As electronic products demand increasingly diverse functionalities, pcb board structures have grown ever more complex. Constrained by spatial limitations, PCB circuit boards have progressively “evolved” from single-layer to double-layer and ultimately multi-layer designs. What, then, distinguishes the manufacturing processes of multi-layer PCB boards from those of double-layer PCBs? A multilayer pcb board is a type […]
Ionic cleanliness testing serves as a critical quality control measure for evaluating ionic contaminant levels on pcb boards surfaces. Its primary objective is to prevent electrical faults such as short circuits and corrosion caused by ionic residues, thereby enhancing the reliability of electronic products. Employing techniques such as chemical extraction and conductivity measurement, this test
FR1 pcb is constructed from glass fiber-reinforced epoxy resin laminates. FR1 PCBs are rigid, flat materials composed of thin copper layers on a non-conductive phenolic resin substrate. FR1, fully known as Flame Retardant 1, is a PC film with high insulation and flame-retardant properties. This material not only exhibits excellent flame resistance but also possesses
In electronic manufacturing, circuit boards must be divided into distinct sections to meet the design requirements of various electronic products. Traditional mechanical cutting and punching techniques struggle to satisfy modern production standards. The advent of PCB laser depaneling machines has made this process efficient and precise, not only boosting production efficiency but also ensuring the
OSP (Organic Solderability Preservative) is a surface treatment process for PCBs (Printed Circuit Boards). It involves coating the copper foil surface with an extremely thin organic protective film (approximately 0.2-0.5μm thick) to prevent copper oxidation and maintain solderability. During soldering, high temperatures cause the protective film to decompose, exposing the copper surface to bond with
Ion cleanliness typically refers to the ion cleanliness of pcb board. Residual ions from various materials during the cleaning process can compromise the functionality and reliability of electronic products. Common issues arising from ionic contamination include surface corrosion and crystalline growth, ultimately leading to short circuits. Excessive current flow through connectors may result in the
What does FPC stand for? FPC stands for Flexible Printed Circuit, known in Chinese as a flexible printed circuit board, commonly abbreviated as a flexible board. FPC is a highly reliable, exceptionally flexible printed circuit board manufactured using polyimide or polyester film as the substrate material, also referred to as a flexible circuit board or
Component spacing design on PCBA represents a pivotal aspect of electronic product development, where precision directly influences circuit electrical performance, thermal efficiency, manufacturing feasibility, and the stable operation of the final product. Component spacing is not merely a matter of spatial allocation, but rather an art form that comprehensively considers electrical safety, thermodynamics, signal integrity,
LED lighting products’ efficiency, energy-saving properties and extended lifespan have driven their increasing market prevalence. At the core of these products, LED light pcb design is pivotal in ensuring luminaire performance, thermal management and reliability. This article delves into each stage of the LED PCB design process to assist you in creating an outstanding LED
In electronic manufacturing, PCB board quality forms the cornerstone for ensuring device performance and reliability. However, within complex production processes, multiple factors may induce various defects in PCBA, thereby compromising the final product’s functionality. This article delves into four prevalent defect categories in PCBA manufacturing: delamination, plated-through-hole copper fractures, pcb board warping and buckling, and
PCB chamfering, simply put, involves bevelling the edges of printed circuit boards. This process is typically carried out after the boards have been cut, using specialised chamfering machinery or hand tools to transform the board’s right-angled edges into bevelled surfaces at a specific angle. This treatment not only enhances the aesthetic appearance of the circuit
The definition of PCBA contaminants refers to any surface deposits, impurities, inclusions, or adsorbed substances that reduce the chemical, physical, or electrical performance of the PCBA to an unacceptable level. The main aspects include the following: Classification of PCBA Contaminants Typical PCBA cleaning processes Solvent Cleaning Semi-Aqueous Solutions Water-based cleaning PCB ion cleanliness testing methods
