Selective soldering is a soldering technique used to connect electronic components to circuit boards, primarily to achieve precise solder joints, often in complex circuit designs. This method of soldering is characterised by the fact that only specific parts are soldered, rather than the entire assembly being fully heated, thus minimising the effect of heat on […]
Flip Chip Bonding is a highly efficient semiconductor packaging method widely used in high performance electronic devices. This technique achieves compact package design and excellent electrical performance by inverting the chip and soldering it to the substrate.Flip chip soldering usually uses solder balls or solder joints to fix the chip to the printed circuit board
PCB terminal strip refers to the connection terminals on the PCB board, usually used to connect to other circuits or devices. It is connected to other electronic components through various interfaces (such as pins, terminals, etc.). This design not only improves the stability of the connection, but also facilitates maintenance and replacement at a later
In the field of electronic engineering technology, breadboard vs pcb is two widely used tools in different stages of circuit design and development. Breadboards serve as a recyclable platform for building and testing electronic circuits without soldering. Its structure consists of a grid of interconnected holes that allow for the quick insertion, removal and relocation
Transistor surface mount, also known as chip transistors, are developed from conventional plug-in transistors, which have the same core, only the package is different, and most of them follow the plug-in transistor’s prototype number. Transistors are smaller in size and lower in profile than traditional through-hole transistors. Transistors are one of the crucial semiconductor components
The PCB Bus Bar is one of the key components of a printed circuit board (PCB) and is primarily responsible for the transmission of current on the board. It is often presented as a flat metal bar with excellent conductivity and is widely used in electronic devices, circuit boards and electrical systems to transmit power,
High Current PCB is circuit board designed specifically for the needs of high current applications. Compared to standard boards,they are characterised by thicker layers of copper, wider wires and excellent thermal conductivity, which allows for more efficient management and distribution of high-current loads. These boards are used in a wide range of applications such as
PCB board is often designed for small-current applications, so what can be done to enhance PCB boards to withstand larger currents? After all, the current demand of the electronic products we use daily is usually only between tens of milliamps to a few amps, and if we suddenly encounter a high current of tens of
Hot swappable pcb is a technical operation in which circuit boards are inserted or removed from a system that operates under power. This technology allows users to replace or upgrade circuit boards without powering down or disconnecting the system, thereby improving system reliability, quick repairs, redundancy, and timely recovery from disasters. Hot-plugging is a way
A pcb battery is a small battery on a circuit board that is used to store the board’s setup or calibration data to ensure that the board can be restored to its original operating state after a long period of inactivity. In some special cases, such as temperature sensors,the pcb battery can also provide power
Ceramic semiconductor materials are made up of a range of compounds which mainly include metal oxides, nitrides and carbides. Among the common ceramic semiconductor materials, zinc oxide (ZnO), barium titanate (BaTiO3) and silicon nitride (Si3N4) occupy an important position. These materials are made by sintering ceramic raw materials under high temperature conditions. As a result
A circuit diagram is a pictorial representation of the connections of a circuit using graphical symbols and lines. It is a combination of specific symbols and lines that clearly shows how the electronic components Q are connected, where the current flows, and how the circuit works. Circuit diagrams can be divided into different types such
Active RF circuits are RF circuits that require an external power source to function properly. Such circuits usually contain components such as amplifiers, mixers, and voltage-controlled oscillators, and are capable of increasing the gain of the signal, modulating the frequency and amplitude of the signal, and are highly resistant to interference. Compared to passive circuits,
Nelco N4000 13 is a very high quality multilayer sheet that is carefully crafted from glass fibre and epoxy resin, with the number of layers varying between approximately 8 and 16, while its thickness varies between 0.25 mm and 5.6 mm. The material’s high insulating ability, excellent thermal stability and strong mechanical strength make it
The hard drive printed circuit board is a key component of a hard disc. It consists of one or more layers of glass fibre substrates stacked on top of each other and covered with various electronic components, such as integrated circuits, connectors, capacitors, and so on. In the operation of a hard disc, the circuit
SMT high temperature soldering technology is a soldering method that uses peak soldering temperatures in excess of 220°C in the SMT (or Surface Mount Technology) process. This technique is typically implemented in the 245 to 247°C temperature range to ensure that the solder paste and the BGA (ball grid array) solder balls are able to
A cold solder joint is a soldering phenomenon that occurs when the required minimum wetting temperature between the brazing material and the base metal is not reached, or when the metallurgical reaction fails to proceed adequately despite the fact that wetting occurs in some localised areas. When this phenomenon occurs, it means that there is
DIP package assembly, also known as Dual In-line Package (DIP), is an assembly method that requires the pins of an electronic component to be inserted into a through-hole of a printed circuit board (PCB), and then secured using soldering techniques such as wave soldering. The DIP package process is particularly suitable for larger electronic components
A phone circuit board is a key component used for the connection and assembly of circuits inside a mobile phone. It is usually a thin board made of insulating material covered with a conductive layer that is used to connect and support the various electronic components inside a mobile phone, such as processors, memory, sensors,
PCB backdrill, also known as controlled depth drilling, is simply the process of drilling a hole from the back side of an already manufactured multilayer circuit board. However, this is not just playing, but to accurately trim some of the through-holes (we also call it PTH holes, that is, plated through-holes) in those unwanted ‘little
In the mass production of printed circuit boards (PCBs), manufacturers often combine multiple individual boards into one large board, a process known as boardmixing, where multiple small boards are combined into one large board. The aim is to feed these boards more efficiently into the automated machines of the SMT (surface mount technology) production line,
Hot plate for pcb soldering is an advanced soldering technique that is primarily used to securely attach electronic components to printed circuit boards (PCBs). This method utilises the heating function of the hot plate to provide uniform temperature control, thus ensuring an efficient and stable soldering process. The hot plate for pcb soldering process achieves
Parasitic resistances are resistances that are not intentionally designed into a circuit, but are created due to circuit layout or component characteristics, for example. They are usually unavoidable and affect the performance and stability of the circuit. Parasitic resistors have the following characteristics: Parasitic resistors are often considered the ‘enemy’ of circuit design due to
HDI technology is a cutting-edge PCB (Printed Circuit Board) manufacturing process that offers the significant benefits of high-density layout, high reliability and high integration, with the PCB serving as the cornerstone of electronic component interconnectivity, carrying and solidly connecting all types of electronic assemblies. Through the application of high-density integration HDI technology, can promote the
