What is a substrate in semiconductor?A semiconductor substrate is a key material used in the manufacture of integrated circuits. It is usually made of monocrystalline silicon and is characterized by

Thick film ceramic pcb is printed metal wiring layer by screen printing process, and then degreased and sintered (generally 850~900℃) to form a circuit. Depending on the viscosity of the

Flexible Copper Clad Laminate (FCCL) refers to a kind of flexible insulating materials such as film on one or both sides, through a specific process, and copper foil bonded together

Coplanarity, or the degree of co-planarity of the pins, refers to the deviation of the ends of the pins of an SMT component relative to an ideal plane. Ideally, all

Do you know what ipc electronics standards are?For those who work in the electronics industry or PCB assembly may wonder if there is a fixed standard to ensure the quality

In the design and manufacture of circuit boards, pcb dimensions tolerance is a very critical issue that directly affects the effectiveness and performance of the circuit board.PCB board dimensional tolerances

What is solder flux? Flux is a substance that helps soldering of electronic components, and at the same time protects the soldered parts and prevents oxidation. Common fluxes are rosin-based

Flexible aluminum pcb refers to the aluminum as the substrate, through a variety of ways to enhance the flexibility of the material of a material. The addition of other elements,

Flex PCB coverlay is an insulating protective layer covering the surface of the flexible printed circuit board, playing a role in protecting the surface conductors and increasing the strength of

How to remove bga chip? Removing BGA chip is a delicate and intricate process that requires precision, patience, and the right tools. BGA chips are widely used in modern electronic

Aluminum substrate pcb is a kind of metal-based copper cladding board with good heat dissipation function. Generally, the single panel consists of three layers of structure, which are circuit layer

Soldering tinning is an important industrial raw material for connecting electronic components in soldered circuits. It is a kind of solder with a low melting point, mainly referring to the

What is pcba manufacturing? It is a critical process in the production of electronic devices. It involves the assembly of electronic components onto a printed circuit board (PCB) to create

Circuit boards are an integral part of modern electronic equipment, and they are usually subjected to a variety of processes during production, such as drilling, surface treatment, gold sinking, soldering,

IC chip is the abbreviation of Integrated Circuit Chip, also known as chip or integrated circuit. It is a highly integrated and miniaturized electronic component that is widely used in

Teflon material is polytetrafluoroethylene, the Chinese name Teflon, Teflon is a resin, the chemical name is called polytetrafluoroethylene, is the ethylene (C2H4) in the four hydrogen (H) are replaced by

In the rapidly evolving field of electronics, the advent of 3D printed circuit boards (PCBs) represents a significant technological advancement. Traditional PCB manufacturing, involving multiple complex and costly steps, has

Waterproofing electronic circuit boards means that the environment around and within water can prevent the equipment from being damaged by moisture or immersion in water. Generally, the waterproofing of circuit

A 4 layer PCB, or four-layer printed circuit board, adds two internal copper layers to form a signal layer and a power layer compared to a double-layer PCB. As a

In recent years, the demand for customizable and high-performance bluetooth mechanical keyboard pcb has surged, fueled by enthusiasts, gamers, and professionals alike. One of the key components that determine the

What is a heat sink in PCB? A heat sink is a component made of a thermally conductive metal with a large surface area. It is usually connected to pcb

What is LTCC?LTCC is Low temperature cofired ceramic, low temperature cofired ceramic technology. Low temperature cofired ceramic technology (LTCC: low temperature cofired ceramic) is a multilayer circuit made by stacking

Flip chip technology, also known as controlled collapse chip connection (C4), represents a revolutionary approach in the field of electronic packaging. It involves mounting a semiconductor device or integrated circuit

SIP (System in Package) and SOC (System on Chip) as two important trends in PCB design, their development not only affects the performance and size of the product, but also