Characteristic impedance, also known as features impedance, is the pure resistance of a circuit or transmission line per unit length when the frequency tends to infinity. It is an inherent

HDI PCB is usually manufactured using the stackup method, the so-called ‘stackup’ refers to the formation of complex multilayer structures through the stacking and compression of multiple layers of circuit

HDI Flex PCB is efficient and reliable circuit board with multiple electronic components. They offer better electrical performance in a smaller package size due to the use of thin, non-conductive

Flexible pcb board(FPC) is a flexible, thin and lightweight, bendable circuit connector made of polyimide, polytetrafluoroethylene and other polymer materials as the substrate, formed by chemical etching or laser stripping

PCB board clamp usually refers to fixtures used to hold PCBs (printed circuit boards) in place. In the production of electronic equipment, PCB board clamps are used to ensure that

PCB circuit board printer​, also known as circuit board printing machine or circuit board printing machine, is a device specially designed to print conductive patterns and components on circuit boards.

High Density Interconnect (HDI) pcb is widely used in modern high-end electronics due to their excellent performance and compact structural design. However, the manufacturing process of HDI PCBs is complex

Aluminium PCBA is widely used in high power density electronic devices due to its superior thermal performance and mechanical strength, but there are a number of manufacturing difficulties in its

Energy harvesting pcb (Printed Circuit Board) is a circuit board applied in energy storage devices (e.g. batteries, supercapacitors) to manage, protect and control the charging and discharging process of the

High multilayer circuit boards usually refer to circuit board structures with 10 to 20 or more layers. Compared with traditional multilayer circuit boards, the complexity of their processing processes has

Conventional wave soldering is a mature and widely used mass welding technology, by inserting plug-in components into the PCB board, and then the whole through the solder wave to complete

Wave soldering as a key process widely used in the field of electronic manufacturing, the stability and precise control of the process is an important guarantee to ensure the quality

High voltage pcb design has an important position in modern electronic equipment, especially in the fields of power electronics, industrial control and new energy vehicles. As it involves high voltage

High current pcb connector is an electrical connector that can be connected and disconnected under high current and high voltage conditions, and is mainly used for connecting high power supplies

Laser engraving pcb board is the process of processing and engraving circuit boards using laser technology. Laser engraving pcb board mainly uses the laser’s high energy density and precise control

Circuit board assembly machine is a very important equipment in the semiconductor industry, which is mainly used to automate the assembly of electronic components and circuit boards. According to its

In the field of electronic manufacturing, double-sided PCB board assembly by virtue of its high integration, small size and other advantages, widely used in various types of electronic products, from

Custom PCBA refers to the customised design and production of PCBA products according to customer requirements. This includes selecting the right components for the specific application, designing a board layout

High frequency pcb and high speed pcb belong to the same PCB circuit boards used for signal transmission, however, there are significant differences between the two in the actual application

The MSL (Moisture Sensitive Level) standard is a classification system used by the electronics industry to assess the sensitivity of components to moisture, which classifies components into eight different levels

The fundamentals of RF circuit design include： RF Circuit Layout PrinciplesWhen designing an RF layout, priority must be given to meeting the following general principles: (1) As far as possible

Solder Joint Pillow, also known as the pillow effect (Head-in-Pillow, HIP), is an undesirable phenomenon in which the solder balls of BGAs, CSPs and other components fail to fully fuse

As a key necessary step in the integrated circuit manufacturing process, chip packaging and testing plays a vital role. Specifically, this link will carry out a series of fine operations