The production process of electronic manufacturing products usually includes product design, raw material procurement, parts processing, assembly production, quality inspection, packaging and shipment. Below, Mia will introduce in detail each aspect of electronic product production. In this era of popular electronic products, ranging from smart bracelets and mobile phones to computers, televisions, etc., we are […]
Low-temperature co-fired ceramic (LTCC) technology is an eye-catching integrated component technology developed in recent years. It represents the development direction of miniaturization, high frequency and integration of electronic components. It has now become the mainstream implementation solution for passive integration. LTCC material requirements: The material performance requirements of LTCC devices include three aspects: electrical performance,
Flexible substrates composed entirely of flexible materials rather than having a rigid part with a polyimide core surrounded by copper and prepreg. In order to enhance your understanding of flexible PCB, this article will introduce the common types of substrate materials for flexible PCB. If you are interested in flexible PCB, you may wish to
Rogers pcb substrate, using the proprietary amide resin material developed by Rogers, this material gives it excellent dielectric properties, thermal stability and mechanical strength. Even under extreme working environments such as high temperature and high humidity, high frequency and high speed, Rogers PCB boards are able to maintain stable operation, demonstrating their strong adaptability and
Understanding the classification and processes of PCB manufacturing processes and mastering basic PCB manufacturing process capabilities are the foundation for PCB manufacturability design. Classification of printed circuit boards Printed circuit board according to the production material can be divided into rigid printed circuit board and flexible printed circuit board. Rigid printed circuit boards are phenolic
Electrical Contact Pad is a conductive area on a PCB (Printed Circuit Board) used to connect electronic component pins or wires. The pad is usually made of copper and is plated (such as tin or gold) to enhance its conductivity and corrosion resistance. The quality and design of electrical contact pads are critical to PCB
PCB, the Chinese name for the printed circuit board, also known as printed circuit boards, is an important electronic component, is the support body of electronic components, is the carrier of the electrical connection of electronic components. Because it is made using electronic printing technology, it is called printed circuit board. Source PCBs, the interconnection
PCB is the abbreviation of Printed Circuit Board. Also known as printed circuit board or printed circuit board. it is called a “printed” circuit board because it is made using electronic printing. A printed circuit board is a substrate used for assembling electronic components. 1. Printed circuit board (PCB) It is a printed board that
PCB circuit board is an indispensable component of modern electronic equipment. It is based on strong fiberglass and coated with one or more thin layers of copper foil to connect and support electronic components. Part 1: Basic knowledge of PCB circuit boards Before we dive into the design aspects of PCB circuit boards, let’s first
“370 hr” is a common PCB material type, which is a high-performance epoxy resin matrix commonly used to manufacture electronic equipment that requires high-temperature and high-frequency performance, such as high-speed communication equipment or aerospace equipment. This material has good thermal stability and mechanical properties, making it suitable for complex circuit designs. It has an important
“GND” stands for “ground” in electronic circuits, and is the abbreviation of “Ground”. It can also be called zero point or system ground. It usually connects other components in the circuit to the ground potential to form part of the circuit. Ground is the reference point in the circuit. Its potential is zero relative to
Mounting holes refers to the holes used to install the circuit board in PCB. These holes are usually located in the four corners of the PCB or along the edge, and are used to fix the position of the circuit board in the device, as well as to connect to the mechanical bracket or fixture
Parasitic capacitance is virtual capacitance (usually unnecessary) between two conductive structures separated by an insulator. It is an effect in PCB layout, where the propagating signal behaves as if it is a capacitor, but it is not a real capacitor. Parasitic capacitance usually occurs between any pair of conductors separated by a dielectric. These capacitances
During the PCBA processing process, some electronic components with poor welding are often encountered. Desoldering is required during the adjustment and maintenance process, or when electronic components are replaced due to incorrect welding. In the face of such electronic components, we generally remove the wrongly welded electronic components without damaging the PCB board. If the
Metal Core PCB is a special type of printed circuit board, whose substrate material is metal instead of common glass fiber reinforced plastic. Metal Core PCBs are usually made of aluminum, copper or magnesium alloy, among which aluminum and copper are the most commonly used materials. Metal Core PCBs have been increasingly used in hybrid
Definition of copper corrosion:It is a phenomenon in which copper reacts with chemicals or gases in the surrounding environment under specific conditions, resulting in oxidation, corrosion or deterioration of the copper surface. This reaction may lead to a reduction in the surface quality of the copper material, a decrease in electrical conductivity, or even an
Wafer Level Packaging (WLP) is an advanced packaging technology that has developed rapidly in recent years due to its advantages of small size, excellent electrical performance, good heat dissipation and low cost. Different from the traditional packaging process, wafer level packaging is in the chip is still on the wafer when the chip is encapsulated,
