What is semiconductor packaging? Semiconductor Packaging is the process of processing a tested wafer into an individual chip according to the product model and functional requirements. The purpose of traditional

In modern electronic devices, power management boards are key to maintaining stable operation. As the functions of devices become more and more abundant, a single power input must support multiple

HDI PCB definition, High Density Interconnect Board, is a circuit board with high line distribution density using micro-blind/buried hole technology. It is able to achieve higher line density and finer

On a circuit board, RT usually stands for Thermistor, a component that is extremely sensitive to temperature. The resistance value of a thermistor changes significantly with temperature, so by measuring

With the development of cutting-edge technologies such as 5G, artificial intelligence, and the Internet of Things, electronic products have put forward higher requirements for high-frequency, high-speed, low-loss, and low-dielectric circuit

A transparent flexible PCB is a pcb board that can be bent and has a certain degree of flexibility without affecting its functionality. It is made of flexible materials such

FPC flexible circuit board is widely used in modern electronic products due to their thin, lightweight and bendable characteristics. However, its unique physical properties also bring many challenges to the

In the production of flex board, material deformation and delamination are important factors affecting product quality. In order to avoid such problems, the following detailed coping strategies can be adopted:

High speed digital pcb is circuit boards that can support high speed digital signal transmission, and are usually used in scenarios where the frequency of digital logic circuits reaches or

Process principles and differences between SAP and mSAP In traditional PCB manufacturing, the most commonly used method is the subtractive process, which is to remove unnecessary copper from the entire

Leadless chip carrier refers to a chip substrate material that does not contain lead. Traditional chip carriers often use leaded materials because leaded materials have high plasticity and are easy

Ceramic substrate in accordance with the process points there are many kinds of, in addition to direct bonding copper (DBC) method, direct copper plating (DPC) method, laser activated metal (LAM)

What is a chipset? A chipset is a processor that consists of multiple chips. Each chip in a chipset may be produced by a different manufacturer. These individual chipsets are

In just a few decades, electronic products have been developing towards miniaturization, multi-function and high performance. Chip packaging is a key link to achieve this goal. Among the many packaging

Ceramic substrates and PCBs play an important role in the electronics industry, each with unique material properties, manufacturing processes and application areas. Ceramic substrate is a ceramic material made of

System in Package (SIP) is a packaging method that integrates multiple semiconductor chips and passive components vertically or horizontally in a single package module. Compared with traditional multi-chip packaging (MCM),

The ball grid array socket is an adapter that allows for pluggable mounting without directly soldering BGA-packaged integrated circuits (ICs) to the test substrate. By connecting the solder balls of

The design layout of a camera pcb board is a central aspect of ensuring camera performance, reliability and stability. An optimised layout can effectively reduce signal interference, improve signal integrity,

The camera motherboard, also called the camera pcb board, is one of the core components inside the camera and contains the camera’s processor. Memory. Interface chip. Sensor control chip and

Hybrid Bonding is an advanced IC packaging technology used to achieve high-density, high-performance interconnections between different chips. The key feature of this technology is to replace the traditional bump or