The PCB laminate structure primarily comprises three key base materials: copper foil, prepreg (semi-cured sheet), and core board (also known as substrate). Taking a common 8-layer PCB laminate structure as an example, the uppermost layer is the surface copper foil, followed sequentially by prepreg, core, with prepreg and core alternately stacked, and the bottom layer […]
Within the field of electronic components, ceramic capacitors occupy a significant position, with multilayer ceramic capacitor (MLCC) and single-layer ceramic capacitors (SLCC) being two common and widely applied types. Although both fall under the category of ceramic capacitors, they exhibit numerous significant differences in structure, performance, manufacturing processes, and material selection. MLCC and SLCC are
Multilayer ceramic capacitor (MLCC) is constructed by stacking extremely thin ceramic dielectric layers with electrodes (typically nickel) printed upon them in an offset arrangement. Composition of multilayer ceramic capacitor:Ceramic dielectric: Under an electric field, polarised dielectric materials store energy. Their polarisation constant changes with variations in the electric field. Different dielectric types exhibit varying response
High-layer printed circuit boards typically refer to boards exceeding four layers. Compared to traditional double-layer boards, they enable more complex circuit designs by embedding multiple conductive layers internally. For instance, an eight-layer board may comprise four signal layers, two power layers, and two ground layers. These layers are separated by insulating materials (such as prepreg)
Rogers 5880 PCB Introduction and Material Properties Rogers 5880 PCB is a highly regarded specialty circuit board material for high-frequency and high-speed electronic designs. It belongs to Rogers’ family of high-performance fluorinated polymer substrates. Compared to traditional FR-4 or CEM-1 materials, Rogers 5880 offers significant advantages in dielectric constant, dissipation factor, and temperature stability, enabling
In electronic manufacturing, flexible printed circuits are widely utilised, with HASL being a common PCB surface finishing process. So, is HASL suitable for flexible circuit boards? HASL, standing for Hot Air Solder Leveling, is an extremely prevalent surface treatment technology within the PCB (printed circuit board) sector. Its core function lies in establishing a uniform
The copper layer on a circuit board serves as a conductive foil, primarily functioning to interconnect electronic components. These components are typically connected to one another or to power circuits via this copper layer, facilitating current and signal transmission throughout the circuit. On the board, the solder joints of component pins connect to other pins
During PCB circuit boards manufacturing, copper peeling represents a relatively common issue that significantly impacts product quality. This phenomenon refers to the separation of copper foil from the substrate on a printed circuit board, potentially causing faults such as open circuits and interrupted signal transmission. Consequently, it compromises the performance and reliability of the entire
The flexural durability of FPC (Flexible Printed Circuit) is a critical metric for assessing its ability to maintain circuit integrity and electrical conductivity under repeated bending, folding, and mechanical motion. Flexural durability refers to the FPC’s capacity to withstand environmental stresses such as winding, bending, folding, or repetitive motion without circuit breakage, cracking, or significant
The PCBA assembly and soldering process for FPCs differs significantly from that of rigid circuit boards. Due to their insufficient rigidity and flexibility, FPCs cannot be secured or transported without specialized carrier boards, rendering essential SMT processes like printing, component placement, and reflow soldering impossible. PC Pre-TreatmentFPC boards are flexible and typically not vacuum-sealed upon
Integrated circuit boards, also known as printed circuit boards (PCBs), are indispensable components in modern electronic equipment. They secure electronic components onto an insulating substrate via surface mounting or through-hole insertion, connecting each component through conductive pathways to realise circuit functionality. The operating principle of integrated circuit boards involves connecting power supply voltages, signal currents,
Printed circuit boards, serving as the carrier platform for electronic components and also known as PCBs, are extensively utilised in various electronic devices. Conductive pathways and electronic components are arranged upon the board substrate to facilitate interconnection and control functions between circuits. Integrated circuit chips, as the core components of modern electronic technology, integrate circuit
The design of flexible printed circuits (FPC) is a complex and intricate process that requires consideration not only of the flexibility demands of the application scenario but also of multiple technical factors to ensure product reliability and manufacturing feasibility. This guide aims to detail the key considerations in flexible board design and provide effective strategies
Flexible printed circuits, with their exceptional flexibility and lightweight, slim form factor, seamlessly integrate into the intricate internal structures of various precision electronic devices. They have become a pivotal element driving the advancement of electronic equipment towards multifunctional integration and extreme miniaturisation. Within the structural framework of flexible printed circuits, copper foil occupies a pivotal
Among the numerous components of flexible circuits, flexible films serve as the core substrate, playing a decisive role in determining the performance of the entire circuit. Flexible circuits, also known as Flexible Printed Circuits (FPC), have emerged as a pivotal technology in meeting the evolving demands of electronic devices. This is due to their ability
Overview and Definition of Alumina Substrate PCBs In the electronics manufacturing industry, with the continuous increase in device power density and increasingly stringent heat dissipation requirements, traditional epoxy resin fiberglass substrates (such as FR-4) are gradually failing to meet the demands of certain high-end applications. Against this backdrop, aluminum substrate PCBs (alumina substrate circuit boards),
The surface mount technology (SMT) process for flexible printed circuit board (FPC) differs significantly from conventional rigid PCB SMT solutions. The key to successful FPC SMT lies in precise positioning. Due to the flexible nature and insufficient rigidity of FPC substrates, specialised carrier boards are essential for securing and handling the boards during fundamental SMT
The white residue on PCB surfaces primarily originates from substances such as polymerised rosin, unreacted activators, and lead chloride or bromides formed by the reaction between flux and solder. Upon absorbing moisture, these substances expand in volume, with some undergoing hydration reactions with water. This leads to increasingly pronounced white residue that proves extremely difficult
The Foundation of the Integration of Drones PCB Systems As highly integrated intelligent flight platforms, drone pcb have evolved from their original military reconnaissance tools to comprehensive systems widely used in a variety of fields, including aerial photography, logistics, agricultural monitoring, surveying and mapping, and even emergency rescue. Their complex flight control, navigation, image processing,
Ceramic pcb, also known as ceramic printed circuit board, is circuit board manufactured using ceramic materials. Compared to conventional fibreglass-reinforced plastic (FR-4) substrates, ceramic PCBs utilise ceramic substrates, offering significant performance advantages. These include superior temperature stability, enhanced mechanical strength, improved dielectric properties, and extended service life. They are primarily employed in high-temperature, high-frequency, and
What is chip packaging? Chip packaging involves securing a bare die onto a specific substrate through a series of intricate processes, such as dicing, cleaning, bonding, wire bonding or flip-chip soldering. The die is then encapsulated using plastic materials (such as epoxy resin) while leads or solder balls are exposed to facilitate connection with external
Integrated Circuits (ICs) are semiconductor microdevices originating in the 1950s. Through precision manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, and aluminium deposition, semiconductor elements, resistors, capacitors, and interconnecting conductors are fully integrated onto a miniature silicon wafer. This forms circuits with specific functions, ultimately resulting in soldered and encapsulated electronic microdevices. Based on product
The PCB lamination process primarily involves stacking multiple layers of copper foil and dielectric materials (typically FR4, polyimide, or other composites) in a specific sequence. Under high temperature and pressure conditions, an adhesive binds these layers together tightly. The resulting multilayer PCB is a robust and fully functional circuit board capable of reliable operation within
The solder mask is an indispensable component in the manufacture of printed circuit boards, serving primarily to shield metallic components on the board from environmental corrosion, particularly oxidation, while effectively preventing unintended electrical short circuits between pads, known as bridging. During soldering processes such as reflow or wave soldering, where precise control of solder placement
