In the RF PCB design process, the selection of high-frequency laminates often falls into the dual pitfalls of prioritising performance at all costs and prioritising cost at all costs. A

The core relationship between lead-free soldering and FR4 boards lies in the challenge posed by the elevated soldering temperature to the thermal properties of the substrate. Compared to traditional leaded

Why are “Package Substrate” and “PCB” often confused? In the semiconductor and electronics manufacturing industry, “Package Substrate” and “PCB” are frequently discussed in the same context, and even used interchangeably

FR4 PCBs (glass fiber–reinforced epoxy laminate boards), as the most widely used type of printed circuit board, have production efficiency and cost control that directly impact overall product competitiveness. Depanelization,

Flexible PCBs, characterized by their bendability and ultra-thin form factor, break through the geometric constraints of traditional rigid boards, while rigid FR4 boards, relying on structural stability, low cost, and

The physical characteristics of millimetre-wave signals render their transmission far more fragile than that of lower-frequency signals, forming the core premise for their reliance on high-density interconnect（HDI） technology. Compared to

SLP (Substrate-like PCB) is not an entirely new technological category, but rather a ‘transitional high-end PCB technology’ bridging the gap between traditional HDI PCBs and IC packaging substrates. Its core

The thermal conductivity coefficient of FR4 serves as a parameter for assessing the thermal performance of FR4 material (glass fibre reinforced epoxy resin). This coefficient is not a fixed absolute

PCB panelization design serves as the pivotal link between R&D and production. High-quality FR4 pcb panels can enhance SMT placement efficiency by over 30% while reducing defect rates; conversely, poorly

The choice of FR4 PCB color is often bound by ingrained assumptions: green is seen as the “king of cost performance,” black carries an aura of “high-end, high performance,” while

As the most widely used substrate material, the glass fibre epoxy structure of FR4 PCBs inherently predisposes their surface copper layers to oxidation and poor solderability. The three mainstream surface

LTCC (Low-Temperature Co-fired Ceramic) technology, a multilayer circuit technique originating in the 1980s, holds a pivotal position in high-density and high-frequency electronics. This process commences with the use of green

Reflow soldering of ceramic circuit boards constitutes a critical process in achieving component encapsulation, wherein the precision of temperature curve control serves as the very lifeline determining soldering quality. Ceramic

Ceramic PCBs, with their superior thermal conductivity, high-temperature resistance and insulation properties, have become the core substrate for high-end electronic equipment. The quality of the routing process directly determines their

As electronic devices accelerate toward miniaturization, higher power, and higher operating frequencies, unprecedentedly stringent requirements are being placed on circuit board precision, thermal performance, and reliability. Ceramic circuit boards, benefiting

As electronic equipment continues to demand higher power density and greater operational stability, ceramic circuit boards have seen increasing adoption in high-end manufacturing sectors due to their excellent thermal conductivity,

As radio-frequency communications, millimetre-wave radar, high-speed interconnects and power modules advance towards higher frequencies, the transmission characteristics of signals within printed circuit boards undergo fundamental changes. Under high-frequency conditions, energy

In the manufacturing process of multilayer ceramic pcb, lamination is not merely a straightforward step of ‘stacking and applying pressure’. As the number of layers increases, circuit density rises, and

In the wave of nanotechnology, two-dimensional materials have become a focus in the field of materials science due to their atomic scale thickness and unique physical properties. Among them, High-k

With the continuous increase in power density and operating frequency of electronic systems, traditional organic PCB materials are gradually reaching their performance limits. Ceramic PCBs, characterized by high thermal conductivity,

With the continuous advancement of power electronics and high-reliability electronic systems, ceramic PCBs have gained widespread application in power modules, automotive electronics, and industrial control domains due to their superior

As the power density of electronic systems continues to increase, thermal management has become one of the core factors constraining product performance and reliability. Within traditional FR-4 PCB architectures, the