Behind the faint light pulses of laser diodes lies an uncompromising demand for substrate material. From the precise detection of autonomous driving lidar to the high-speed transmission of 800G optical

When the thermal conductivity of conventional FR-4 substrates, typically below 1 W/(m·K), proves inadequate for managing the thermal loads of high-power devices, ceramic circuit boards emerge as the preferred solution.

Connections between pcb circuit boards are primarily achieved through conductive connectors, wires, flexible printed circuits (FPC), board-to-board connectors, and soldering techniques. Among these, flexible printed circuits (FPC) serve as a

SMT stencils, commonly referred to as ‘templates’, are an indispensable component of the SMT (Surface Mount Technology) process; they serve as the template for printing solder paste onto the PCB

PCB trace impedance refers to the total resistance encountered by electrical signals during transmission across a PCB board. In layman’s terms, it represents the ‘resistance’ encountered by electrical signals as

Semi flex pcb is essentially “standard” multilayer PCBs manufactured using specific grades of FR4. The thickness of the FR4 is subject to particular tolerances, enabling thinner sections to provide the

High speed PCB design specifically refers to systems that utilise high speed digital signals to transmit data between components. The boundary between high-speed digital design and simpler circuit boards employing

The Impact of PCB Impedance Control on Circuit Performance and Stability. In the design of high-frequency, high-speed electronic products, the stability and reliability of circuit performance critically influence product quality.

Driven by innovation in consumer electronics, medical devices, aerospace, and other fields, flexible pcb (FPC) have become core components for achieving three-dimensional structural integration and dynamic functionality in devices. However,

Introduction — What is Rapid PCB Prototyping? Rapid PCB prototyping (PCB) plays a crucial role throughout the entire electronics product development lifecycle. It’s a critical step in transforming design concepts

Silkscreen printing is typically employed to mark useful information on PCB boards, aiding users during the assembly process. It serves to label component values, part numbers, polarity, and other details,

Introduction and Background In modern electronic product design and manufacturing, flexible printed circuits (FPCs) have expanded from a limited number of high-end applications to encompass a wide range of fields,

Rogers RT duroid high-frequency circuit materials are composite laminates of PTFE (with random fillers of glass or ceramic), suitable for high-reliability applications such as aerospace. For many years, the RT/duroid

Rigid PCB, commonly referred to simply as PCBs, are what most people envision when thinking of circuit boards. These boards utilise conductive tracks and other components arranged upon a non-conductive

Ultra-high thermal conductivity aluminium substrate is a novel circuit board that achieves exceptional thermal performance by replacing the resin insulating layer within existing metal aluminium-based circuit board structures with a

What is 5G millimetre wave? 5G millimetre wave, also known as the millimetre wave band, refers to the spectrum segment with wavelengths between 1mm and 10mm, corresponding to frequencies ranging

Thermal stress refers to the mechanical stress arising from uneven thermal expansion or contraction within materials during temperature changes. Within the PCB substrate sector, thermal stress primarily originates from the

Rogers PCB materials, owing to their unique properties, have become a critical choice in the manufacture of high-frequency electronic equipment. They find extensive application in wireless communication systems, satellite communication

Introduction and Background In the printed circuit board (PCB) manufacturing process, solder mask is a crucial step. It’s more than just a protective coating; it’s a key factor affecting soldering

Chip packaging technology constitutes a critical component within the semiconductor industry, directly influencing the performance, reliability, and lifespan of electronic devices. In recent years, as electronic products have evolved towards

TGV (Through Glass Via) technology evolved from 2.5D/3D integrated TSV interposer technology. Since its inception in 2008, it has focused on overcoming the dielectric loss bottleneck in high-frequency, high-speed signal

Cold solder joints refer to instances during the soldering process where an inadequate metallic bond forms between the solder and the workpiece. While appearing connected, such joints exhibit poor contact,

Introduction and Background Amid the rapid development of today’s high-speed digital and radio frequency electronics industries, circuit board materials and structural design are becoming crucial for corporate competitiveness. While traditional