HDI circuit boards are highly integrated printed circuit boards with high density, miniaturization, and light weight, which can significantly improve the performance and functional density of electronic products. HDI board design specifications usually cover the following aspects: Number of Layers and Thickness: HDI circuit boards usually use a multi-layer structure to accommodate more signal and […]
BGA packages is solder ball array package, is an integrated circuit using an organic carrier board packaging method. With the continuous development of society, in order to meet the demand for electronic products light, thin, short, small and functional diversification, production of green and other aspects of the BGA package began to be applied to
Rogers material is a specialised laminate used in the manufacture of high frequency, high performance Printed Circuit Boards (PCBs) and is manufactured by Rogers Corporation. Rogers materials typically do not contain glass fibres, but rather a ceramic foundation or hydrocarbon ceramic composite substrate, which gives them excellent dielectric properties, low dielectric constants and low loss
PCB prepreg is a soft material, similar to the black tape, also called ‘semi-glue’ or ‘film’, commonly used in the production of circuit boards. In the PCB PP is sandwiched between the core board and copper foil or two core boards before the dielectric layer to play an insulating role. It is made of polymer
The laminated construction of PCB circuit boards refers to the stacking of multiple layers of circuit boards together to form a single structure. Electronic components can be arranged on each layer of the pcb circuit board, and the components are connected between the layers by means of wires and jacks. The laminated structure can provide
Rogers ceramic pcb is a kind of circuit board using ceramic material as the substrate, which has the advantages of high thermal conductivity, high insulation, corrosion resistance and high temperature resistance. This type of circuit board is suitable for use in a variety of electronic products that require high performance and reliability, such as aerospace,
Rogers RO4003C substrate is known for its dielectric constant Dk of 3.38+/-0.05 and low dielectric loss Df of 0.0027 at 10 GHz. It is a unique glasscloth-reinforced, ceramic-filled hydrocarbon composite that combines the excellent electrical properties of PTFE/glasscloth with the superior processability of epoxy resin/glasscloth. processability. RO4003C laminates are available in two different configurations with
PCB plating to fill vias is a treatment performed to connect different layers of circuits during the manufacturing process. In the manufacturing of High Density Interconnect (HDI) boards and multilayer boards, the treatment of microvias (via) is a key aspect. Conventional mechanical drilling methods can no longer meet the high precision requirements of microvias, and
In electronic circuit design, pcb circuit board line width is closely related to its current carrying capacity. Wire width directly determines the cross-sectional area of the wire, thus affecting the maximum current it can withstand. The proper design of the line width not only ensures the normal operation and safety of the circuit, but also
As electronic devices continue to develop towards miniaturization, lightness, and multi-function, the limitations of traditional rigid circuit boards and flexible circuit boards have gradually emerged, and they cannot fully meet the complex needs of modern precision electronics. Against this background, PCB Flex Rigid (Rigid-Flex PCB) came into being. It combines the stable structure of rigid
A radio frequency circuit board (RF PCB) is a type of circuit board specifically designed to handle high frequency and radio frequency signals. Compared to ordinary PCBs, RF PCBs have unique design requirements for efficient signal transmission in the high frequency range. Impedance matching and signal integrity are important in RF circuit board design and
Heavy copper flex PCB refers to circuit boards with thicker copper layers in the flexible circuit board, which are usually between 100 and 400 microns thick, far exceeding the 35 micron copper thickness of standard PCBs. This design not only improves the current-carrying capacity of the board, but also greatly enhances its thermal performance. Flexible
With the rapid development of automotive electronics technology, automotive PCB assembly as a key electronic manufacturing link, its reliability is directly related to the safety and performance stability of the vehicle system. Enhancing the reliability of automotive PCB assembly not only reduces the failure rate and rework cost, but also effectively improves the overall quality
Automotive circuit board, full name of automotive printed circuit board, is a kind of electronic products using printing technology to print the copper foil line on the insulated substrate. It connects various electronic components such as resistors, capacitors, chips, etc. together through specific circuit patterns to achieve the transmission and processing of electronic signals, thus
Automotive pcb assembly is the process of assembling automotive printed circuit boards, which has more stringent quality requirements than PCBA in other fields. This is mainly because the automotive electronic system is directly related to the performance and safety of the vehicle. Automotive pcb assembly process:Raw material preparationAccording to the special needs of automotive electronics,
Printed circuit boards are the bearers of electronic components, which provide a master for connecting the various components in a circuit. Structurally, PCBs are mainly classified into single-sided, double-sided and multilayer boards. The parts and wires of a single panel are concentrated on each side of the substrate. This type of printed circuit board is
A flex pcb edge connector is an electrical connector designed for flexible printed circuit boards (FPCs) to provide a reliable electrical connection between the circuit leads of a flexible circuit board and the contact pads on other circuit boards, such as rigid PCBs. It is usually mounted on a rigid circuit board (PCB) to secure
The flex pcb thickness varies depending on the material, manufacturing process and application requirements, typically ranging from 0.1mm to 1.6mm. Choosing the right thickness is critical to ensure product performance and longevity. Factors affecting the flex pcb thickness Flex pcb thickness in different applications Flex pcbs are classified as single layer, double layer, multilayer and
Printed circuit board (PCB) as a core component of modern electronic equipment, its quality and reliability of the performance of the entire electronic system plays a vital role. However, during the manufacturing, storage and use of PCBs, they are affected by various factors such as temperature, humidity, contaminants and process operations, and often suffer from
In the entire process of SMT, precise printing of solder paste is the first step to achieve high-quality welding. To achieve this goal, a widely used and crucial tool is the solder paste stencil. The main function of this stencil is to print solder paste on demand onto the pads of the printed circuit board
Characteristic impedance, also known as features impedance, is the pure resistance of a circuit or transmission line per unit length when the frequency tends to infinity. It is an inherent characteristic of the transmission line and is not affected by factors such as the frequency, amplitude and phase of the signal. Usually expressed by the
HDI PCB is usually manufactured using the stackup method, the so-called ‘stackup’ refers to the formation of complex multilayer structures through the stacking and compression of multiple layers of circuit board materials. The more layers are stacked, the more difficult the board’s performance and process will be. HDI pcb stackup structure is usually expressed in
HDI Flex PCB is efficient and reliable circuit board with multiple electronic components. They offer better electrical performance in a smaller package size due to the use of thin, non-conductive substrate materials. HDI flex pcb primarily made from flexible substrates such as polyimide, which are lightweight and easily bendable to accommodate devices with complex shapes.
Flexible pcb board(FPC) is a flexible, thin and lightweight, bendable circuit connector made of polyimide, polytetrafluoroethylene and other polymer materials as the substrate, formed by chemical etching or laser stripping of wire graphics and holes. Due to its flexible, light and thin characteristics, it is widely used in mobile phones, tablet PCs, e-books, digital cameras
