PCB pins are the metal parts of printed circuit boards used to connect electronic components. They are usually small metal columns or pads extending vertically from the surface of the PCB board, through welding, plugging and other ways and components of the pins or pin holes are closely linked to realize the transmission of circuit […]
Postage stamp holes are holes with a small diameter and shallow depth, usually about 0.254 mm in diameter and 0.167 mm in depth, and are round or oval in shape, and sometimes in other shapes, such as square, triangle, etc. Stamp holes can be customized to meet specific needs.Postage stamp holes size and shape can
In PCB (Printed Circuit Board) design, the connection method is a very important part. It determines the reliability, performance and functionality of electronic devices. But how to connect pcb board? PCB board connection methods mainly include V-cut, stamp holes, hollow connecting strips, V-cut, copper foil bridge connection, separated connecting boards, panelization and so on. V-cut
The battery charger pcb board is a kind of intelligent protection electronic circuit, which can protect the battery in many ways, not only to prevent the battery from overcharging and over-discharging, but also to protect the battery from being damaged by over-current, over-voltage, short-circuit and other problems. During the battery charging process, the internal voltage
Buried capacitance pcb is a common technique used in PCB design to improve the performance of a system by embedding capacitors inside the PCB board.PCB buried capacitors are capacitors made inside the PCB board, and the capacitors made in this way are called buried capacitors. The embedded capacitors can be ceramic, tantalum or polymer capacitors,
Electrical panel usually consist of a power input module, a transformer module, a power distribution module and a control and protection module. The power input module is mainly to connect the external power supply to the electrical panel, while the transformer module converts the input voltage to supply power reliably to other modules. The power
PCB board testing is an extremely important step in the production process and is an essential production process. It is to check the rationality of PCB design, test its possible problems or defects in the production process, to ensure the functionality and appearance of the product, and improve the production yield of the final product.
Milling PCB board is a method of processing printed circuit boards (PCBs) using CNC milling technology. It cuts and repairs PCB boards through milling methods to form the final form of the product. With the booming of the electronics market, the demand for PCB milling technology is getting higher and higher. Reasons affecting the accuracy
A drill for pcb board is a device used to perform precise drilling operations on PCBs for the subsequent installation of electronic components such as resistors, capacitors, IC pins, and various other connectors. Drilling is a critical step in the PCB manufacturing process as it ensures electrical interconnections between internal layers of the board as
3D packaging semiconductor technology, also known as three-dimensional integrated circuit packaging technology, is an advanced semiconductor packaging method that allows multiple chips to be stacked together in a vertical direction to provide higher performance, smaller package size and lower energy consumption. The core of this packaging technology lies in the stacking of multiple chips in
PCB prepreg refers to the resin matrix in a certain way impregnated with reinforcing fibers, the formation of a uniform thickness of the strip or sheet-like semi-finished products, is a composite material from the raw material to the products of the transition of the intermediate products. It contains matrix resin and reinforcing fiber. Prepreg can
The fundamental difference between FPGA vs CPU lies in the difference between software and hardware; CPU is a Von Neumann structure, which executes a series of instructions serially; while FPGA can realize parallel operation, like embedding multiple CPUs in a chip, whose performance will be ten or a hundred times that of a single CPU.
PCB Via fill is a material used to fill through holes in a PCB board. Through holes are holes punched in a PCB to connect different circuit layers so that current or signals can flow through. The purpose of through-hole fillers is to prevent liquid solder pads or other impurities from remaining in the through-holes,
Bendable Circuit Board, or Flex PCB, is a type of circuit board that is manufactured using a flexible substrate. Its best feature is that it can be flexibly bent without affecting its performance or conductivity. Compared to traditional rigid circuit boards, flexible circuit boards have better adaptability and applicability. FPC is the United States in
Residual copper in circuit boards is a common by-product of the manufacturing process, and excessive residual copper not only occupies space, but also may cause pollution to the environment. Therefore, how to remove copper from pcb has become the focus of attention of the majority of enterprises. Residual copper refers to the copper foil that
HDMI splitter is a way to HDMI signal into more than two-way function of the device, and split the signal and the source signal is the same, can be synchronized in real time. In layman’s terms, it is an HDMI interface to expand into multiple HDMI interfaces, so that you can use a host at
What is a splitter?It is an electronic device that is used to distribute electrical signals or data streams to different routes. It can split an input signal into multiple output signals according to a certain pattern, each output signal has the same electrical characteristics as the input signal, and the number of output signals can
Circuit board stencil, also known as pcb stencil, is an important tool used to guarantee the quality of circuit boards and plays a key role in PCB manufacturing. It consists of a layer of metal mesh fixed on the surface of the printed circuit board, which is used to control the position of solder paste
A stencil printing is an important tool used in the PCB manufacturing process. stencils used in electronics factories are mainly used in the manufacture of parts of printed circuit boards. They are an integral part of modern electronics, and it can not be made without the use of stencils in electronics factories. A stencil is
What is solder mask layer? Soldermask, the soldering surface layer used to assemble electronic components, is usually made of a solderable material with a specific surface treatment and chemical composition that allows the components to be easily attached to the PCB. The surface of the soldermask is usually coated with a thin layer of solder
Solder balls are small spheres made of pure tin or tin alloy. It has good corrosion resistance and electrical conductivity, so they have a wide range of applications in electronic component manufacturing, soldering and energy storage. Classification of tin balls1.SnPb C4 Bump (SnPb C4 tin ball)Traditional solder balls made of tin-lead (SnPb) alloy with a
What is a substrate in semiconductor?A semiconductor substrate is a key material used in the manufacture of integrated circuits. It is usually made of monocrystalline silicon and is characterized by high purity and absence of impurities. The surface of the substrate is coated with a layer of photoresist to create graphics by photolithography. Oxide and
Thick film ceramic pcb is printed metal wiring layer by screen printing process, and then degreased and sintered (generally 850~900℃) to form a circuit. Depending on the viscosity of the metal paste and screen mesh size, the thickness of the prepared metal wiring layer is generally 10μm to 20μm (increasing the thickness of the metal
Flexible Copper Clad Laminate (FCCL) refers to a kind of flexible insulating materials such as film on one or both sides, through a specific process, and copper foil bonded together with the formation of copper cladding board, FCCL is a flexible circuit board (Flexible Printed Circuit, FPC) processing substrate, according to the structure of the
