Electronic manufacturer

Ceramic substrates and PCBs play an important role in the electronics industry, each with unique material properties, manufacturing processes and application areas. Ceramic substrate is a ceramic material made of electronic substrates, belonging to the inorganic materials, usually with alumina (Al2O3), aluminium nitride (AlN) and silicon nitride (Si3N4) as the main component, ceramic substrate has […]

The ball grid array socket is an adapter that allows for pluggable mounting without directly soldering BGA-packaged integrated circuits (ICs) to the test substrate. By connecting the solder balls of the IC to the pads of the test substrate via the BGA socket, the risk of poor contact (e.g. open or short circuit) and IC

The design layout of a camera pcb board is a central aspect of ensuring camera performance, reliability and stability. An optimised layout can effectively reduce signal interference, improve signal integrity, and improve thermal management. Camera PCB Board Wiring GuideThe LVCMOS signal alignment needs to be away from the differential lines to prevent the LVCMOS line

The camera motherboard, also called the camera pcb board, is one of the core components inside the camera and contains the camera’s processor. Memory. Interface chip. Sensor control chip and other important components. The role of the camera motherboard is to control and manage the various functions and operations of the camera, so that the

Hybrid Bonding is an advanced IC packaging technology used to achieve high-density, high-performance interconnections between different chips. The key feature of this technology is to replace the traditional bump or solder ball (bump) interconnections with direct copper-to-copper connections, which enables ultra-fine pitch stacking and packaging in a very small space for the purpose of three-dimensional

Hybrid bonding is an emerging packaging technology that combines the features of inter-chip bonding and intra-chip bonding. It utilises different bonding techniques to achieve interconnections between wafers and package substrates or within wafers to meet the needs of high-performance integrated circuits with complex interconnect structures. There are two common types of hybrid bonding: W2W can

FPC Bonding (Flexible Printed Circuit Board Bonding) is a technology that electrically and mechanically connects flexible circuit boards (FPC/FPCB) to other electronic components, rigid circuit boards (PCBs), or components such as displays through a specific process. This process is widely used in consumer electronics (e.g., mobile phones, tablets, wearable devices), automotive electronics, and medical devices

Differential signal line is mainly the difference between the traditional signal line corresponds to a ground line signal transmission mode, differential signal transmission is mainly two lines on the signal transmission, the two signals are equal in amplitude and opposite in phase. Relative to the traditional single-ended signal, it has a strong anti-jamming, can effectively

There is a significant difference between FPC PCB assembly and the assembly of rigid circuit boards, the main reason is that flex board is softer and less hard, if you do not use a special carrier board, it is difficult to achieve effective fixation and handling, so as to be unable to complete the printing,

Radar PCB is an RF circuit board used for detection and automation that is primarily responsible for generating, transmitting and receiving RF signals. It contains an antenna structure mounted on a high frequency laminate that transmits the radar flaps generated by the RF circuitry and receives the reflected radar pulses after hitting an object, which

A PCB radar is a type of printed circuit board designed for use in radar systems and is primarily responsible for generating, transmitting and receiving RF signals. It is typically made of a high frequency laminate material that integrates an antenna structure for transmitting and receiving radar waves. The radar PCB is able to send

As an important basic component of electronic products, the stability of pcb substrate dimensions during the manufacturing process of printed circuit boards directly affects the performance and reliability of the final product. However, substrate dimensions often change due to a variety of factors during the production process, resulting in dimensional deviations, bending and warping, and

As a core component carrying complex functions and high-density interconnections in modern electronic products, multilayer circuit board faces many technical challenges in the manufacturing process due to their increased thickness, increased number of layers, and dense wiring and perforations. With the increasing demand for high-performance PCBs in fields such as 5G communications, artificial intelligence and

PCB dielectric thickness is usually the thickness of the glass fibre cloth or other special material used to cover both sides of a printed circuit board (PCB) during the manufacturing process. The choice of dielectric thickness depends on the specific application scenario and requirements of the circuit board. Multilayer board dielectric thickness refers to the

PCB thickness tolerance refers to the difference in the thickness of a circuit board due to the production process and equipment conditions during the manufacture of the pcb circuit board, which is the thickness tolerance of the board. This tolerance range depends mainly on the type and specification of the board used. Normally, the pcb

Burn in board is a common test method to evaluate the performance and reliability of circuit boards by simulating the conditions of long-time use or harsh environments. The circuit board aging process is the specific steps and procedures to carry out circuit board aging test. In practice, the standardisation and optimisation of the circuit board

In the field of modern electronics manufacturing, SMT (surface mount technology) and burn in board is inextricably linked, and their synergistic effect is a key link to ensure the stability and reliability of electronic product performance.SMT technology, as the basic process for manufacturing aging boards, enhances the durability and accuracy of burn in boards in

RO4350B is a commonly used high-frequency printed circuit board (PCB) material produced by Rogers Corporation in the United States. This material is used in wireless communications, radar systems, medical devices and other high frequency electronic equipment.The dielectric constant of RO4350B is approximately 3.48.This value was measured at a frequency of 1 GHz.Typically, the dielectric constant

HDI circuit boards are highly integrated printed circuit boards with high density, miniaturization, and light weight, which can significantly improve the performance and functional density of electronic products. HDI board design specifications usually cover the following aspects: Number of Layers and Thickness: HDI circuit boards usually use a multi-layer structure to accommodate more signal and

BGA packages is solder ball array package, is an integrated circuit using an organic carrier board packaging method. With the continuous development of society, in order to meet the demand for electronic products light, thin, short, small and functional diversification, production of green and other aspects of the BGA package began to be applied to

Rogers material is a specialised laminate used in the manufacture of high frequency, high performance Printed Circuit Boards (PCBs) and is manufactured by Rogers Corporation. Rogers materials typically do not contain glass fibres, but rather a ceramic foundation or hydrocarbon ceramic composite substrate, which gives them excellent dielectric properties, low dielectric constants and low loss