Metal Core PCB is a special type of printed circuit board, whose substrate material is metal instead of common glass fiber reinforced plastic. Metal Core PCBs are usually made of aluminum, copper or magnesium alloy, among which aluminum and copper are the most commonly used materials. Metal Core PCBs have been increasingly used in hybrid […]
PCB microsection is a technology that utilizes high-precision equipment and a special process to make fine cuts on circuit boards. Compared with traditional cutting methods, microsection technology has higher precision and a smaller error margin, enabling precise cutting of tiny components and fine lines on circuit boards. Anatomical destructive slicing methods for circuit boards can
Definition of copper corrosion:It is a phenomenon in which copper reacts with chemicals or gases in the surrounding environment under specific conditions, resulting in oxidation, corrosion or deterioration of the copper surface. This reaction may lead to a reduction in the surface quality of the copper material, a decrease in electrical conductivity, or even an
BGA technology (Ball Grid Array Package) that is the ball grid array packaging technology, is about the early 1990’s by the United States Motorola and Japan Citizen jointly developed high-performance packaging technology, BGA IC is in the back of the substrate according to the array way to make a ball contact as a pin, in
FR4 is a commonly used PCB substrate materials, it is “flame retardant” (Flame Retardant) level 4 of the glass fiber reinforced epoxy resin material abbreviation. Flame Retardant (Flame Retardant): Flame Retardant refers to the ability of a material to slow down the propagation of flame or self-extinguish when subjected to flame, thus reducing the risk
What is the relation between resistance and current?In a circuit system, the power supply is responsible for providing the potential difference that allows current to flow in the circuit. The current passes through a resistor which causes a voltage drop and eventually returns to the power supply. According to Ohm’s law, current is inversely proportional
The solder ball reflow process is a commonly used surface mount technology. It can realize the soldering function by heating and melting the solder ball and connecting it to the solder joints on the substrate, and can be widely used in electronic products to improve the reliability of the connection, save space, and facilitate the
PCB as an important part of electronic equipment, its quality and reliability requirements are increasing. pcb testing is a complex and critical link, involving the application of a variety of technologies and pcb testing methods, but also need to consider a number of factors in the design process. 7 PCB Testing Techniques Flying probe test
PCB substrate key components in the electronics field that utilize chemical etching technology to connect electronic components (e.g., wires, resistors, capacitors, etc.) to copper foil to form a complete circuit system. This technology allows for the smooth transmission of signals and currents between electronic components, thus ensuring the proper functioning of electronic devices. Packaged substrates
Wafer Level Packaging (WLP) is an advanced packaging technology that has developed rapidly in recent years due to its advantages of small size, excellent electrical performance, good heat dissipation and low cost. Different from the traditional packaging process, wafer level packaging is in the chip is still on the wafer when the chip is encapsulated,
PCB color is mainly determined by its substrate on the soldermask layer, the main role of the soldermask layer is to prevent welding solder flow freely, to avoid causing short circuits. The color of the soldermask can be achieved by adding different color materials, thus forming the colorful PCB boards we see. The relationship between
Laser engraving pcb board is a kind of efficient and precise printed circuit board processing equipment, which adopts the laser technology, can carry out high-precision engraving, laser engraving, etc. on the surface of PCB, so as to realize the marking, marking, layout, cutting and other processing of the circuit board, which provides important technical support
CPU packaging technology refers to the packaging and encapsulation of integrated circuit chips to protect the chip from the external environment, and to facilitate the installation and maintenance of the CPU chip as one of the core components of the computer, packaging technology is of great significance to improve the reliability of the CPU, reduce
PCB stiffener is a type of sheet used to enhance the structural strength and stability of circuit boards. It is usually made of high-strength, high-rigidity materials, such as metal or special plastics. By pasting or fixing it on the key parts of the circuit board, PCB stiffener can effectively improve the overall strength and bending
Electroplating copper is a thin film of copper plated on the surface of other materials, usually by electrolytic deposition. Pure copper is a material made entirely of copper, and the higher the purity, the better the electrical properties. Electroplating is the process of plating a thin layer of a specific metal or alloy on a
Fix pcb board is a critical part of ensuring the proper functioning of electronic equipment. Once the circuit board failure, may lead to equipment performance degradation, abnormal function or even unusable. Timely and accurate repair can restore the normal function of the circuit board, improve the stability and reliability of the equipment, and extend its
Make your own pcb board is a complex and specialized process that involves multiple steps and considerations. The following is a general design process: 2.PCB Structure DesignAccording to the size of the circuit board and mechanical positioning requirements, in the PCB design environment to draw the circuit board frame, and in the appropriate location to
Multilayer PCB stackup technology, in short, is the process of stacking multiple circuit board layers together through specific connections to form a circuit board structure with higher integration and more complex functionality. By increasing the number of circuit board layers, this technology allows more electronic components and circuits to be accommodated in a limited space,
Water soluble solder paste is a kind of flux widely used in electronic soldering process, which can improve the wettability of solder, prevent oxidation, and clean the residue with water after soldering. Compared with traditional solder paste, water-soluble solder paste has the following characteristics: Classification of water-soluble solder pasteAccording to the composition classificationAcidic water-soluble flux:
What is bga? BGA meaning Ball Grid Array Package, known as Ball Grid Array, is a surface mount packaging technology for integrated circuits. Its pins are arranged in an array on the bottom of the package substrate, and ball contacts are made as pins to connect with the printed circuit board (PCB). BGA encapsulation process
LGA is an electronic component packaging technology based on the Land Grid Array (LGA) connector design principle for connecting IC chips to printed circuit boards (PCBs). LGA is an electronic component packaging technology based on the design principle of Land Grid Array (LGA) connector, which is used to connect IC chips to printed circuit boards
What is a circuit board? A circuit board is a thin sheet made of conductive material, on which are densely covered with a variety of electronic components and lines. It is the core component of electronic equipment, used to connect and support electronic components, to realize the electrical connection and signal transmission. There are many
OSP plating, as a printed circuit board copper foil surface treatment of a RoHS-compliant process, is an abbreviation of Organic Solderability Preservatives, which uses chemical methods to form a layer of organic skin film on the clean bare copper surface. This film not only prevents the copper surface from rusting in the normal environment, but
IC packaging is a method of protecting semiconductor components from external physical damage or corrosion by encapsulating them in an encapsulating material made of ceramic or plastic. There are many different types of integrated circuits that follow different circuit designs and enclosure requirements. This translates into different types of IC package types design. Why is
