Technology Blog

clean flux off circuit board

Flux residue effects and how to clean flux residue

In the manufacturing process of electronic products, flux, as an important soldering auxiliary material, plays a key role in connecting electronic components with circuit boards. However, while flux brings convenience, its residue problem has also become a challenge that cannot be ignored. Excessive flux residue not only affects the appearance and quality of the product, […]

smt-production-line

Overview of SMT production line technologies and processes

SMT production line, full name surface assembly technology (Surface Mount Technology), is a modern electronic assembly technology. A new generation of electronic assembly technology developed from hybrid integrated circuit technology, characterized by the use of component surface mount technology and reflow soldering technology, has become a new generation of assembly technology in the manufacture of

PCB-Soldering-Temperature

PCB Soldering Temperature: Control and Effects

PCB soldering temperature is a crucial parameter in the electronics manufacturing process. It not only affects the quality of soldering, but also directly relates to the performance and reliability of electronic products. Therefore, precise control of PCB soldering temperature is a key step to ensure the quality of electronic products.The proper pcb soldering temperature is

red-glue

SMT Red Glue: Characterization, Application and Management

Red Glue is a polyolefin compound, a special adhesive used for fixing and protecting electronic components in the surface mount (SMT) process. Property CharacteristicsViscosity fluidity, temperature characteristics and wettability. By the characteristics so decided to red glue in smt chip processing in the role is to make the parts firmly affixed to the PCB surface,

FFC-vs-FPC-Connector

FFC vs FPC Connector: Types and Characteristics Analysis

FFC connectors are used to mate ribbon flat flexible cables (FFC) to PCB circuits in wire-to-board applications. They are also available in cable-to-cable configurations. These connectors have a high density, very narrow form factor and fit into tight spaces. They are typically used in consumer applications such as laptops, cameras, computer peripherals, appliances, and telephones.

pcb-reflow

PCB reflow: analysis of advantages and disadvantages

PCB reflow soldering refers to the heating and melting of pre-painted in the pad above the paste (paste is generally composed of tin powder and flux mixture), so that it returns to the liquid state of the flow (this process is reflow), so that the devices placed above the pad in advance and the full

solder-paste

Solder Paste: Core Material for SMT Soldering

Solder paste is the core material in SMT mounting, it is a kind of material used to connect the electrode of parts and the pad of circuit board, mainly used for the welding of PCB surface resistance, capacitance, IC and other electronic components in SMT industry. It is made of solder powder, flux and other

decoupling-capacitor

Decoupling capacitors: noise stabilizing components

What is decoupling capacitor?It is a capacitor installed in the power supply side of the component in the circuit, this capacitor can provide a more stable power supply, but also can reduce the component coupled to the power supply side of the noise, and indirectly can reduce the other components by the impact of the

pfc-circuit

PFC Circuit:Principles, Applications and Developments

PFC circuit is a power factor correction circuit that is an important component used in electronic equipment to improve the power factor of the AC power supply, reducing the negative impact on the network and the power plant, as well as improving the energy efficiency of the equipment. It consists of three main components: an

through-hole-vs-surface-mount

PCB Assembly: through hole vs surface mount

Traditionally, Through-Hole Technology (THT) has been used to build most printed circuit boards (PCBs). However, in recent years, the use of surface mount technology (SMT) has become increasingly popular and is gradually replacing through-hole mount technology. What is through-hole insertion technology?Through-hole insertion technology inserts components with tails or leads into pre-drilled holes in the PCB.

fpga

Differences between FPGAs and microcontrollers

FPGA, or Field Programmable Gate Array, is an integrated chip composed of digital circuits, which belongs to a kind of Programmable Logic Device (PLD). It appears in the form of semi-customized circuits in the field of Application Specific Integrated Circuits (ASIC), which not only solves the shortage of customized circuits, but also breaks through the

Chassis-Ground

PCB Chassis Ground Principles and Applications

What is chassis ground?Chassis ground is the metal chassis in the enclosure and establishes a connection to the chassis. Chassis ground is usually connected to earth at the point where power enters the power supply and can provide noise absorption or safety protection for parts of the system. What are the types of PCB grounds?Depending

how-to-connect-components-on-pcb

how to connect components on pcb

PCB circuit boards play a pivotal role in electronic equipment, not only carrying various types of electronic components, but also responsible for their precise connection to ensure stable and reliable operation of the circuit. So, in the design and production of PCB circuit boards, how to connect components on pcb? The most common method of

