function. SOC chips, on the other hand, are a type of system-level integration that achieves greater efficiency by integrating
BGA (Ball Grid Array) package, or Ball Grid Array package, is an array of solder balls on the bottom of the package substrate to serve as the I/O terminals of the circuits to be interconnected with the printed circuit board (PCB). Devices packaged with this technology are surface mount devices. BGA packaging classification Advantages of
SMT, or Surface Mount Technology, is a technology for mounting electronic components directly onto the surface of a PCB (Printed Circuit Board). Compared with the traditional through-hole insertion technology, SMT has the advantages of high density, high reliability, low cost and so on, so it is widely used in modern electronic products. SMT process flow
What is osp? OSP is a RoHS compliant process for the surface treatment of copper foil on printed circuit boards. It is short for Organic Solderability Preservatives, which translates to Organic Solderability Film, also known as Copper Protectant, and also known as Preflux in English. method to grow a layer of organic film. This film
In the PCB industry, 1OZ copper thickness means the thickness of 1OZ of copper uniformly laid flat over an area of 1 square foot (FT2). It is the average thickness of copper foil expressed in terms of weight per unit area. It is expressed by the formula, i.e.,1OZ = 28.35g/ FT2 (FT2 is square feet,
