Introduction and Clarification In the electronics manufacturing industry, printed circuit boards (PCBs) are fabricated using a variety of methods. Milling, as a key process, is gaining increasing attention from companies and engineers. Milling PCB Board involves using CNC milling equipment to cut and process the PCB along a pre-defined path, ultimately achieving the desired shape […]
The significance of high-frequency PCB materials in 77 GHz automotive radar applications. Within the high-frequency spectrum, although numerous novel PCB materials have been developed, not all are suitable for such elevated frequencies. At millimetre-wave frequencies, which PCB material characteristics prove most critical? Understanding these properties facilitates the simplification of millimetre-wave applications, particularly concerning the selection
Flexible printed circuit boards (FPCs), serving as core components for interconnecting electronic devices, have their layer count design directly impacting product performance, cost, and application scenarios. Based on the number of conductive layers, FPCs can be categorised into single-layer, double-layer, and multi-layer (three layers and above) structures. Flexible pcb with different layer counts exhibit significant
Flexible LED strip lights, also known as flexible ribbon lights, utilise FPC as the substrate circuit board and are assembled with surface-mount LEDs, resulting in a product thickness of merely 0.1cm that occupies minimal space. Common specifications include 30 LEDs per metre, 60 LEDs per metre, 120 LEDs per metre, 144 LEDs per metre, and
Multilayer flex pcb is formed by laminating three or more layers of single-sided or double-sided flexible circuit boards together. Through-holes are created via drilling and plating, establishing conductive pathways between different layers. This eliminates the need for complex soldering processes. Whilst the number of conductive layers in such flexible designs can be virtually unlimited, layout
Photoresist, also known as photo-resistive material, refers to an etch-resistant thin-film material whose solubility changes upon exposure to ultraviolet light, electron beams, ion beams, X-rays, or other forms of radiation. Photoresist comprises photosensitive resin, photoinitiators, solvents and additives: photoinitiators, also known as photopolymerisation materials (primarily including UV coatings, UV inks, UV adhesives, etc.), are materials
Overview and Basic Concepts of Flex PCB Prototypes In modern electronics design and manufacturing, flex PCB prototypes (flexible printed circuit board prototypes) have become an essential component of innovative product development. Compared to traditional rigid PCBs, flexible PCBs offer advantages such as flexibility, lightness, vibration resistance, and the ability to accommodate three-dimensional layouts. This has
PCB jumper refers to spaces reserved on a printed circuit board for connecting circuits, achieved by adding conductive wires and connectors. They serve a broad purpose in circuit design, effectively resolving layout and routing challenges. Jumpers serve as ‘circuit shortcuts’ in PCB design, achieved through thickened conductors or special connection methods, specifically addressing the following
The surface treatment process of PCB circuit boards is crucial to their performance and environmental credentials. Among these, the tin-plating process is widely favoured for its cost-effectiveness and solderability. Tin-plating can be categorised into leaded and lead-free variants based on lead content, exhibiting significant differences in composition, soldering characteristics, environmental requirements, and application scenarios. What
What are leaded and leadfree processes? Leaded solder typically consists primarily of tin-lead (Sn-Pb) alloys, such as the classic Sn63/Pb37 (63% tin, 37% lead), which has a low melting point (approximately 183°C), stable soldering properties, and a mature process. Lead-free solder, conversely, primarily utilises alloys such as tin-silver-copper (e.g., SAC305) or tin-copper (Sn-Cu), which are
The encapsulation process, also known as the packaging process, involves the secure enclosure of semiconductor chips using specific materials. This provides effective defence against environmental degradation, ensuring stable chip operation. Beyond delivering crucial physical protection, the process is designed from the outset to fully account for the inherent characteristics of chips – namely their lightweight,
Definition and Function of a PCB Board Transformer In modern electronics manufacturing, the term “PCB board transformer” is a common yet often misunderstood concept. It typically refers to a transformer device mounted on a printed circuit board (PCB). This encompasses both the physical device itself and the circuit layout and engineering coordination surrounding it within
