Solder mask in pcb, is also called PCB solder mask film in flexible circuit boards, using green, yellow, red, black, blue and other photosensitive inks sprayed on the surface of the PCB circuit board.Solder Mask is a protective layer applied to the surface of a circuit board that prevents short circuits from occurring when other […]
Silicon chip is silicon wafers used to make silicon semiconductor circuits, the original material of which is silicon. High purity polycrystalline silicon is dissolved and doped into silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. Silicon crystal rods are ground, polished, and sliced to form silicon wafers, also
Cirucit board transparent is a new type of circuit board material whose main components are PET (polyester film) and ITO (Indium Tin Oxide) film. Compared to traditional circuit boards, transparent circuit boards have higher transparency, compressive strength and stability. Transparent circuit boards can be customized into different shapes and structures according to customer requirements and
A bypass capacitor is a capacitor connected in parallel with a part or component in a circuit. It provides a selective low-impedance path that allows current, signal, or noise to bypass a particular part or component. A bypass capacitor can improve the performance of a circuit by adjusting its capacitance to selectively direct signals or
PCB Resistor Calculator, also known as Chip Fixed Resistor, is a tool for calculating the resistance value of chip resistors. It can calculate the required chip resistor type and resistance value according to the user’s input parameters such as resistance value, accuracy, package type, and so on. Using Chip Resistor Calculator allows you to easily
A ground plane antenna is a low-frequency antenna used for the transmission of radio waves, and is mainly used in ground plane communication systems to transmit low-frequency electromagnetic wave signals. A ground plane antenna is a low frequency antenna used in ground wave communication systems to transmit low frequency electromagnetic wave signals. Ground plane antenna
A microprocessor is a central processor consisting of one or a few large-scale integrated circuit. These circuits perform the functions of control and arithmetic logic components. The microprocessor is the arithmetic control part of a microcomputer, and can perform operations such as fetching and executing instructions, as well as exchanging information with external memory and
PCB silver plating is the plating of silver on the circuit board, which can play a role in protecting the pads and increase the conductivity of the circuit board. The advantage of silver plating is the ability to control board impedance and reduce signal attenuation of high frequency signals. In addition, silver plating has good
What is fr4 plate?fr4 plate is a commonly used insulating substrate composed of glass fiber and epoxy resin. It has good electrical insulation properties and mechanical strength, and is suitable for the manufacture of electronic circuit boards. Where “fr” is the English abbreviation for “flame retardant”, and fr4 sheet is a material that meets the
Patches pcb, also known as chip repair technology, is a state in the absence of drawings, to complete the circuit board line detection, component detection, fault diagnosis, repair of professional technology. Circuit board repair is broadly applicable to any equipment board, currently received technology, cost market demand and other factors, circuit board repair mainly refers
Circuit board circuit schematic is the circuit board of each electronic component using the prescribed graphic symbols, and with the use of wires to the graphic symbols of each electronic component pins connected in accordance with certain rules, the use of graphic connection relationship to illustrate the circuit board between the unit circuit power supply,
Aluminum printed circuit board refers to a kind of printed circuit board with aluminum plate as the substrate, and copper conduction lines are processed on the surface through chemical etching or mechanical processing, etc. to form a circuit board. It is characterized by good thermal conductivity, mechanical strength and stability, and is suitable for use
HDI step refers to the complexity of the manufacturing process of HDI boards, generally with the accumulation of layers (Build-up) to manufacture HDI boards, the more the number of layers, the higher the HDI process, the higher the technical grade of the board is also higher. HDI order can be divided into the following categories.HDI
Wafer Level Packaging (WLP) is an advanced packaging technology that refers to the direct encapsulation of chips onto wafers to form a complete whole (similar to a microcircuit), and the final product is a chip module containing chips, pins and connecting wires. There are three main technology routes for wafer-level packaging: BGA (Ball Grid Array),
What is pcb warpage?Board warpage refers to the degree of surface bending and deformation of the circuit board, usually evaluated by two indicators, namely, the maximum warpage and the average warpage. The warpage of the circuit board will affect its use in practical applications, so it is very necessary to carry out strict control. Standards
What is Flex PCB? A Flex PCB is a printed circuit board that can be bent and folded to accommodate different shapes of materials, and it can be bent and twisted without easily breaking the material. Flex PCBs are usually made of elastic materials such as polyurethane and rubber. These materials are used in a
HDI pcb (High Density Interconnector), that is, high-density interconnect board, is the use of micro-blind buried hole technology of a line distribution density is relatively high circuit boards. HDI boards have an inner layer of lines and outer layer of lines, and then the use of drilling holes, holes, such as metallization and other processes,
Rigid-flex PCB designs combine rigid and flexible board technologies. In most rigid-flex boards, flexible circuit substrate layers are attached to one or more rigid boards internally, externally, or both, depending on the design specifications of the application. Typically, rigid-flex printed circuit boards are produced with a flexible polyimide material on a copper-clad substrate that is
What is a Gerber file?Gerber, also known as “light drawing”, serves as an intermediate medium for converting designed graphic data into PCB or FPC manufacturing, i.e., a CAD-CAM data conversion format standard, the main purpose of which is PCB or FPC board drawing, which is ultimately used by FPC manufacturers to complete PCB production. The
What is FPGA?FPGA board, that is, Field Programmable Gate Array, which is a product of further development on the basis of programmable devices such as PAL, GAL, CPLD, etc. It appears as a semi-custom circuit in the field of Application Specific Integrated Circuits (ASIC). It is as a special integrated circuit (ASIC) in the field
Ceramic Printed Circuit Board is advanced circuit boards that offer superior performance and reliability, especially in demanding high-performance electronic applications. Unlike conventional circuit boards made from organic materials such as fiberglass or epoxy, ceramic PCB is manufactured using ceramic materials, which gives them unique properties and features. These boards are designed to excel where high
PCB layer stack, also known as PCB layering, is a common practice in electronic design, especially in devices that require high density and high speed signal processing. The central goal is to increase functionality and speed by stacking multiple circuit boards in the same device. How does PCB layering work? In a nutshell, it accomplishes
Analog Integrated Circuits (AIC) is a circuit that integrates multiple analog electronic devices and circuits on a single chip. It is mainly used for processing, transmission and control of analog signals. Analog integrated circuits include various functional analog circuit components such as amplifiers, filters, oscillators, etc., which are capable of accurate processing and conversion of
The solder melting temp and selection method of tin solder is different for different ratios of tin and lead, but it is always lower than the melting temperature of any of the pure metals that make up the alloy. For different soldering parts and soldering environments, it is necessary to choose solder with different melting
