Printed circuit boards, serving as the carrier platform for electronic components and also known as PCBs, are extensively utilised in various electronic devices. Conductive pathways and electronic components are arranged upon the board substrate to facilitate interconnection and control functions between circuits. Integrated circuit chips, as the core components of modern electronic technology, integrate circuit […]
The design of flexible printed circuits (FPC) is a complex and intricate process that requires consideration not only of the flexibility demands of the application scenario but also of multiple technical factors to ensure product reliability and manufacturing feasibility. This guide aims to detail the key considerations in flexible board design and provide effective strategies
Flexible printed circuits, with their exceptional flexibility and lightweight, slim form factor, seamlessly integrate into the intricate internal structures of various precision electronic devices. They have become a pivotal element driving the advancement of electronic equipment towards multifunctional integration and extreme miniaturisation. Within the structural framework of flexible printed circuits, copper foil occupies a pivotal
Among the numerous components of flexible circuits, flexible films serve as the core substrate, playing a decisive role in determining the performance of the entire circuit. Flexible circuits, also known as Flexible Printed Circuits (FPC), have emerged as a pivotal technology in meeting the evolving demands of electronic devices. This is due to their ability
Overview and Definition of Alumina Substrate PCBs In the electronics manufacturing industry, with the continuous increase in device power density and increasingly stringent heat dissipation requirements, traditional epoxy resin fiberglass substrates (such as FR-4) are gradually failing to meet the demands of certain high-end applications. Against this backdrop, aluminum substrate PCBs (alumina substrate circuit boards),
The surface mount technology (SMT) process for flexible printed circuit board (FPC) differs significantly from conventional rigid PCB SMT solutions. The key to successful FPC SMT lies in precise positioning. Due to the flexible nature and insufficient rigidity of FPC substrates, specialised carrier boards are essential for securing and handling the boards during fundamental SMT
The white residue on PCB surfaces primarily originates from substances such as polymerised rosin, unreacted activators, and lead chloride or bromides formed by the reaction between flux and solder. Upon absorbing moisture, these substances expand in volume, with some undergoing hydration reactions with water. This leads to increasingly pronounced white residue that proves extremely difficult
The Foundation of the Integration of Drones PCB Systems As highly integrated intelligent flight platforms, drone pcb have evolved from their original military reconnaissance tools to comprehensive systems widely used in a variety of fields, including aerial photography, logistics, agricultural monitoring, surveying and mapping, and even emergency rescue. Their complex flight control, navigation, image processing,
Ceramic pcb, also known as ceramic printed circuit board, is circuit board manufactured using ceramic materials. Compared to conventional fibreglass-reinforced plastic (FR-4) substrates, ceramic PCBs utilise ceramic substrates, offering significant performance advantages. These include superior temperature stability, enhanced mechanical strength, improved dielectric properties, and extended service life. They are primarily employed in high-temperature, high-frequency, and
What is chip packaging? Chip packaging involves securing a bare die onto a specific substrate through a series of intricate processes, such as dicing, cleaning, bonding, wire bonding or flip-chip soldering. The die is then encapsulated using plastic materials (such as epoxy resin) while leads or solder balls are exposed to facilitate connection with external
Integrated Circuits (ICs) are semiconductor microdevices originating in the 1950s. Through precision manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, and aluminium deposition, semiconductor elements, resistors, capacitors, and interconnecting conductors are fully integrated onto a miniature silicon wafer. This forms circuits with specific functions, ultimately resulting in soldered and encapsulated electronic microdevices. Based on product
The PCB lamination process primarily involves stacking multiple layers of copper foil and dielectric materials (typically FR4, polyimide, or other composites) in a specific sequence. Under high temperature and pressure conditions, an adhesive binds these layers together tightly. The resulting multilayer PCB is a robust and fully functional circuit board capable of reliable operation within
The solder mask is an indispensable component in the manufacture of printed circuit boards, serving primarily to shield metallic components on the board from environmental corrosion, particularly oxidation, while effectively preventing unintended electrical short circuits between pads, known as bridging. During soldering processes such as reflow or wave soldering, where precise control of solder placement
Understanding Semiconductor Substrates In the semiconductor industry, semiconductor substrates play a crucial and fundamental role. Whether it’s microprocessors, memory, power devices, or RF modules, substrates are the physical support platform upon which these electronic devices rely. They not only support the physical structure of the device but also directly influence its electrical performance, heat dissipation,
As a core material for high-reliability electronic components, the production process of multilayer aluminium substrates integrates precision machining with materials science, with each step directly impacting the product’s electrical performance and mechanical stability. From substrate surface pre-treatment to final packaging, every stage must strictly adhere to process specifications to ensure the multilayer aluminium substrates meet
Low Temperature Co-fired Ceramic (LTCC), as an advanced electronic packaging technology, employs a thick-film material system to co-fire electrode materials, substrates, and electronic components in a single process through a pre-designed structure. This technology, with its high integration and superior performance, has become a key pathway for achieving miniaturisation and multifunctionality in electronic systems. The
As electronic products accelerate towards lighter, slimmer, smaller and higher-density designs, traditional rigid PCBs struggle to meet specific structural and performance demands. Flexible PCB (FPC), however, shine across numerous sectors including mobile phones, cameras, wearables, medical electronics and automotive electronics, owing to their unique ability to bend, fold and stretch. Particularly in critical areas such
Flexible printed circuits (FPC), owing to their pliable nature, have found exceptionally widespread application within the electronics sector, proving particularly well-suited to scenarios where space is at a premium. As electronic devices continue their trajectory towards miniaturisation, the scope of FPC utilisation grows ever broader. In the assembly stages of numerous consumer products, constrained by
High-speed pcb board circuits typically refer to digital circuits operating at very high speeds, which is related to the clock pulse frequency required by digital circuits. These pulses are rectangular waveforms. High-frequency circuits generally denote radio wave frequencies, which are sinusoidal waves. Both the transmission and reception circuits for radio waves are typically termed high-frequency
Transparent PCBs are circuit boards manufactured using transparent substrates (such as glass, polyimide or plastic) and transparent conductive materials (such as ITO or silver nanowires), combining electrical conductivity with light transmission. They find extensive application in flexible displays, smart touchscreens and medical devices. Within this manufacturing process, metal masks particularly high-precision laser-cut masks—play a critical
In today’s era of increasingly miniaturised and multifunctional electronic devices, flexible printed circuits (FPC) have become vital bridges connecting critical internal components. However, as technological aesthetics and application scenarios continue to expand, a novel type of flexible circuit board—the transparent flexible printed circuit (Transparent FPC)—is emerging. It not only inherits the flexibility of traditional FPC
With the advancement of modern electronic technology, the trend towards high-frequency signal transmission and high-speed digitalisation has become mainstream, making high frequency PCB design a crucial field of research. High frequency circuit boards are typically defined as boards handling electromagnetic frequencies exceeding 1GHz, imposing heightened demands on substrate properties, routing, and overall design. In high-frequency
Flexible printed circuits (FPC), also known as flexible circuit boards, stand out in the electronics sector due to their high wiring density, lightweight and slim profile, and exceptional bending performance, making them highly favoured within the industry. These unique advantages enable FPCs to adapt flexibly to various complex shapes and size requirements, proving particularly suitable
In the field of high frequency pcb circuit design, the quality of material properties directly determines signal transmission efficiency and stability. With the rapid advancement of technologies such as 5G communications, millimeter-wave radar, and industrial IoT, the demand for low-loss, high-reliability circuit materials is increasingly urgent. The RO4000® series hydrocarbon ceramic laminates, leveraging their unique