As electronic products demand increasingly diverse functionalities, pcb board structures have grown ever more complex. Constrained by spatial limitations, PCB circuit boards have progressively “evolved” from single-layer to double-layer and ultimately multi-layer designs. What, then, distinguishes the manufacturing processes of multi-layer PCB boards from those of double-layer PCBs? A multilayer pcb board is a type
Ionic cleanliness testing serves as a critical quality control measure for evaluating ionic contaminant levels on pcb boards surfaces. Its primary objective is to prevent electrical faults such as short circuits and corrosion caused by ionic residues, thereby enhancing the reliability of electronic products. Employing techniques such as chemical extraction and conductivity measurement, this test
FR1 pcb is constructed from glass fiber-reinforced epoxy resin laminates. FR1 PCBs are rigid, flat materials composed of thin copper layers on a non-conductive phenolic resin substrate. FR1, fully known as Flame Retardant 1, is a PC film with high insulation and flame-retardant properties. This material not only exhibits excellent flame resistance but also possesses
In electronic manufacturing, circuit boards must be divided into distinct sections to meet the design requirements of various electronic products. Traditional mechanical cutting and punching techniques struggle to satisfy modern production standards. The advent of PCB laser depaneling machines has made this process efficient and precise, not only boosting production efficiency but also ensuring the
OSP (Organic Solderability Preservative) is a surface treatment process for PCBs (Printed Circuit Boards). It involves coating the copper foil surface with an extremely thin organic protective film (approximately 0.2-0.5μm thick) to prevent copper oxidation and maintain solderability. During soldering, high temperatures cause the protective film to decompose, exposing the copper surface to bond with
What does FPC stand for? FPC stands for Flexible Printed Circuit, known in Chinese as a flexible printed circuit board, commonly abbreviated as a flexible board. FPC is a highly reliable, exceptionally flexible printed circuit board manufactured using polyimide or polyester film as the substrate material, also referred to as a flexible circuit board or
Component spacing design on PCBA represents a pivotal aspect of electronic product development, where precision directly influences circuit electrical performance, thermal efficiency, manufacturing feasibility, and the stable operation of the final product. Component spacing is not merely a matter of spatial allocation, but rather an art form that comprehensively considers electrical safety, thermodynamics, signal integrity,
Definition and Basic Characteristics In the design and manufacturing of printed circuit boards (PCBs), exposed copper refers to surfaces with exposed copper, not covered by solder or solder mask. Exposed copper typically appears in areas requiring subsequent soldering, grounding, or testing, such as pads, vias, or conductive bridges. Compared to PCBs fully covered with solder
LED lighting products’ efficiency, energy-saving properties and extended lifespan have driven their increasing market prevalence. At the core of these products, LED light pcb design is pivotal in ensuring luminaire performance, thermal management and reliability. This article delves into each stage of the LED PCB design process to assist you in creating an outstanding LED
In electronic manufacturing, PCB board quality forms the cornerstone for ensuring device performance and reliability. However, within complex production processes, multiple factors may induce various defects in PCBA, thereby compromising the final product’s functionality. This article delves into four prevalent defect categories in PCBA manufacturing: delamination, plated-through-hole copper fractures, pcb board warping and buckling, and
Introduction In modern electronics manufacturing, printed circuit boards (PCBs) are considered the “heart” and “nervous system” of electronic products. From smartphones and wearables to automotive electronics, medical devices, and aerospace, the functionality of nearly all electronic products relies on PCBs. However, as PCBs accelerate toward higher density, miniaturization, and multi-layered design, quality issues are becoming
PCB chamfering, simply put, involves bevelling the edges of printed circuit boards. This process is typically carried out after the boards have been cut, using specialised chamfering machinery or hand tools to transform the board’s right-angled edges into bevelled surfaces at a specific angle. This treatment not only enhances the aesthetic appearance of the circuit
