EMI radiation consists of electric and magnetic fields, which disrupt the normal operation of electronic devices. These electromagnetic waves propagate within electronic devices and interfere with electrical components, with their ratio referred to as wave impedance. To reduce EMI, we use metal cans (Faraday cages) to encapsulate electronic circuits on printed circuit boards (PCBs), which […]
The pcb grounding plane on a PCB is typically a large metal area connected to the circuit ground. This metal area may only occupy a small portion of the board or, in multi-layer designs, it can span an entire layer. Depending on design requirements, it may even span multiple layers. Grounding, in simple terms, is
A PCB board layer typically refers to the number of conductive layers within a printed circuit board (PCB). These conductive layers are made of copper foil and are a critical component for establishing electrical connections between electronic components. The design of the number of layers in a PCB directly impacts its performance, cost, and application
Conductive via holes, also known as through holes, pcb via must be filled to meet customer requirements. After extensive testing, the traditional aluminium plate filling process has been replaced with a white mesh to complete the solder mask and filling of the PCB surface. This ensures stable production and reliable quality. Via holes serve to
PCB pad is a critical component of printed circuit boards, serving as the interface between electronic components and the circuit board for establishing electrical connections and mechanical support. The quality of pad design directly impacts component soldering reliability, overall product performance, and manufacturing process efficiency. PCB pad widthThe width of the PCB pad should be
The pcb aspect ratio, which is the ratio of the length to the width of the circuit board, is a critical parameter in electronic design. The aspect ratio refers to the ratio of the length to the width of the circuit board, and it not only affects the physical dimensions and layout of the circuit
Electroplating via filling is a key technology in the field of modern high-density electronic packaging. It not only greatly enhances the design flexibility and performance of PCB boards, but also demonstrates significant advantages in product reliability, heat dissipation capabilities, and production efficiency. This article will explore the many advantages of electroplating via filling in depth
RF cable assembly is cable that transmit radio frequency (RF) signals from one device to another. They consist of coaxial cable and RF connectors at both ends. Coaxial cable has a central conductor surrounded by an insulating layer and a shielded outer conductor. RF connectors are designed to match the impedance and frequency range of
What is a RF cable? A RF cable is a type of cable used for transmitting high-frequency signals, and its construction differs from that of ordinary cables. RF cable typically consist of the following four layers:Inner conductor: A central metal wire (copper or silver-plated copper) responsible for signal transmission. Insulation layer: A dielectric material (such
As a core component of electronic devices, the performance stability of RF circuit boards directly affects the overall operational effectiveness of the device. However, in complex electromagnetic environments, RF circuit boards are highly susceptible to various forms of electromagnetic interference, which can lead to performance degradation or even failure. Therefore, implementing effective shielding measures to
RF pcbs are core components in electronic devices, and their performance stability directly affects the overall operational effectiveness of the device. However, in complex electromagnetic environments, RF circuit boards are easily susceptible to various electromagnetic interferences, leading to performance degradation or even failure. Therefore, effective RF PCB shielding is particularly important. Basic Principles of RF
What is a PCB teardrop? A PCB teardrop is an additional copper pad, either straight or circular, located at the connection point between a pad or via and a trace, or when a trace transitions between different widths. For example, if part of your trace width changes from 10 mil to 4 mil, a teardrop
EMI coating is a thin film made from materials that shield electromagnetic interference signals, capable of blocking the propagation of electromagnetic waves. EMI coating is typically made from conductive materials and can be applied via adhesion or spraying to the external surfaces or internal structures of various electronic devices. EMI signal shielding coatings can be
A graphics card circuit board, also known as a graphics card motherboard or graphics card PCB, is a circuit board used to transmit signals from the graphics processing unit (GPU). It is a very important component inside a computer, working in conjunction with the CPU and memory to ensure that the computer can handle high-load
On a graphics card pcb, the power supply section is just as critical as the graphics processing unit (GPU). If the GPU is the ‘brain’ of the graphics card, then the power supply section is its ‘heart.’ Without a robust ‘heart’ providing foundational support, even the most powerful ‘brain’ cannot function properly. Additionally, the design
What is coverlay in fpc?FPC coverlay is polymer film made from materials such as polyimide (PI), primarily used to protect and insulate the external circuits of flexible PCB. FPC coverlay is the earliest and most widely used technology in the application of cover layers for flexible printed circuit boards. FPC coverlay primarily serves to protect
PCB overmolding is a technique that involves coating printed circuit boards (PCBs) with protective polymer resin. This process is designed to protect PCBs from external factors such as humidity, dirt, and temperature fluctuations. During the pcb overmolding process, the polymer resin is injected and cured around the PCB circuitry, forming a tight and secure seal.
PCB warping is a common quality issue in surface mount technology (SMT) processing, severely affecting the performance and reliability of electronic products. This phenomenon is not caused by a single factor but rather the combined effect of multiple factors. Gaining a deep understanding of these underlying causes is key to effectively preventing and resolving PCB
In the field of electronic product manufacturing, solder contamination on PCB gold fingers is a common and challenging issue that significantly impacts product performance and reliability. Especially during critical processes such as solder paste printing and reflow soldering, even minor operational errors or environmental factors can cause solder paste to accidentally adhere to the gold
The production process for high-frequency microwave pcb is complex and requires extremely high precision, encompassing multiple critical stages from engineering data processing to final forming. To ensure product quality and performance, manufacturers must strictly adhere to specific operational procedures and control points at every stage of the process. Challenges in high-frequency microwave pcb processing: Key
The manufacturing of microwave pcb has multiple distinctive features, primarily manifested in the diversity of substrate materials, stringent requirements for design precision, computer-controlled manufacturing processes, specialised graphic production, diverse surface coating options, CNC-controlled shape processing, and automated batch production inspection equipment. Substrate Material DiversityThe miniaturisation and integration of microwave devices have imposed higher demands on
PCBA test fixtures, also known as ‘test fixtures, play a crucial role in the PCBA manufacturing process. They are primarily used to conduct comprehensive testing on PCBs that have undergone SMT placement and DIP insertion processes. These tests primarily include ICT testing and FCT testing, which utilise test points to verify the electrical conductivity of
RF connectors are electrical connectors used for transmitting radio frequency signals. They are also referred to as coaxial connectors within the industry, as RF connectors are typically connected to coaxial cables and also have a coaxial structure. Classification of RF connectors:By connection interface structure:Threaded connection: Uses series such as SMC, SMA, TNC, N, UHF, 7/16,
Microstrip patch antennas and their arrays may not be seen much but are the most widely used form of antenna. They are simple in structure and can be formed by a dielectric, a metal conductor patch on top of the dielectric, and a ground plane. Even the intervening dielectric can be an air structure. The
