The Introduction of pcb testing methods and technology
PCB as an important part of electronic equipment, its quality and reliability requirements are increasing. pcb testing is a complex and critical link, involving the application of a variety of
PCB substrate and Packaging PCB: The Difference Between Them
PCB substrate key components in the electronics field that utilize chemical etching technology to connect electronic components (e.g., wires, resistors, capacitors, etc.) to copper foil to form a complete circuit
Flow and development of wafer-level packaging
Wafer Level Packaging (WLP) is an advanced packaging technology that has developed rapidly in recent years due to its advantages of small size, excellent electrical performance, good heat dissipation and
PCB Color: Why most pcb boards are green
PCB color is mainly determined by its substrate on the soldermask layer, the main role of the soldermask layer is to prevent welding solder flow freely, to avoid causing short
Laser engraving pcb board: a new choice for processing
Laser engraving pcb board is a kind of efficient and precise printed circuit board processing equipment, which adopts the laser technology, can carry out high-precision engraving, laser engraving, etc. on
CPU Packaging: A New Look at Chip Protection and Performance
CPU packaging technology refers to the packaging and encapsulation of integrated circuit chips to protect the chip from the external environment, and to facilitate the installation and maintenance of the
PCB Stiffener: A New Boost to FPC Performance
PCB stiffener is a type of sheet used to enhance the structural strength and stability of circuit boards. It is usually made of high-strength, high-rigidity materials, such as metal or
Brief description of Electroplating copper technology
Electroplating copper is a thin film of copper plated on the surface of other materials, usually by electrolytic deposition. Pure copper is a material made entirely of copper, and the
Fix PCB Board: The Way to Stable Operation
Fix pcb board is a critical part of ensuring the proper functioning of electronic equipment. Once the circuit board failure, may lead to equipment performance degradation, abnormal function or even
The design guide of make your own pcb board
Make your own pcb board is a complex and specialized process that involves multiple steps and considerations. The following is a general design process: 2.PCB Structure DesignAccording to the size
Multilayer PCB Stackup:Application and Exploration
Multilayer PCB stackup technology, in short, is the process of stacking multiple circuit board layers together through specific connections to form a circuit board structure with higher integration and more
Introduction of water soluble solder paste
Water soluble solder paste is a kind of flux widely used in electronic soldering process, which can improve the wettability of solder, prevent oxidation, and clean the residue with water
BGA Packaging Technology: Principles and Characteristics
What is bga? BGA meaning Ball Grid Array Package, known as Ball Grid Array, is a surface mount packaging technology for integrated circuits. Its pins are arranged in an array
LGA vs BGA: Principles, Applications and Comparison
LGA is an electronic component packaging technology based on the Land Grid Array (LGA) connector design principle for connecting IC chips to printed circuit boards (PCBs). LGA is an electronic
What is a circuit board and How it works
What is a circuit board? A circuit board is a thin sheet made of conductive material, on which are densely covered with a variety of electronic components and lines. It
OSP plating: Efficient and environmentally PCB processing
OSP plating, as a printed circuit board copper foil surface treatment of a RoHS-compliant process, is an abbreviation of Organic Solderability Preservatives, which uses chemical methods to form a layer
IC Package Types:A Journey Through Technology Evolution
IC packaging is a method of protecting semiconductor components from external physical damage or corrosion by encapsulating them in an encapsulating material made of ceramic or plastic. There are many
The new process ofPCB blind via buried via
PCB blind via buried via technology realizes the precise connection between the inner layer of the circuit board and the surface layer of the circuit board with the help of
DIP Packaging Technology: Principles and Characteristics
DIP packaging (Dual In-line Package), also known as dual in-line package technology, refers to the use of dual in-line form of integrated circuit chip package, the vast majority of small
PWB vs PCB: Analysis of Similarities and Differences
A PCB is a functional board that provides point-to-point connection of wires and printed components on an insulated substrate, according to a predetermined design.A PWB is a functional board that
The Key Elements of Thermal Relief PCB Design
PCB thermal relief refers to the process of heat management and control for printed circuit boards (PCBs). As the PCB is integrated with a large number of electronic components, these
Heavy copper pcb: the new power of the electronics industry
Heavy copper pcb is a printed circuit board (PCB) with a layer of copper foil bonded to its glass epoxy substrate, and when the thickness of the copper foil is
In-depth analysis of flexible circuit board material
As a popular choice for meeting the needs of flexible electronic circuits, FPC flexible circuit boards are designed to replace traditional wire harnesses for a variety of complex electronic design
The core components of circuit board resistors
Circuit board resistors are one of the most basic components used in PCBs. They are passive devices that block the flow of current in a circuit.PCB resistors control, divide, stabilize,