The laminate structure of RF PCB must consider not only the impedance of RF signal traces but also heat dissipation, current, components, EMC, structural integrity, and skin effect. When layering and stacking multilayer printed circuit boards, we typically adhere to the following fundamental principles: A) Each layer of an RF PCB should feature a large […]
The CCL (Copper Clad Laminate) lamination process utilizes high-temperature and high-pressure conditions to achieve a tight and robust bond between the copper foil and substrate within the laminate. This process is centered on producing high-quality, high-performance PCBs (Printed Circuit Boards), ensuring the CCL meets the electrical, mechanical, and chemical properties required for PCBs. CCL Laminating
Connections between pcb circuit boards are primarily achieved through conductive connectors, wires, flexible printed circuits (FPC), board-to-board connectors, and soldering techniques. Among these, flexible printed circuits (FPC) serve as a widely adopted connection method, excelling in the creation of reliable, high-density electronic products. Their lightweight, thin profile and excellent flexibility make them highly suitable for
SMT stencils, commonly referred to as ‘templates’, are an indispensable component of the SMT (Surface Mount Technology) process; they serve as the template for printing solder paste onto the PCB (Printed Circuit Board) during the initial stage of surface mounting. In the first stage of the SMT process, this smt stencil is employed to precisely
PCB trace impedance refers to the total resistance encountered by electrical signals during transmission across a PCB board. In layman’s terms, it represents the ‘resistance’ encountered by electrical signals as they traverse the PCB. PCB trace impedance matching denotes the adjustment and alignment of trace impedance to ensure more stable and reliable signal transmission across
Semi flex pcb is essentially “standard” multilayer PCBs manufactured using specific grades of FR4. The thickness of the FR4 is subject to particular tolerances, enabling thinner sections to provide the flexible/bendable portions traditionally achieved with rigid FR4. Semi flex pcb is suitable for static applications (where the flexible section aids assembly) or scenarios involving minimal
High speed PCB design specifically refers to systems that utilise high speed digital signals to transmit data between components. The boundary between high-speed digital design and simpler circuit boards employing slower digital protocols is not always clear cut.Typically,the key indicator determining whether a system qualifies as ‘high-speed’ is the edge rate (or rise time) of
The Impact of PCB Impedance Control on Circuit Performance and Stability. In the design of high-frequency, high-speed electronic products, the stability and reliability of circuit performance critically influence product quality. PCB impedance control, as one of the key factors affecting signal transmission quality, is an indispensable technique in high-quality circuit board design. PCB impedance control
Driven by innovation in consumer electronics, medical devices, aerospace, and other fields, flexible pcb (FPC) have become core components for achieving three-dimensional structural integration and dynamic functionality in devices. However, the physical properties of flexible substrates differ fundamentally from those of rigid PCBs. Relying solely on the inherent flexibility of the material cannot guarantee long-term
Silkscreen printing is typically employed to mark useful information on PCB boards, aiding users during the assembly process. It serves to label component values, part numbers, polarity, and other details, while also incorporating version numbers, manufacturer information, and similar data. PCB silkscreen printing is completed during the PCB manufacturing process, yet it is utilised in
Rogers RT duroid high-frequency circuit materials are composite laminates of PTFE (with random fillers of glass or ceramic), suitable for high-reliability applications such as aerospace. For many years, the RT/duroid series has been recognised within the industry as a high-reliability material offering exceptional performance. AdvantagesThe RT/duroid material series offers significant advantages including ultra-low loss, low
Rigid PCB, commonly referred to simply as PCBs, are what most people envision when thinking of circuit boards. These boards utilise conductive tracks and other components arranged upon a non-conductive substrate to connect electrical components. In rigid circuit boards, the non-conductive substrate typically incorporates glass cloth, which enhances the board’s strength and imparts rigidity. Rigid
Qu’est-ce qu’un PCBA ? PCBA signifie PCB Assembly, c’est-à-dire Printed Circuit Board Assembly, c’est-à-dire que les composants électroniques sont fixés sur le PCB par soudure ou enfichage pour former un produit électronique complet. Le PCB est la base du PCBA, un substrat isolé utilisé pour la connexion électrique entre les composants électroniques, grâce à des