PCBA ion contamination refers to residual charged ion contaminants left behind during the manufacturing process of PCBA (Printed Circuit Board Assembly), primarily originating from flux, chemical cleaners, air humidity, electroplating, wave soldering, reflow soldering, and other process steps. These contaminants may cause issues such as electromigration and corrosion, thereby affecting circuit reliability. Why Conduct Ion
UPS PCB, short for uninterruptible power supply printed circuit board, is the core control board of the UPS system. It is primarily responsible for providing emergency power to equipment when the main power supply is interrupted. UPS PCBClassification ⑴ Offline Square Wave Output UPS Power Supply: Its single-unit output power is approximately 400–2000 VA. When
After the PCB circuitry is etched, a layer of ink (green ink, blue ink, black ink, etc.) needs to be applied. However, ink is liquid and has flowability. During the curing process after application, uneven ink distribution may occur, primarily around drill holes. In such cases, certain areas may appear under a magnifying glass to
In today’s highly integrated electronic product era, circuit boards serve as core components, and pcb manufacturing costs directly impact the market competitiveness of the final product. Accurately understanding the composition of PCB expenses, mastering their calculation methods, and effectively implementing cost optimisation strategies are key to manufacturers and design engineers maintaining a competitive edge in
Il piano di messa a terra su un circuito stampato è in genere un’ampia area metallica collegata alla massa del circuito. Quest’area metallica può occupare solo una piccola porzione della scheda oppure, nei progetti multistrato, può estendersi su un intero strato. A seconda dei requisiti di progettazione, può anche estendersi su più strati. La messa
What is a presensitized PCB board?A presensitized pcb board is a special type of printed circuit board with a photosensitive surface. It supports photolithography technology and can be adjusted using ultraviolet light. Despite common misconceptions, presensitized PCBs are similar to standard copper-clad PCBs, but essentially involve transferring graphics onto the board. Presensitized printed circuit boards
PCB board serves as the core components of electronic products, and their quality directly impacts the performance and reliability of the final product. With the rapid advancement of electronic technology, PCB design has become increasingly complex, with higher density and integration levels. This has led to higher demands on PCB inspection, rendering traditional inspection methods
Elektronikfertigungsdienstleistungen (EMS), auch bekannt als ECM (Electronic Contract Manufacturing), sind Elektronikhersteller, die eine Reihe von Dienstleistungen für Markeninhaber elektronischer Produkte anbieten, darunter Fertigung, Beschaffung, Teilkonstruktion und Logistik. Im Vergleich zu traditionellen OEM- oder ODM-Dienstleistungen, die nur Produktdesign und OEM-Fertigung umfassen, bieten Elektronikhersteller Wissen und Managementdienstleistungen wie Materialmanagement, Logistik und Transport sowie sogar Produktwartungsdienstleistungen an. Der
EMI radiation consists of electric and magnetic fields, which disrupt the normal operation of electronic devices. These electromagnetic waves propagate within electronic devices and interfere with electrical components, with their ratio referred to as wave impedance. To reduce EMI, we use metal cans (Faraday cages) to encapsulate electronic circuits on printed circuit boards (PCBs), which
Die Erdungsfläche auf einer Leiterplatte ist in der Regel ein großer Metallbereich, der mit der Schaltungserde verbunden ist. Dieser Metallbereich kann nur einen kleinen Teil der Platine einnehmen oder sich bei mehrschichtigen Designs über eine gesamte Schicht erstrecken. Je nach Designanforderungen kann er sogar mehrere Schichten umfassen. Einfach ausgedrückt ist die Erdung die Festlegung eines
Le plan de masse d’un circuit imprimés est généralement une grande surface métallique reliée à la masse du circuit. Cette surface métallique peut occuper seulement une petite partie de la carte ou, dans les conceptions multicouches, s’étendre sur toute une couche. Selon les exigences de conception, elle peut même s’étendre sur plusieurs couches. En termes
The pcb grounding plane on a PCB is typically a large metal area connected to the circuit ground. This metal area may only occupy a small portion of the board or, in multi-layer designs, it can span an entire layer. Depending on design requirements, it may even span multiple layers. Grounding, in simple terms, is
