Soldering tinning is an important industrial raw material for connecting electronic components in soldered circuits. It is a kind of solder with a low melting point, mainly referring to the solder made of tin-based alloy. The production method of soldering tin is to melt the ingot first, and then pressure processed into material. An important […]
Circuit boards are an integral part of modern electronic equipment, and they are usually subjected to a variety of processes during production, such as drilling, surface treatment, gold sinking, soldering, etc., as well as being exposed to a variety of contaminants and chemicals. Therefore, cleaning circuit boards is necessary to remove surface contaminants and improve
Teflon material is polytetrafluoroethylene, the Chinese name Teflon, Teflon is a resin, the chemical name is called polytetrafluoroethylene, is the ethylene (C2H4) in the four hydrogen (H) are replaced by fluorine (F), into tetrafluoroethylene (C2F4), and then formed by polymerization. Since Teflon is made of carbon and fluorine atoms and does not contain hydrogen, it
Waterproofing electronic circuit boards means that the environment around and within water can prevent the equipment from being damaged by moisture or immersion in water. Generally, the waterproofing of circuit boards is realized by applying waterproof coatings. At the same time, in the design and installation of circuit boards, it is also necessary to consider
A 4 layer PCB, or four-layer printed circuit board, adds two internal copper layers to form a signal layer and a power layer compared to a double-layer PCB. As a result, the components on the PCB can be arranged more densely, resulting in smaller packages, higher levels of integration, and better immunity to interference. At
What is a heat sink in PCB? A heat sink is a component made of a thermally conductive metal with a large surface area. It is usually connected to pcb components, including power transistors and switching devices. The function of this part is to absorb and dissipate heat. PCB heat sinks work through the principle
What is LTCC?LTCC is Low temperature cofired ceramic, low temperature cofired ceramic technology. Low temperature cofired ceramic technology (LTCC: low temperature cofired ceramic) is a multilayer circuit made by stacking unfired cast ceramic materials together, with printed interconnect conductors, components, and circuits inside, and sintering the structure into an integrated ceramic multilayer material. LTTC utilizes
SIP (System in Package) and SOC (System on Chip) as two important trends in PCB design, their development not only affects the performance and size of the product, but also has a far-reaching impact on the future direction of the entire electronics industry. SoC is System on Chip. From a narrow perspective, SoC is the
Microwave circuit board is a special kind of circuit board, which has good performance for the transmission of high-frequency signals. Compared to general printed circuit boards, it has a more unique circuit layer structure, commonly single, double and multilayer. Microwave circuit boards (high-frequency boards), refers to the specific microwave substrate copper-clad boards, the use of
What is Solder Paste Inspection?SPI, or Solder Paste Inspection, is a technique for inspecting the solder paste printing aspect of SMT processing. It evaluates the printing quality of solder paste by measuring the volume, area, height and other parameters of the paste on the circuit board, so that problems such as insufficient, excessive or offset
Solder mask in pcb, is also called PCB solder mask film in flexible circuit boards, using green, yellow, red, black, blue and other photosensitive inks sprayed on the surface of the PCB circuit board.Solder Mask is a protective layer applied to the surface of a circuit board that prevents short circuits from occurring when other
Silicon chip is silicon wafers used to make silicon semiconductor circuits, the original material of which is silicon. High purity polycrystalline silicon is dissolved and doped into silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. Silicon crystal rods are ground, polished, and sliced to form silicon wafers, also
Cirucit board transparent is a new type of circuit board material whose main components are PET (polyester film) and ITO (Indium Tin Oxide) film. Compared to traditional circuit boards, transparent circuit boards have higher transparency, compressive strength and stability. Transparent circuit boards can be customized into different shapes and structures according to customer requirements and
A bypass capacitor is a capacitor connected in parallel with a part or component in a circuit. It provides a selective low-impedance path that allows current, signal, or noise to bypass a particular part or component. A bypass capacitor can improve the performance of a circuit by adjusting its capacitance to selectively direct signals or
PCB Resistor Calculator, also known as Chip Fixed Resistor, is a tool for calculating the resistance value of chip resistors. It can calculate the required chip resistor type and resistance value according to the user’s input parameters such as resistance value, accuracy, package type, and so on. Using Chip Resistor Calculator allows you to easily
A ground plane antenna is a low-frequency antenna used for the transmission of radio waves, and is mainly used in ground plane communication systems to transmit low-frequency electromagnetic wave signals. A ground plane antenna is a low frequency antenna used in ground wave communication systems to transmit low frequency electromagnetic wave signals. Ground plane antenna
A microprocessor is a central processor consisting of one or a few large-scale integrated circuit. These circuits perform the functions of control and arithmetic logic components. The microprocessor is the arithmetic control part of a microcomputer, and can perform operations such as fetching and executing instructions, as well as exchanging information with external memory and
PCB silver plating is the plating of silver on the circuit board, which can play a role in protecting the pads and increase the conductivity of the circuit board. The advantage of silver plating is the ability to control board impedance and reduce signal attenuation of high frequency signals. In addition, silver plating has good
What is fr4 plate?fr4 plate is a commonly used insulating substrate composed of glass fiber and epoxy resin. It has good electrical insulation properties and mechanical strength, and is suitable for the manufacture of electronic circuit boards. Where “fr” is the English abbreviation for “flame retardant”, and fr4 sheet is a material that meets the
Patches pcb, also known as chip repair technology, is a state in the absence of drawings, to complete the circuit board line detection, component detection, fault diagnosis, repair of professional technology. Circuit board repair is broadly applicable to any equipment board, currently received technology, cost market demand and other factors, circuit board repair mainly refers
Circuit board circuit schematic is the circuit board of each electronic component using the prescribed graphic symbols, and with the use of wires to the graphic symbols of each electronic component pins connected in accordance with certain rules, the use of graphic connection relationship to illustrate the circuit board between the unit circuit power supply,
Aluminum printed circuit board refers to a kind of printed circuit board with aluminum plate as the substrate, and copper conduction lines are processed on the surface through chemical etching or mechanical processing, etc. to form a circuit board. It is characterized by good thermal conductivity, mechanical strength and stability, and is suitable for use
HDI step refers to the complexity of the manufacturing process of HDI boards, generally with the accumulation of layers (Build-up) to manufacture HDI boards, the more the number of layers, the higher the HDI process, the higher the technical grade of the board is also higher. HDI order can be divided into the following categories.HDI
Wafer Level Packaging (WLP) is an advanced packaging technology that refers to the direct encapsulation of chips onto wafers to form a complete whole (similar to a microcircuit), and the final product is a chip module containing chips, pins and connecting wires. There are three main technology routes for wafer-level packaging: BGA (Ball Grid Array),