Was ist eine Leiterplatte? Die Leiterplatte ist die Kernkomponente der Elektronikindustrie und die Hauptplatine der elektronischen Fertigungsindustrie. Die Entwicklung der pcb ist eng mit dem rasanten Fortschritt der Elektroniktechnologie verbunden und fördert gemeinsam die kontinuierliche Innovation und den Fortschritt der elektronischen Informationsindustrie. Aufgrund ihrer Verwendung im elektronischen Druck wird sie als Leiterplatte oder Printed Wiring
Qu’est-ce qu’un circuits imprimé ? Le circuit imprimé est le composant central de l’industrie électronique et la carte mère de l’industrie de fabrication électronique. Le développement des circuits imprimés est étroitement lié à l’évolution rapide des technologies électroniques, favorisant conjointement l’innovation et le progrès continus de l’industrie de l’information électronique. En raison de son utilisation
Les circuits imprimés électroniques médicaux sont devenus l’un des types de circuits imprimés les plus complexes et les plus difficiles à fabriquer dans l’industrie. L’assemblage des circuits imprimés joue un rôle fondamental dans les équipements médicaux, impliquant des tâches clés telles que la transmission de signaux et le traitement des données. Son innovation technologique favorise
Medizinische Elektronik-Leiterplatten haben sich zu einer der komplexesten und anspruchsvollsten Leiterplatten der Branche entwickelt. Die Leiterplattenbestückung spielt eine grundlegende Rolle in medizinischen Geräten und umfasst wichtige Aufgaben wie Signalübertragung und Datenverarbeitung. Ihre technologische Innovation fördert die Miniaturisierung und intelligente Entwicklung medizinischer Geräte und gewährleistet gleichzeitig die Zuverlässigkeit der Geräte sowie innovative Forschung und Entwicklung. Durch
Ultra-high thermal conductivity aluminium substrate is a novel circuit board that achieves exceptional thermal performance by replacing the resin insulating layer within existing metal aluminium-based circuit board structures with a multi-film layer nanostructure diamond-like carbon (DLC) insulating layer. Ultra-hyperconductive aluminium substrate is a utility model applicable to the printed circuit board field, providing an efficient
What is 5G millimetre wave? 5G millimetre wave, also known as the millimetre wave band, refers to the spectrum segment with wavelengths between 1mm and 10mm, corresponding to frequencies ranging from 30 to 300GHz. In practical applications, frequencies above 24GHz are classified as millimetre waves. This band occupies the overlapping wavelength range between microwaves and
Thermal stress refers to the mechanical stress arising from uneven thermal expansion or contraction within materials during temperature changes. Within the PCB substrate sector, thermal stress primarily originates from the following sources: Thermal cycling during manufacturingReflow Soldering: In SMT processes, PCB substrate endure high temperatures (240–260°C) and rapid cooling. Non-uniform expansion and contraction of materials
Rogers PCB materials, owing to their unique properties, have become a critical choice in the manufacture of high-frequency electronic equipment. They find extensive application in wireless communication systems, satellite communication devices, radar systems, and microwave antennas. Their exceptional low loss, low dielectric constant, low dielectric loss factor, and outstanding dimensional stability enable Rogers PCBs to
Chip packaging technology constitutes a critical component within the semiconductor industry, directly influencing the performance, reliability, and lifespan of electronic devices. In recent years, as electronic products have evolved towards miniaturisation and enhanced performance, traditional packaging materials have progressively revealed their limitations. Against this backdrop, glass substrates, owing to their unique physicochemical advantages, are increasingly
TGV (Through Glass Via) technology evolved from 2.5D/3D integrated TSV interposer technology. Since its inception in 2008, it has focused on overcoming the dielectric loss bottleneck in high-frequency, high-speed signal transmission inherent to traditional silicon substrates, while addressing industry pain points such as the high cost and complex manufacturing processes associated with silicon materials. This
PCBA processing costs encompass multiple stages including PCB manufacturing, component procurement, SMT placement, DIP insertion, and testing/validation. Quotation efficiency is influenced by factors such as design file completeness, supply chain alignment, process complexity, batch size, and testing requirements. This article systematically outlines the cost components of PCBA and analyses key factors affecting quotation timeliness. PCBA
