In this era swept by the digital tide, the importance of data centres and communication networks as pivotal hubs for information flow is self-evident. High-frequency optical module pcbs (800G and above), akin to crucial “neurons” within these hubs, shoulder the responsibility of high-speed data transmission, serving as core components that ensure the efficient operation of […]
In the ongoing evolution of optical module technology, PCB circuit boards face immense pressures across multiple dimensions—signalling, spatial constraints, thermal management—which continuously challenge their performance in material selection, process precision, and design logic. Specifically, core challenges manifest in the following four critical areas: (1) The Integrity Dilemma of High-Speed Signal TransmissionAs signal rates increase exponentially—soaring
In the present era of rapid and unprecedented advancements in artificial intelligence technology, AI servers have emerged as the pivotal infrastructure underpinning computational power, their significance growing ever more pronounced. High layer PCBs and flip-chip ball grid array (FC-BGA) substrates, serving as critical components within AI server PCBs, function akin to the heart and neural
As a core component in optical communications, the stability and reliability of optical modules are paramount. The optical modules pcb design not only determines their electrical performance but also plays a decisive role in thermal management, signal protection, and manufacturability. In the evolution of optical modules, PCBs predominantly adopt HDI structures—whether mechanical blind-via HDI, laser
Drone antennas, in essence, are devices mounted on unmanned aerial vehicles for receiving and transmitting radio waves. They serve as the bridge enabling communication between the drone and the external environment, ensuring the precise transmission of flight commands and the real-time return of flight data. Depending on the application scenario, drone antennas can be categorised
AI server PCBs serve as the core electronic components within artificial intelligence servers, connecting and supporting critical elements such as processors, memory, accelerators, and power management systems. They enable high-speed signal transmission, high-power-density power delivery, and efficient thermal management to meet the demands of AI computing for large-scale data processing and high-speed operations. Amidst the
The optical module PCB serves as a pivotal component for achieving electro-optical conversion, playing a crucial role within communication systems. It facilitates the transformation of electrical signals into optical signals, or vice versa, thereby ensuring efficient, long-distance data transmission through optical fibres. When designing optical module PCBs, multiple factors must be thoroughly considered, including signal
The drone antenna is a multifunctional component that facilitates video transmission, remote control, GPS reception, data transfer, FPV experience, signal range extension, and signal quality enhancement. Its importance in ensuring the drone’s smooth operation and functionality cannot be overstated. How the Drone Antenna FunctionsThe drone antenna essentially receives and transmits electromagnetic waves, acting as the
In single-sided board designs, only one side features copper foil traces (i.e., the solder side), with electronic components placed exclusively on the opposite side (i.e., the component side). In double-sided and multilayer boards, both sides contain copper foil traces and can accommodate surface-mount devices (SMDs). Here, the ‘component side’ typically denotes the side housing the
Bridging is one of the common defects in PCBA processing, particularly during the SMT placement process. The occurrence of bridging issues often severely impacts product quality and reliability. Bridging can lead to circuit short-circuits, signal interference, and even cause product functional failure. Causes of bridging:PCB design flaws: When large or heavy components are concentrated on
In the field of pcb board manufacturing, the precision and stability of processes directly impact product quality and performance. From substrate pre-treatment to the lamination and forming of multilayer boards, through to the fabrication of special structures such as step grooves and the control of board warpage, each stage involves intricate technical considerations and rigorous
PCB blistering refers to localised swelling or bulging occurring within or on the surface of printed circuit boards (PCBs) during production or use. This phenomenon typically manifests as separation between the substrate and copper foil, solder mask, or other layers, forming bubbles or voids. Causes of PCB BlisteringSubstrate Processing IssuesParticularly concerning thinner substrates (generally below
PCB blue glue is a blue viscous adhesive classified as a peelable solder resist material. Applied to PCB surfaces via screen printing or foil printing, it cures to form a protective film that effectively isolates non-target areas during processes like soldering and electroplating. This prevents solder, chemicals, and other substances from adhering, thereby safeguarding pads,
A breadboard is a reusable platform for building and testing electronic circuits without soldering. It consists of a grid of interconnected holes that allow for quick insertion and rearrangement of components and wires. Breadboards are ideal for preliminary circuit design and experimentation because they enable easy modification and troubleshooting. Basic Steps for Using a BreadboardTo
Within the physical infrastructure of electronic circuits, PCB circuit boards and FPCBs (flexible printed circuit boards) stand as the two core types supporting electronic components. Leveraging their distinct material properties and functional advantages, they span applications from traditional industrial equipment to cutting-edge consumer electronics. PCBs provide stable support through rigid structures, while FPCBs achieve breakthroughs
What is a flexible LED PCB? A flexible LED PCB is a circuit board that can be bent and twisted without damage. Its flexibility stems from the use of flexible plastic substrates such as polyimide, replacing the rigid fibreglass employed in traditional PCBs. This pliability makes it an ideal choice for applications with limited space
In modern wireless communication systems, antennas serve as the “bridge” connecting electromagnetic waves with electronic devices, their performance directly determining signal transmission efficiency and stability. With technological evolution, ceramic antennas have gradually become core components in high-frequency communications and satellite navigation, leveraging dual advantages in materials science and process innovation. Meanwhile, traditional metal antennas continue
Ceramic antennas are not conventional ‘ceramic products’ but rather miniature antennas formed by integrating metal conductors (such as silver or copper) with ceramic dielectric materials through precision manufacturing processes. Their core principle leverages the propagation characteristics of electromagnetic waves within ceramic media: ceramic materials possess high dielectric constants and low loss properties, enabling significant reduction
Onboard antennas are built directly into the vehicle’s electronics system. Unlike traditional external antennas that protrude from the vehicle, onboard antennas are seamlessly integrated within the vehicle’s design. This integration not only enhances the vehicle’s aesthetics but also improves its functionality. Types of Onboard AntennasPCB Antennas: These are compact antennas printed directly onto a circuit
Onboard antenna refer to antennas directly integrated onto a printed circuit board (PCB). Compared to traditional external antennas, they offer advantages such as compact size, low cost, and manufacturing flexibility. The operating principle of onboard antenna involves designing and routing conductive traces or metal lines on the PCB to enable wireless signal transmission and reception.
Ceramic circuit boards utilise ceramic as the substrate material, upon which metallic circuits are constructed and conductive vias formed. Ceramics encompass a diverse range of materials, with commonly employed types including aluminium oxide, aluminium nitride, zirconium oxide, silicon carbide, and silicon nitride – all classified as inorganic non-metallic materials. The fabrication of ceramic discs or
An 8-layer pcb features one circuit layer on each of the top and bottom surfaces, with six intermediate ground and power planes. This structure enhances the board’s stability and reliability while significantly reducing electromagnetic noise and interference. In practical applications, 8-layer pcbs are primarily employed for high-speed signal transmission and complex circuit designs. An 8-layer
The PCB laminate structure primarily comprises three key base materials: copper foil, prepreg (semi-cured sheet), and core board (also known as substrate). Taking a common 8-layer PCB laminate structure as an example, the uppermost layer is the surface copper foil, followed sequentially by prepreg, core, with prepreg and core alternately stacked, and the bottom layer
Within the field of electronic components, ceramic capacitors occupy a significant position, with multilayer ceramic capacitor (MLCC) and single-layer ceramic capacitors (SLCC) being two common and widely applied types. Although both fall under the category of ceramic capacitors, they exhibit numerous significant differences in structure, performance, manufacturing processes, and material selection. MLCC and SLCC are
