Ceramic substrate in accordance with the process points there are many kinds of, in addition to direct bonding copper (DBC) method, direct copper plating (DPC) method, laser activated metal (LAM)

What is a chipset? A chipset is a processor that consists of multiple chips. Each chip in a chipset may be produced by a different manufacturer. These individual chipsets are

In just a few decades, electronic products have been developing towards miniaturization, multi-function and high performance. Chip packaging is a key link to achieve this goal. Among the many packaging

Ceramic substrates and PCBs play an important role in the electronics industry, each with unique material properties, manufacturing processes and application areas. Ceramic substrate is a ceramic material made of

System in Package (SIP) is a packaging method that integrates multiple semiconductor chips and passive components vertically or horizontally in a single package module. Compared with traditional multi-chip packaging (MCM),

The ball grid array socket is an adapter that allows for pluggable mounting without directly soldering BGA-packaged integrated circuits (ICs) to the test substrate. By connecting the solder balls of

The design layout of a camera pcb board is a central aspect of ensuring camera performance, reliability and stability. An optimised layout can effectively reduce signal interference, improve signal integrity,

The camera motherboard, also called the camera pcb board, is one of the core components inside the camera and contains the camera’s processor. Memory. Interface chip. Sensor control chip and

Hybrid Bonding is an advanced IC packaging technology used to achieve high-density, high-performance interconnections between different chips. The key feature of this technology is to replace the traditional bump or

Hybrid bonding is an emerging packaging technology that combines the features of inter-chip bonding and intra-chip bonding. It utilises different bonding techniques to achieve interconnections between wafers and package substrates

FPC Bonding (Flexible Printed Circuit Board Bonding) is a technology that electrically and mechanically connects flexible circuit boards (FPC/FPCB) to other electronic components, rigid circuit boards (PCBs), or components such

Differential signal line is mainly the difference between the traditional signal line corresponds to a ground line signal transmission mode, differential signal transmission is mainly two lines on the signal

There is a significant difference between FPC PCB assembly and the assembly of rigid circuit boards, the main reason is that flex board is softer and less hard, if you

In the continuous development of modern industrial manufacturing, materials science has played a key role. Among many high-performance materials, polytetrafluoroethylene (PTFE), more commonly known as Teflon, is undoubtedly the most

Radar PCB is an RF circuit board used for detection and automation that is primarily responsible for generating, transmitting and receiving RF signals. It contains an antenna structure mounted on

A PCB radar is a type of printed circuit board designed for use in radar systems and is primarily responsible for generating, transmitting and receiving RF signals. It is typically

As an important basic component of electronic products, the stability of pcb substrate dimensions during the manufacturing process of printed circuit boards directly affects the performance and reliability of the

As a core component carrying complex functions and high-density interconnections in modern electronic products, multilayer circuit board faces many technical challenges in the manufacturing process due to their increased thickness,

PCB dielectric thickness is usually the thickness of the glass fibre cloth or other special material used to cover both sides of a printed circuit board (PCB) during the manufacturing

PCB thickness tolerance refers to the difference in the thickness of a circuit board due to the production process and equipment conditions during the manufacture of the pcb circuit board,

Burn in board is a common test method to evaluate the performance and reliability of circuit boards by simulating the conditions of long-time use or harsh environments. The circuit board

In the field of modern electronics manufacturing, SMT (surface mount technology) and burn in board is inextricably linked, and their synergistic effect is a key link to ensure the stability