The white residue on PCB surfaces primarily originates from substances such as polymerised rosin, unreacted activators, and lead chloride or bromides formed by the reaction between flux and solder. Upon absorbing moisture, these substances expand in volume, with some undergoing hydration reactions with water. This leads to increasingly pronounced white residue that proves extremely difficult […]
Ceramic pcb, also known as ceramic printed circuit board, is circuit board manufactured using ceramic materials. Compared to conventional fibreglass-reinforced plastic (FR-4) substrates, ceramic PCBs utilise ceramic substrates, offering significant performance advantages. These include superior temperature stability, enhanced mechanical strength, improved dielectric properties, and extended service life. They are primarily employed in high-temperature, high-frequency, and
What is chip packaging? Chip packaging involves securing a bare die onto a specific substrate through a series of intricate processes, such as dicing, cleaning, bonding, wire bonding or flip-chip soldering. The die is then encapsulated using plastic materials (such as epoxy resin) while leads or solder balls are exposed to facilitate connection with external
Integrated Circuits (ICs) are semiconductor microdevices originating in the 1950s. Through precision manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, and aluminium deposition, semiconductor elements, resistors, capacitors, and interconnecting conductors are fully integrated onto a miniature silicon wafer. This forms circuits with specific functions, ultimately resulting in soldered and encapsulated electronic microdevices. Based on product
The PCB lamination process primarily involves stacking multiple layers of copper foil and dielectric materials (typically FR4, polyimide, or other composites) in a specific sequence. Under high temperature and pressure conditions, an adhesive binds these layers together tightly. The resulting multilayer PCB is a robust and fully functional circuit board capable of reliable operation within
The solder mask is an indispensable component in the manufacture of printed circuit boards, serving primarily to shield metallic components on the board from environmental corrosion, particularly oxidation, while effectively preventing unintended electrical short circuits between pads, known as bridging. During soldering processes such as reflow or wave soldering, where precise control of solder placement
As a core material for high-reliability electronic components, the production process of multilayer aluminium substrates integrates precision machining with materials science, with each step directly impacting the product’s electrical performance and mechanical stability. From substrate surface pre-treatment to final packaging, every stage must strictly adhere to process specifications to ensure the multilayer aluminium substrates meet
Low Temperature Co-fired Ceramic (LTCC), as an advanced electronic packaging technology, employs a thick-film material system to co-fire electrode materials, substrates, and electronic components in a single process through a pre-designed structure. This technology, with its high integration and superior performance, has become a key pathway for achieving miniaturisation and multifunctionality in electronic systems. The
As electronic products accelerate towards lighter, slimmer, smaller and higher-density designs, traditional rigid PCBs struggle to meet specific structural and performance demands. Flexible PCB (FPC), however, shine across numerous sectors including mobile phones, cameras, wearables, medical electronics and automotive electronics, owing to their unique ability to bend, fold and stretch. Particularly in critical areas such
Flexible printed circuits (FPC), owing to their pliable nature, have found exceptionally widespread application within the electronics sector, proving particularly well-suited to scenarios where space is at a premium. As electronic devices continue their trajectory towards miniaturisation, the scope of FPC utilisation grows ever broader. In the assembly stages of numerous consumer products, constrained by
The precision and reliability of electronic manufacturing hinge upon a comprehensive technical standards framework. From electrostatic discharge protection to soldering techniques, and from cleaning methodologies to material testing, international standards such as IPC and EIA provide quantifiable, traceable operational guidelines. These serve as the cornerstone for safeguarding product quality and enhancing production efficiency. IPC-ESD-2020 Electrostatic
As an indispensable component in electronic products, circuit boards undertake the vital tasks of electrical transmission and connection. The colours we observe on pcb boards are actually the hues presented by their surface coating materials. Common coating colours include yellow, green, red, blue, and others. So why are different colours applied to circuit boards? There
High-speed pcb board circuits typically refer to digital circuits operating at very high speeds, which is related to the clock pulse frequency required by digital circuits. These pulses are rectangular waveforms. High-frequency circuits generally denote radio wave frequencies, which are sinusoidal waves. Both the transmission and reception circuits for radio waves are typically termed high-frequency
Transparent PCBs are circuit boards manufactured using transparent substrates (such as glass, polyimide or plastic) and transparent conductive materials (such as ITO or silver nanowires), combining electrical conductivity with light transmission. They find extensive application in flexible displays, smart touchscreens and medical devices. Within this manufacturing process, metal masks particularly high-precision laser-cut masks—play a critical
In today’s era of increasingly miniaturised and multifunctional electronic devices, flexible printed circuits (FPC) have become vital bridges connecting critical internal components. However, as technological aesthetics and application scenarios continue to expand, a novel type of flexible circuit board—the transparent flexible printed circuit (Transparent FPC)—is emerging. It not only inherits the flexibility of traditional FPC
With the advancement of modern electronic technology, the trend towards high-frequency signal transmission and high-speed digitalisation has become mainstream, making high frequency PCB design a crucial field of research. High frequency circuit boards are typically defined as boards handling electromagnetic frequencies exceeding 1GHz, imposing heightened demands on substrate properties, routing, and overall design. In high-frequency
Flexible printed circuits (FPC), also known as flexible circuit boards, stand out in the electronics sector due to their high wiring density, lightweight and slim profile, and exceptional bending performance, making them highly favoured within the industry. These unique advantages enable FPCs to adapt flexibly to various complex shapes and size requirements, proving particularly suitable
In the manufacturing and repair of electronic products, soldering electronic components constitutes a fundamental and critical process. To ensure the proper functionality and long-term stability of circuit boards, strict adherence to a series of operational protocols is required from component preparation through to the final completion of soldering. Surface Mount TechnologySurface Mount Technology (SMT) is
Rogers PCB assembly is a core process in the manufacturing of modern high-performance electronic devices. This article aims to detail how, during Rogers PCB assembly, exceptional performance and reliability are achieved through meticulous signal protection, optimized microstrip line and grounding techniques, rational component layout and shielding, as well as rigorous post assembly testing and debugging.
In the field of high frequency pcb circuit design, the quality of material properties directly determines signal transmission efficiency and stability. With the rapid advancement of technologies such as 5G communications, millimeter-wave radar, and industrial IoT, the demand for low-loss, high-reliability circuit materials is increasingly urgent. The RO4000® series hydrocarbon ceramic laminates, leveraging their unique
In RF circuit design, signal interference, power supply noise, and mutual interference between components often become critical factors limiting system performance. Through scientific and rational partitioning design, effectively separating circuit modules with different functions can not only significantly reduce signal interference but also greatly enhance system stability and reliability. High-frequency component separation: Isolate high-frequency components
The laminate structure of RF PCB must consider not only the impedance of RF signal traces but also heat dissipation, current, components, EMC, structural integrity, and skin effect. When layering and stacking multilayer printed circuit boards, we typically adhere to the following fundamental principles: A) Each layer of an RF PCB should feature a large
The CCL (Copper Clad Laminate) lamination process utilizes high-temperature and high-pressure conditions to achieve a tight and robust bond between the copper foil and substrate within the laminate. This process is centered on producing high-quality, high-performance PCBs (Printed Circuit Boards), ensuring the CCL meets the electrical, mechanical, and chemical properties required for PCBs. CCL Laminating
Connections between pcb circuit boards are primarily achieved through conductive connectors, wires, flexible printed circuits (FPC), board-to-board connectors, and soldering techniques. Among these, flexible printed circuits (FPC) serve as a widely adopted connection method, excelling in the creation of reliable, high-density electronic products. Their lightweight, thin profile and excellent flexibility make them highly suitable for
