In the electronics manufacturing industry, Through Hole vs SMD (Surface Mount Device) are two commonly used ways of mounting circuit board components, which play an indispensable role in the design and manufacturing of electronic products. Although they have their own characteristics and advantages, in many cases they are complementary, and together they contribute to the […]
FFC connectors and FPC connectors are often confused. Although both are flexible cable connectors, but FFC connectors and FPC connectors are still a certain degree of difference. FFC is a flexible flat cable (Flexible Flat Cable) connectors, FPC is a flexible printed circuit (Flexible Print Circuit). In terms of the manufacturing of the two, the
Copper Through Hole Filling (THF) technology is a major technological breakthrough that addresses the challenges of high-frequency thermal management and signal integrity while improving wiring density and interconnect reliability.Comparing THF and Conductive Paste Fill Through-Hole process, Conductive Paste Fill Through-Hole process involves multiple steps that are difficult to control, high production cost, and the fill
AOI, or Automatic Optical Inspection, is a device based on optical principles to detect common defects encountered in welding production. AOI is a newly emerging new testing technology, but it is developing rapidly, and many manufacturers have introduced AOI test equipment. When AOI is used, the machine automatically scans the PCB with a camera, captures
What is the difference between SiP VS SoC?SiP package ( System In a Package) is a single standard package that assembles multiple active electronic components with different functions and optional passive devices to realize a certain function. SOC chips, on the other hand, are a type of system-level integration that achieves greater efficiency by integrating
BGA (Ball Grid Array) package, or Ball Grid Array package, is an array of solder balls on the bottom of the package substrate to serve as the I/O terminals of the circuits to be interconnected with the printed circuit board (PCB). Devices packaged with this technology are surface mount devices. BGA packaging classification Advantages of
SMT, or Surface Mount Technology, is a technology for mounting electronic components directly onto the surface of a PCB (Printed Circuit Board). Compared with the traditional through-hole insertion technology, SMT has the advantages of high density, high reliability, low cost and so on, so it is widely used in modern electronic products. SMT process flow
What is osp? OSP is a RoHS compliant process for the surface treatment of copper foil on printed circuit boards. It is short for Organic Solderability Preservatives, which translates to Organic Solderability Film, also known as Copper Protectant, and also known as Preflux in English. method to grow a layer of organic film. This film
In the PCB industry, 1OZ copper thickness means the thickness of 1OZ of copper uniformly laid flat over an area of 1 square foot (FT2). It is the average thickness of copper foil expressed in terms of weight per unit area. It is expressed by the formula, i.e.,1OZ = 28.35g/ FT2 (FT2 is square feet,
In modern circuit design, the problem of signal interference is undoubtedly a core issue, which directly determines the performance and reliability of the entire system. For PCB engineers, signal interference design is a crucial skill and challenge. In practice, we found that there are four main sources of interference in PCB design: power supply noise,
Circuit board cutting refers to the separation of a circuit board into two or several pieces according to a reasonable line without affecting its effectiveness. Common circuit board cutting methods include straight line cutting (V-cutting), milling cutting, wire cutting and laser cutting. Each of these cutting methods has its own characteristics, and the choice depends
Copper sulfate electroplating in PCB plating occupies an extremely important position, acid copper plating good or bad directly affect the quality of copper plating layer and related mechanical properties, and the subsequent processing of a certain impact, so how to control the quality of copper sulfate electroplating is an important part of PCB plating. The
Etching is part of the PCB manufacturing process and is used to create cutter traces on printed circuit boards. This is accomplished by removing excess copper from the copper laminate, leaving only the desired circuitry on it. There are two types of etching: dry etching and wet etching:Wet Etching: Wet etching uses an acid solution
Circuit boards carry various electronic components and are connected through complex wiring to realize the function of the device. However, with the growth of the use of time, the circuit board will inevitably fail, which will require circuit board repair. IC board repair is not only a technical work, but also an art, requiring repairers
Circuit board glue is a specialized adhesive used in the manufacture of circuit boards. Its main function is to fix the electronic components on the circuit board to ensure the stability and reliability of the circuit. Compared with traditional soldering methods, circuit board glue has better insulating properties and higher temperature resistance, which can effectively
A glass PCB board is a printed circuit board that uses glass as its substrate. While traditional PCBs usually use paper or plastic substrates, glass substrate PCBs use glass as the substrate material. Glass PCB board is widely used in electronic products that require high performance and reliability, such as flat panel displays, smartphones, and
A stencil circuit board, also known as an SMT stencil, is an essential tool in the printed circuit board (PCB) manufacturing process. It is a metal mesh used in PCB production to help position and protect components on the PCB board, as well as to ensure the accuracy and quality of the board during processing.
Mechanical keyboard PCB refers to the circuit board used by the mechanical keyboard, it is the key component to realize the input signal of the key to be transformed into the electrical signal that can be understood by the computer and transmitted to the computer for further processing.PCB consists of three main parts, namely, the
IC carrier board that is, ic packaging substrate, is a class of circuit boards used to carry the chip, belongs to a branch of the PCB, with high density, high precision, high performance, miniaturization and thin and light features, can provide support for the chip, heat dissipation and protection, but also for the chip and
FPCA is the abbreviation of Flexible Printed Circuit Assembly, which refers to the hardware substrate formed by soldering electronic components to a flexible circuit board (FPC, Flexible Printed Circuit). It is widely used in communication, consumer electronics, automotive field. Automotive electrification, intelligence has opened up a broader market space for it, power batteries, sensors, cameras
OSP meaning Organic Solderability Preservatives, the Chinese name is Organic Solderability Film or Copper Protector. The core concept is to chemically generate a layer of organic film on the clean bare copper surface. This film has multiple properties such as resistance to oxidation, thermal shock, and humidity, and its main function is to protect the
PCB motherboard is the main board mounted components of the electronic board. It is the electronic components of the support body, but also electronic components electrically connected to the carrier. PCB motherboard design and layout directly affects the user’s ease of installation and use, so in the design and development process needs to be carefully
The solder pads, as the basic element of surface mount assembly, forms the core of the circuit board pad pattern, i.e. the combination of pads designed for a specific component type. It is not only a bridge for electrical connections, but also a key part of device fixation, which serves both functions. In the many
Soldermask is a polymer coated on the surface of the copper foil of a PCB. Its main function is to cover the surface of the copper foil and prevent oxidation of the copper wires, thus extending the service life of the board. It also prevents the flow of solder between neighboring pads during soldering, which
