A PCB capacitor is an electronic component in which a capacitor is mounted directly onto a printed circuit board (PCB). It is mainly used to store charge and release it when needed to provide stable voltage and current, thus ensuring the normal operation of the circuit. Compared with traditional capacitors, printed circuit board capacitors have […]
PCB density usually refers to the number of circuits, components and vias per unit area of the board. Higher density means more integrated functionality on the board, but also increased manufacturing difficulty and cost. Optimizing board density using multilayer PCB processing has become a widely used technology in the industry. Multilayer PCB processing involves carefully
Soldering Procedures for Chip Components on PCBs: Soldering Process for SMD Components 1.Cleaning and securing the PCBBefore soldering the PCB, the first task is to ensure the cleanliness of the PCB boards. Any oily fingerprints and oxides must be removed to prevent negative effects on the soldering. When soldering PCBs manually, if conditions permit, a
In the PCB manufacturing process, pcb test points, as a key element, play an important role in ensuring that circuit testing and debugging is carried out smoothly. Their existence not only enhances the reliability of the circuit, but also effectively reduces production costs and significantly improves manufacturing efficiency. The role of test points is broad
PCB slip ring, as a highly efficient electrical transmission device, are widely used in scenarios that require continuous rotation while maintaining electrical connections.Compared to conventional slip rings, they feature a more compact and integrated design, enabling a brushless connection between the wires and the printed circuit board, thus ensuring the stability and reliability of power
FR4 material, as a commonly used glass fiber reinforced epoxy resin laminate material, occupies an important position in the electronics field due to its excellent electrical and mechanical properties. Among these properties, FR4 relative permittivity and dielectric strength are particularly critical, and together they determine the performance and application range of FR4 in circuit design.
Screen printing is the process of producing printed circuit boards using silkscreen printing technology. The screen printing layer is one of the layers used to label components or add other information when drawing PCBs. Through this printing method, the component shape, serial number and other descriptive text printed on the component surface or solder surface
Ceramic printed circuit board, which is manufactured on the basis of ceramic materials such as high-purity alumina ceramics, have become one of the highlights of modern electronics manufacturing. Compared to conventional plexiglass fiber circuit boards, ceramic circuit boards exhibit higher mechanical strength, excellent temperature resistance and thermal conductivity, as well as outstanding dimensional and chemical
Cutting printed circuit board is the process of dividing a whole or linked circuit board into two or several pieces according to a reasonable line. This step is carried out without affecting the effectiveness of the circuit board, which is conducive to the secondary processing and recycling of circuit boards for remanufacturing. Mechanical cutting of
A single sided pcb is a circuit board that has a copper-clad layer on one side only and no conductive layer on the other side. It relies on a layout such as open wires or common wires in order to realize the electrical connectivity of flat circuits. Compared to double-sided boards, single-sided boards are simpler
A printed circuit board soldermask is a special construction designed to protect the integrity and stability of a circuit board by preventing solder from penetrating into areas of the board that should not be soldered during the soldering process. Soldermasks are typically placed on the substrate of a circuit board to cover a predetermined portion
A potting pcb is a circuit board that has been subjected to a special potting process. This process usually involves the potting of a specific part of the board or the entire board surface with a protective insulating material. The potting material not only improves the mechanical strength of the board, but also effectively prevents
Flexible PCB is carefully designed to cope with bending requirements, and their bend radius is a core parameter that ensures their functionality and durability. This parameter determines the extent to which the PCB can be bent safely without damage. The bending radius of a flexible PCB is influenced by a number of factors, the main
In 1936, Austrian Paul Eisler first utilized printed circuit boards in radios. By 1943, the technology was commonly used by Americans for military radios. And it was not until 1948 that U.S. officials officially approved the invention for commercial use. It was only from the mid-1950s that printed circuit boards came into widespread use. Before
Wafer testing is divided into two main categories: wafer testing (CP testing) and finished product testing (FT testing). Wafer testing is a moderate test of the capacitance and circuit function on each wafer after wafer fabrication is completed to ensure that its circuits are functioning properly before it is sent to the packaging plant for
Hard gold PCB is a printed circuit board with a layer of hard metal plated on its surface. This hard metal not only enhances the PCB’s abrasion and corrosion resistance, but also greatly improves its electrical conductivity, making hard gold PCB in high-frequency, high-speed, high-current electronic equipment outstanding performance. Application of Hard Gold PCBHard gold
PCB damage often results from mishandling. In the PCB assembly workspace, circuit boards can be dropped, bumped or mishandled when placed on a carrier. So, when a laminate suffers such damage, can it be repaired? The answer, as with most engineering issues, depends on the circumstances. Electronic products are categorized according to the industry standard
In the manufacturing process of electronic equipment, pcb layout is a crucial link. A reasonable circuit board layout can ensure the efficient and stable operation of electronic equipment, but also help to improve production efficiency and reduce production costs! Seven principles of device layout in circuit board designConvenienceIn the circuit board design will often be
Surface mount PCB, that is, a variety of electronic components directly mounted on the surface of the PCB, and then fixed by welding and other processes. This technology eliminates the traditional plug-in technology of piercing, pin bending and other cumbersome steps, greatly simplifying the manufacturing process and improve production efficiency. At the same time, because
Printed circuit boards are the basis of modern electronics. As such, they require special care and precision in their production and manufacturing processes. One of the most critical procedures to consider is the process of cutting pcb. Why do PCB needs to be cut?There are many different types of circuit boards. As a result, each
Inside electronic devices, we often come across an unassuming green component – the printed circuit board (PCB). So why are PCBs green?The green part is called solder resist, the composition is resin and pigment, green is green color pigment, there are also various other colors, and decoration tuning paint no difference. The reason why the
What is a FPC? FPC is short for Flexible Printed Circuit, which is called Flexible Printed Circuit Board in Chinese. It is a kind of printed circuit board made of polyimide or polyester film as the base material, with high reliability and excellent flexibility. Its main advantages include the ability to be freely bent, rolled
FPCB, also known as Flexible Printed Circuit Board, is a flexible circuit board. Because FPC flexible board can be freely bent, coiled, folded and other advantages, greatly reducing the size of electronic products, applicable to electronic products to high-density, miniaturization, high-reliability direction of the development of the need for FPC in aerospace, military, mobile communications,
MSAP is an acronym for Modified semi-addition process (MSAP) technology, a processing method for printed circuit boards. The method is mainly through the formation of blind vias between the two layers of the board, making the board more compact, thus realizing the wiring in a smaller space. And blind buried holes such process is an