PCB-antenna

PCB Antenna: A Brief Overview of Design and Applications

What is a PCB antenna? As the name suggests, it is a PCB printed on an alignment, which can be drawn as a straight line alignment, reversed F-shaped alignment, snake or circular alignment, etc., the length of a quarter wavelength can basically form an antenna to radiate electrical signals out or receive signals. Design elements

Surface-treatment

PCB surface treatment process: HASL, ENIG and OSP analysis

Since the copper layer on the PCB board is easily oxidized, the resulting copper oxide layer can seriously degrade the soldering quality and thus the reliability and effectiveness of the final product. In order to avoid this situation, the need for pcb surface treatment. Some information will be talking about the surface molding, board factory

pewter

Pewter Bead Generation and Prevention: Soldering Challenges

A pewter bead is a small, round ball-like substance that forms when tin is extruded between the pad and the component foot during the soldering process. The generation of solder beads is mainly related to the soldering temperature, flux and the surface condition of the printed wiring board. Reflow soldering in the tin bead generation

blind-vias

PCB Blind Vias: Key Technology for Reinforced Circuit Boards

PCB circuit board blind vias are holes in multilayer circuit boards that are used to connect different levels of internal lines, but do not run through the entire plate. Blind vias play an important role in increasing line density, reducing board size and enhancing circuit performance. Blind buried blind holes is a multilayer circuit board,

Resin Plugging

PCB Resin Plugging: A New Process for Enhanced Performance

Resin Plug Hole refers to the use of resin material to fill holes and defects in circuit boards to repair functional defects in circuits. Holes and defects in a circuit board may be created by processes such as drilling, plating, pressing, etc., or they may be designed to achieve specific electrical properties. For example, Via

Virtual Welding

Virtual Welding: Circuit Hazard Prevention

Virtual Welding is a common wiring fault, it refers to the solder joints at the solder joints are not completely effective welding together, resulting in poor contact, may appear on and off. Virtual soldering refers to the component pins, soldering ends, PCB pads at the tin is not sufficient, the wetting angle of the solder

mvi-test

MVI test in PCB manufacturing and assembly applications

Automated optical inspection (automatedopticalinspection,AOI) technology, also known as machine vision inspection (machinevisioninspection,MVI test) technology or automatedvisualinspection (automatedvisualinspection,AVI) technology. In some industries, such as flat panel display, semiconductor, solar and other manufacturing industries, the term AOI is more popular and known. However, there are still subtle differences between AOI and MVI/AVI in terms of concept and

sop-package

SOP Package: Comprehensive Analysis and Application

SOP Package is a form of packaging used in the manufacture and assembly of electronic components.SOP package is a surface mount technology (Surface Mount Technology, SMT), which solder the pins of electronic components to the surface of a printed circuit board (Printed Circuit Board, PCB) instead of connecting them through a perforated hole. SOP package

pcb-cutter

PCB Cutter: Technology and Application Exploration

PCB cutter is a mechanical equipment specialized in cutting circuit boards. It cuts circuit boards accurately and quickly by means of a high-speed rotating cutting tool to meet the needs of different electronic products on the size and shape of circuit boards. Cutting is the first step in material analysis. The choice of cutter as

Through-hole-vs-SMD

Relationship between through hole vs smd

In the electronics manufacturing industry, Through Hole vs SMD (Surface Mount Device) are two commonly used ways of mounting circuit board components, which play an indispensable role in the design and manufacturing of electronic products. Although they have their own characteristics and advantages, in many cases they are complementary, and together they contribute to the

fpc-connectors

FFC and FPC Connector Differences and Commonalities

FFC connectors and FPC connectors are often confused. Although both are flexible cable connectors, but FFC connectors and FPC connectors are still a certain degree of difference. FFC is a flexible flat cable (Flexible Flat Cable) connectors, FPC is a flexible printed circuit (Flexible Print Circuit). In terms of the manufacturing of the two, the

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