In the field of electronic product manufacturing, solder contamination on PCB gold fingers is a common and challenging issue that significantly impacts product performance and reliability. Especially during critical processes such as solder paste printing and reflow soldering, even minor operational errors or environmental factors can cause solder paste to accidentally adhere to the gold […]
The production process for high-frequency microwave pcb is complex and requires extremely high precision, encompassing multiple critical stages from engineering data processing to final forming. To ensure product quality and performance, manufacturers must strictly adhere to specific operational procedures and control points at every stage of the process. Challenges in high-frequency microwave pcb processing: Key
Definition and Development Background of HDI Flexible Circuit Boards Driven by the trend toward increasingly thinner, smaller, and highly integrated electronic products, traditional rigid circuit boards are no longer able to meet the diverse product forms and complex circuit design requirements. In particular, in high-end sectors such as consumer electronics, medical devices, aerospace, and automotive
The manufacturing of microwave pcb has multiple distinctive features, primarily manifested in the diversity of substrate materials, stringent requirements for design precision, computer-controlled manufacturing processes, specialised graphic production, diverse surface coating options, CNC-controlled shape processing, and automated batch production inspection equipment. Substrate Material DiversityThe miniaturisation and integration of microwave devices have imposed higher demands on
RF connectors are electrical connectors used for transmitting radio frequency signals. They are also referred to as coaxial connectors within the industry, as RF connectors are typically connected to coaxial cables and also have a coaxial structure. Classification of RF connectors:By connection interface structure:Threaded connection: Uses series such as SMC, SMA, TNC, N, UHF, 7/16,
Microstrip patch antennas and their arrays may not be seen much but are the most widely used form of antenna. They are simple in structure and can be formed by a dielectric, a metal conductor patch on top of the dielectric, and a ground plane. Even the intervening dielectric can be an air structure. The
High frequency pcb is special circuit board dedicated to higher electromagnetic frequencies, applicable to high-frequency (frequency over 300MHz and wavelength less than 1 metre) and microwave (frequency higher than 3GHz, wavelength less than 0.1 metre) fields. This type of PCB is usually in the microwave substrate copper-clad board, through part of the use of ordinary
What is a high-Tg PCB? What are the advantages of using high Tg PCBs? When the temperature of a high Tg printed circuit board rises to a certain range, the substrate transitions from a ‘glass state’ to a ‘rubber state,’ and this temperature is referred to as the board’s glass transition temperature (Tg). In other
What is 94v-0 on a pcb? The 94v-0 standard is a standard set for the combustion characteristics of plastic materials in electronic and electrical products. It was established by Underwriters Laboratories (UL), a highly authoritative insurance laboratory in the United States. This standard specifies the specific behaviour of plastic materials when exposed to flames, with
In the fields of mechanical processing, PCB design and product assembly, the design of holes is far more than just a round hole. Different types of hole structures have a direct impact on assembly accuracy, mechanical properties and even product appearance. Counterbore vs countersink are the two most common finishing hole types. Many technicians, purchasers,
The trend in PCB design is moving towards lighter, thinner, and smaller boards. In addition to high-density circuit board design, there is also the important and complex field of three-dimensional connection assembly for rigid-flex circuit boards. Rigid-flex boards are also known as rigid-flexible boards. With the emergence and development of FPC circuit boards, rigid-flex circuit
An integrated circuit socket, also known as an IC socket, is an interface used to connect integrated circuits. It allows integrated circuits to be easily inserted and removed, facilitating testing and replacement. This type of socket is widely used in various electronic devices, particularly those that require frequent replacement or testing of integrated circuits. An
Rogers 5880 sheet is a high performance PTFE composite material with extremely low dielectric constant and loss, widely used in high frequency circuits for communications, automotive, aerospace and other applications. Sheet Parameters:Rogers 5880 sheet is a polytetrafluoroethylene (PTFE)-based material with a dielectric constant of 2.2 and thicknesses ranging from 0.003‘ to 0.240’. The sheets are
In the context of the rapid development of 5G communication technology, the performance of high-frequency PCB board has become the key to ensure the quality of signal transmission and system stability. Traditional FR4 materials are widely used in all kinds of electronic products for their excellent cost performance, while Rogers and other high-frequency specialised materials
What is Modular PCB Design? With the increasing complexity of electronic product functions, traditional single circuit board design has been unable to meet the needs of rapid iteration, flexible upgrades and efficient maintenance. In this context, the concept of “Modular PCB Design” came into being and gradually became an important trend in the electronics manufacturing
Rogers RO4350B dielectric constant stability is relatively high, the standard value using 10GHz frequency test value of 3.48, with the frequency increase in dielectric constant will decline, 24GHz frequency dielectric constant compared to the 10GHz frequency decreased by 0.01, for 3.47. Rogers RO4350B high-frequency board is fully compatible with traditional PCB manufacturing technology, do not
Battery on pcb is battery devices that are mounted on circuit boards to provide electrical support for electronic components, chips, etc. on the circuit boards. Battery on pcb is usually selected based on size, voltage and capacity requirements, and the following are the 5 most common types: The Role of Battery on pcb How to
Dev Board (Development Board) is a hardware prototyping platform for embedded system design, usually integrating processor, memory, peripheral interfaces and other modules for software debugging, algorithm verification or product prototyping. According to different core architectures, they are mainly divided into the following three categories: Using a dev board as a development tool for embedded system
Introduction With the continuous improvement of global environmental awareness, green manufacturing has become an irreversible trend in the electronics industry. Major markets such as Europe and the United States have put forward stricter environmental standards for electronic products. Among them, ROHS PCB, as a basic compliance requirement, is playing the dual role of “pass” and
Eutectic soldering, also known as low melting point alloy soldering, is a specific soldering technique. The process involves the removal of unstable oxide layers at the interface between the chip and the gold-plated base by gentle friction at specific temperatures and pressures, which causes the contacting surfaces to melt and form a liquid phase. Subsequently,
LED driver board is used to drive the LED lamps and lanterns circuit board, its main function is to convert the power supply to the current and voltage suitable for the LED work.LED driver board has the characteristics of high efficiency, stability and reliability, can provide constant current output, to ensure that the LED lamps
PCB encapsulation materials consist of substrates, interconnections, frames, interlayer media, and sealing materials. Among these, PCB encapsulation substrate materials serve as electronic components, primarily providing mechanical support, hermetic protection, and facilitating heat dissipation for electronic components and their interconnections.Substrate: High-density multilayer encapsulation substrates primarily serve as an electrical transition between semiconductor chips and conventional PCBs
Welding porosity is a common defect encountered in welding production, formed by the absorption and release of gases (primarily oxygen, nitrogen, and hydrogen) within the weld seam. It not only reduces the effective cross-sectional area of the welded component but also causes stress concentration, significantly lowering the strength and toughness of the weld metal. This
Introduction: The intersection of craft and art In stained glass works, each piece of glass is a narrative of light and shadow, and it is the shining metal welds that splice these fragments into a complete picture. Stained glass solder is not only an adhesive that connects each piece of glass, but also a tool
