What is coverlay in fpc?FPC coverlay is polymer film made from materials such as polyimide (PI), primarily used to protect and insulate the external circuits of flexible PCB. FPC coverlay is the earliest and most widely used technology in the application of cover layers for flexible printed circuit boards. FPC coverlay primarily serves to protect […]
PCB overmolding is a technique that involves coating printed circuit boards (PCBs) with protective polymer resin. This process is designed to protect PCBs from external factors such as humidity, dirt, and temperature fluctuations. During the pcb overmolding process, the polymer resin is injected and cured around the PCB circuitry, forming a tight and secure seal.
PCB warping is a common quality issue in surface mount technology (SMT) processing, severely affecting the performance and reliability of electronic products. This phenomenon is not caused by a single factor but rather the combined effect of multiple factors. Gaining a deep understanding of these underlying causes is key to effectively preventing and resolving PCB
In the field of electronic product manufacturing, solder contamination on PCB gold fingers is a common and challenging issue that significantly impacts product performance and reliability. Especially during critical processes such as solder paste printing and reflow soldering, even minor operational errors or environmental factors can cause solder paste to accidentally adhere to the gold
The production process for high-frequency microwave pcb is complex and requires extremely high precision, encompassing multiple critical stages from engineering data processing to final forming. To ensure product quality and performance, manufacturers must strictly adhere to specific operational procedures and control points at every stage of the process. Challenges in high-frequency microwave pcb processing: Key
The manufacturing of microwave pcb has multiple distinctive features, primarily manifested in the diversity of substrate materials, stringent requirements for design precision, computer-controlled manufacturing processes, specialised graphic production, diverse surface coating options, CNC-controlled shape processing, and automated batch production inspection equipment. Substrate Material DiversityThe miniaturisation and integration of microwave devices have imposed higher demands on
PCBA test fixtures, also known as ‘test fixtures, play a crucial role in the PCBA manufacturing process. They are primarily used to conduct comprehensive testing on PCBs that have undergone SMT placement and DIP insertion processes. These tests primarily include ICT testing and FCT testing, which utilise test points to verify the electrical conductivity of
RF connectors are electrical connectors used for transmitting radio frequency signals. They are also referred to as coaxial connectors within the industry, as RF connectors are typically connected to coaxial cables and also have a coaxial structure. Classification of RF connectors:By connection interface structure:Threaded connection: Uses series such as SMC, SMA, TNC, N, UHF, 7/16,
Microstrip patch antennas and their arrays may not be seen much but are the most widely used form of antenna. They are simple in structure and can be formed by a dielectric, a metal conductor patch on top of the dielectric, and a ground plane. Even the intervening dielectric can be an air structure. The
High frequency pcb is special circuit board dedicated to higher electromagnetic frequencies, applicable to high-frequency (frequency over 300MHz and wavelength less than 1 metre) and microwave (frequency higher than 3GHz, wavelength less than 0.1 metre) fields. This type of PCB is usually in the microwave substrate copper-clad board, through part of the use of ordinary
What is a high-Tg PCB? What are the advantages of using high Tg PCBs? When the temperature of a high Tg printed circuit board rises to a certain range, the substrate transitions from a ‘glass state’ to a ‘rubber state,’ and this temperature is referred to as the board’s glass transition temperature (Tg). In other
What is 94v-0 on a pcb? The 94v-0 standard is a standard set for the combustion characteristics of plastic materials in electronic and electrical products. It was established by Underwriters Laboratories (UL), a highly authoritative insurance laboratory in the United States. This standard specifies the specific behaviour of plastic materials when exposed to flames, with
The trend in PCB design is moving towards lighter, thinner, and smaller boards. In addition to high-density circuit board design, there is also the important and complex field of three-dimensional connection assembly for rigid-flex circuit boards. Rigid-flex boards are also known as rigid-flexible boards. With the emergence and development of FPC circuit boards, rigid-flex circuit
An integrated circuit socket, also known as an IC socket, is an interface used to connect integrated circuits. It allows integrated circuits to be easily inserted and removed, facilitating testing and replacement. This type of socket is widely used in various electronic devices, particularly those that require frequent replacement or testing of integrated circuits. An
Paste flux is a key ingredient in solder paste, mainly used to clean the metal surface of oxides during the soldering process and to promote the wetting and flow of the solder, thus ensuring a strong and reliable joint. It usually consists of rosin, active agents, organic acids, thixotropic agents, solvents and other ingredients, which
Rogers 5880 sheet is a high performance PTFE composite material with extremely low dielectric constant and loss, widely used in high frequency circuits for communications, automotive, aerospace and other applications. Sheet Parameters:Rogers 5880 sheet is a polytetrafluoroethylene (PTFE)-based material with a dielectric constant of 2.2 and thicknesses ranging from 0.003‘ to 0.240’. The sheets are
In the context of the rapid development of 5G communication technology, the performance of high-frequency PCB board has become the key to ensure the quality of signal transmission and system stability. Traditional FR4 materials are widely used in all kinds of electronic products for their excellent cost performance, while Rogers and other high-frequency specialised materials
Rogers RO4350B dielectric constant stability is relatively high, the standard value using 10GHz frequency test value of 3.48, with the frequency increase in dielectric constant will decline, 24GHz frequency dielectric constant compared to the 10GHz frequency decreased by 0.01, for 3.47. Rogers RO4350B high-frequency board is fully compatible with traditional PCB manufacturing technology, do not
Battery on pcb is battery devices that are mounted on circuit boards to provide electrical support for electronic components, chips, etc. on the circuit boards. Battery on pcb is usually selected based on size, voltage and capacity requirements, and the following are the 5 most common types: The Role of Battery on pcb How to
Dev Board (Development Board) is a hardware prototyping platform for embedded system design, usually integrating processor, memory, peripheral interfaces and other modules for software debugging, algorithm verification or product prototyping. According to different core architectures, they are mainly divided into the following three categories: Using a dev board as a development tool for embedded system
Eutectic soldering, also known as low melting point alloy soldering, is a specific soldering technique. The process involves the removal of unstable oxide layers at the interface between the chip and the gold-plated base by gentle friction at specific temperatures and pressures, which causes the contacting surfaces to melt and form a liquid phase. Subsequently,
LED driver board is used to drive the LED lamps and lanterns circuit board, its main function is to convert the power supply to the current and voltage suitable for the LED work.LED driver board has the characteristics of high efficiency, stability and reliability, can provide constant current output, to ensure that the LED lamps
PCB encapsulation materials consist of substrates, interconnections, frames, interlayer media, and sealing materials. Among these, PCB encapsulation substrate materials serve as electronic components, primarily providing mechanical support, hermetic protection, and facilitating heat dissipation for electronic components and their interconnections.Substrate: High-density multilayer encapsulation substrates primarily serve as an electrical transition between semiconductor chips and conventional PCBs
Welding porosity is a common defect encountered in welding production, formed by the absorption and release of gases (primarily oxygen, nitrogen, and hydrogen) within the weld seam. It not only reduces the effective cross-sectional area of the welded component but also causes stress concentration, significantly lowering the strength and toughness of the weld metal. This
