Mia

Definition of copper corrosion:It is a phenomenon in which copper reacts with chemicals or gases in the surrounding environment under specific conditions, resulting in oxidation, corrosion or deterioration of the copper surface. This reaction may lead to a reduction in the surface quality of the copper material, a decrease in electrical conductivity, or even an […]

Wafer Level Packaging (WLP) is an advanced packaging technology that has developed rapidly in recent years due to its advantages of small size, excellent electrical performance, good heat dissipation and low cost. Different from the traditional packaging process, wafer level packaging is in the chip is still on the wafer when the chip is encapsulated,