Technology Blog

What is fr4 plate?fr4 plate is a commonly used insulating substrate composed of glass fiber and epoxy resin. It has good electrical insulation properties and mechanical strength, and is suitable for the manufacture of electronic circuit boards. Where “fr” is the English abbreviation for “flame retardant”, and fr4 sheet is a material that meets the […]

Description The processes involved in manufacturing printed circuit boards (PCBs) are time-consuming and complex. Excellence in these processes is a must since PCBs are the backbone of all electronic circuits. PCBs come in several different forms. Rigid (hard board), flexible (copper and coverlay), rigid-flex (integrated rigid and flexible circuits) are the most common. This publication

Patches pcb, also known as chip repair technology, is a state in the absence of drawings, to complete the circuit board line detection, component detection, fault diagnosis, repair of professional technology. Circuit board repair is broadly applicable to any equipment board, currently received technology, cost market demand and other factors, circuit board repair mainly refers

Circuit board circuit schematic is the circuit board of each electronic component using the prescribed graphic symbols, and with the use of wires to the graphic symbols of each electronic component pins connected in accordance with certain rules, the use of graphic connection relationship to illustrate the circuit board between the unit circuit power supply,

Aluminum printed circuit board refers to a kind of printed circuit board with aluminum plate as the substrate, and copper conduction lines are processed on the surface through chemical etching or mechanical processing, etc. to form a circuit board. It is characterized by good thermal conductivity, mechanical strength and stability, and is suitable for use

HDI step refers to the complexity of the manufacturing process of HDI boards, generally with the accumulation of layers (Build-up) to manufacture HDI boards, the more the number of layers, the higher the HDI process, the higher the technical grade of the board is also higher. HDI order can be divided into the following categories.HDI

How to choose the right tool for circuit design software? Is a key to productivity. In this paper, we arrange several common circuit design software tools, and make a simple comparison of the advantages and disadvantages of these circuit design software tools. Protel Protel is the Protel Company in the late 1980s launched the circuit

Wafer Level Packaging (WLP) is an advanced packaging technology that refers to the direct encapsulation of chips onto wafers to form a complete whole (similar to a microcircuit), and the final product is a chip module containing chips, pins and connecting wires. There are three main technology routes for wafer-level packaging: BGA (Ball Grid Array),

What is pcb warpage?Board warpage refers to the degree of surface bending and deformation of the circuit board, usually evaluated by two indicators, namely, the maximum warpage and the average warpage. The warpage of the circuit board will affect its use in practical applications, so it is very necessary to carry out strict control. Standards

What is Flex PCB? A Flex PCB is a printed circuit board that can be bent and folded to accommodate different shapes of materials, and it can be bent and twisted without easily breaking the material. Flex PCBs are usually made of elastic materials such as polyurethane and rubber. These materials are used in a

Printed Circuit Boards (PCBs) are fundamental components in modern electronic devices. They act as the backbone for electrical connections and play a crucial role in ensuring the functionality of electronic devices. Among the various surface finish options available for PCBs, Immersion Silver (ImAg) has gained significant popularity due to its unique properties and advantages. This

HDI pcb (High Density Interconnector), that is, high-density interconnect board, is the use of micro-blind buried hole technology of a line distribution density is relatively high circuit boards. HDI boards have an inner layer of lines and outer layer of lines, and then the use of drilling holes, holes, such as metallization and other processes,

Rigid-flex PCB designs combine rigid and flexible board technologies. In most rigid-flex boards, flexible circuit substrate layers are attached to one or more rigid boards internally, externally, or both, depending on the design specifications of the application. Typically, rigid-flex printed circuit boards are produced with a flexible polyimide material on a copper-clad substrate that is

Introduction Carbon fiber and FR4 plates are two crucial materials extensively used in various industries such as aerospace, automotive, and electronics. Each material possesses distinct properties, making them suitable for specific applications. This article delves into the characteristics, manufacturing processes, applications, performance comparison, cost analysis, environmental impact, and future trends of carbon fiber and FR4

What is FPGA?FPGA board, that is, Field Programmable Gate Array, which is a product of further development on the basis of programmable devices such as PAL, GAL, CPLD, etc. It appears as a semi-custom circuit in the field of Application Specific Integrated Circuits (ASIC). It is as a special integrated circuit (ASIC) in the field

In the realm of Printed Circuit Board (PCB) design and manufacturing, minimum solder mask sliver is a critical parameter that directly influences the reliability and performance of electronic devices. This term refers to the smallest permissible gap between solder mask layers covering conductive features like pads, traces, and vias on a PCB. Managing minimum solder

Ceramic Printed Circuit Board is advanced circuit boards that offer superior performance and reliability, especially in demanding high-performance electronic applications. Unlike conventional circuit boards made from organic materials such as fiberglass or epoxy, ceramic PCB is manufactured using ceramic materials, which gives them unique properties and features. These boards are designed to excel where high

PCB layer stack, also known as PCB layering, is a common practice in electronic design, especially in devices that require high density and high speed signal processing. The central goal is to increase functionality and speed by stacking multiple circuit boards in the same device. How does PCB layering work? In a nutshell, it accomplishes

Analog Integrated Circuits (AIC) is a circuit that integrates multiple analog electronic devices and circuits on a single chip. It is mainly used for processing, transmission and control of analog signals. Analog integrated circuits include various functional analog circuit components such as amplifiers, filters, oscillators, etc., which are capable of accurate processing and conversion of

Introduction to PCB Panel Design Printed Circuit Board (PCB) panel design is a critical aspect of electronic manufacturing, significantly influencing the efficiency, cost, and quality of the production process. This article delves into the essential principles and practices of PCB panel design, offering comprehensive insights into the subject. Importance of PCB Panel Design The significance

FPC connector is a flexible printed circuit board connector, which is usually used to connect two or more flexible printed circuit boards or to connect a flexible printed circuit board to a rigid circuit board. FPC connectors are usually composed of conductive metal foil, insulating substrate and connectors, and have extremely high flexibility to adapt

The solder melting temp and selection method of tin solder is different for different ratios of tin and lead, but it is always lower than the melting temperature of any of the pure metals that make up the alloy. For different soldering parts and soldering environments, it is necessary to choose solder with different melting