Exposed copper on pcb refers to the surface of the circuit board part of the copper foil is processed to remove the exposed place called exposed copper, also known as exposed copper over the holes, exposed copper heat dissipation, and so on. The PCB exposed copper is often used to strengthen the circuit board structure, […]
Alkaline etching solution for circuit boards, also known as passivation solution, is one of the widely used chemical etching solutions in the electronics industry for removing unwanted copper materials from circuit boards, and then generating a protective layer on the surface to protect the circuits on the boards from corrosion. The principle of action of
PCB board copper thicknesses are generally classified as 1oz (35μm), 2oz (70μm) and 3oz (105μm). Of course, the copper thickness depends on the type of board you are making. Copper thickness for switching power supplies with high currents is 2oz. for signal transmission, usually, 1oz is sufficient. Normal double-sided boards are 1oz. Multilayer circuit boards
What is semiconductor packaging? Semiconductor Packaging is the process of processing a tested wafer into an individual chip according to the product model and functional requirements. The purpose of traditional packaging is to fix, lead and seal the cut chip, but with the advent of the post-Moore’s Law era, more and more steps that need
In modern electronic devices, power management boards are key to maintaining stable operation. As the functions of devices become more and more abundant, a single power input must support multiple output modules, which puts higher requirements on the flexibility and reliability of the distribution structure. In this context, the PCB splitter, a distribution structure based
HDI PCB definition, High Density Interconnect Board, is a circuit board with high line distribution density using micro-blind/buried hole technology. It is able to achieve higher line density and finer wiring in limited space to meet the demand for miniaturisation, high performance and high reliability of modern electronic products. In the field of pcb board,
On a circuit board, RT usually stands for Thermistor, a component that is extremely sensitive to temperature. The resistance value of a thermistor changes significantly with temperature, so by measuring its resistance value, we can accurately deduce the current ambient temperature. This characteristic makes thermistors play a vital role in circuit functions such as temperature
With the development of cutting-edge technologies such as 5G, artificial intelligence, and the Internet of Things, electronic products have put forward higher requirements for high-frequency, high-speed, low-loss, and low-dielectric circuit materials. In this context, traditional materials such as epoxy resins, ceramics, and polyimides are facing performance bottlenecks, and glass PCBs, as an emerging high-performance material,
A transparent flexible PCB is a pcb board that can be bent and has a certain degree of flexibility without affecting its functionality. It is made of flexible materials such as polyimide or polyester film, allowing for compact circuit connections in a given space. Transparent flex pcb is lightweight and durable. It is this property
FPC flexible circuit board is widely used in modern electronic products due to their thin, lightweight and bendable characteristics. However, its unique physical properties also bring many challenges to the welding process, requiring fine process control and specialised coping strategies. Flexible circuit boards in the welding process should pay attention to: Quality inspection is a
In the production of flex board, material deformation and delamination are important factors affecting product quality. In order to avoid such problems, the following detailed coping strategies can be adopted: Substrate selectionThe choice of material directly determines the basic bending performance of flex board. In terms of substrates, polyimide (PI) and polyester (PET) are commonly
High speed digital pcb is circuit boards that can support high speed digital signal transmission, and are usually used in scenarios where the frequency of digital logic circuits reaches or exceeds 45MHz-50MHz, or where the delay of digital signals in circuits on the transmission line is greater than 1/2 rise time. Compared to traditional analogue
Process principles and differences between SAP and mSAP In traditional PCB manufacturing, the most commonly used method is the subtractive process, which is to remove unnecessary copper from the entire copper-clad board by etching to form the required circuit pattern. This method performs well when the line width is greater than 100μm, but when the
Leadless chip carrier refers to a chip substrate material that does not contain lead. Traditional chip carriers often use leaded materials because leaded materials have high plasticity and are easy to process during manufacturing, but leaded chips are harmful to the environment and the human body. Leadless chip carrier is widely used in the manufacture
Ceramic substrate in accordance with the process points there are many kinds of, in addition to direct bonding copper (DBC) method, direct copper plating (DPC) method, laser activated metal (LAM) method, low-temperature co-fired ceramics (LTCC), high-temperature co-fired ceramics (HTCC) in addition to the AMB method of the technology that currently attracts much attention, that is,
What is a chipset? A chipset is a processor that consists of multiple chips. Each chip in a chipset may be produced by a different manufacturer. These individual chipsets are combined together to form a processor using a complex connection system. Chipset processors can take advantage of the latest chip manufacturing technology to reduce the
In just a few decades, electronic products have been developing towards miniaturization, multi-function and high performance. Chip packaging is a key link to achieve this goal. Among the many packaging technologies, CSP Package (Chip Scale Package) has attracted much attention because its size is close to that of a bare chip. CSP not only greatly
Ceramic substrates and PCBs play an important role in the electronics industry, each with unique material properties, manufacturing processes and application areas. Ceramic substrate is a ceramic material made of electronic substrates, belonging to the inorganic materials, usually with alumina (Al2O3), aluminium nitride (AlN) and silicon nitride (Si3N4) as the main component, ceramic substrate has
System in Package (SIP) is a packaging method that integrates multiple semiconductor chips and passive components vertically or horizontally in a single package module. Compared with traditional multi-chip packaging (MCM), SIP package emphasizes functional unitization and module integration, which can improve design flexibility and integration. SIP packaging has the following important technical features:Chip vertical/horizontal stacking:
The ball grid array socket is an adapter that allows for pluggable mounting without directly soldering BGA-packaged integrated circuits (ICs) to the test substrate. By connecting the solder balls of the IC to the pads of the test substrate via the BGA socket, the risk of poor contact (e.g. open or short circuit) and IC
The design layout of a camera pcb board is a central aspect of ensuring camera performance, reliability and stability. An optimised layout can effectively reduce signal interference, improve signal integrity, and improve thermal management. Camera PCB Board Wiring GuideThe LVCMOS signal alignment needs to be away from the differential lines to prevent the LVCMOS line
The camera motherboard, also called the camera pcb board, is one of the core components inside the camera and contains the camera’s processor. Memory. Interface chip. Sensor control chip and other important components. The role of the camera motherboard is to control and manage the various functions and operations of the camera, so that the
Hybrid Bonding is an advanced IC packaging technology used to achieve high-density, high-performance interconnections between different chips. The key feature of this technology is to replace the traditional bump or solder ball (bump) interconnections with direct copper-to-copper connections, which enables ultra-fine pitch stacking and packaging in a very small space for the purpose of three-dimensional
Hybrid bonding is an emerging packaging technology that combines the features of inter-chip bonding and intra-chip bonding. It utilises different bonding techniques to achieve interconnections between wafers and package substrates or within wafers to meet the needs of high-performance integrated circuits with complex interconnect structures. There are two common types of hybrid bonding: W2W can
