The solder ball reflow process is a commonly used surface mount technology. It can realize the soldering function by heating and melting the solder ball and connecting it to the

PCB as an important part of electronic equipment, its quality and reliability requirements are increasing. pcb testing is a complex and critical link, involving the application of a variety of

PCB substrate key components in the electronics field that utilize chemical etching technology to connect electronic components (e.g., wires, resistors, capacitors, etc.) to copper foil to form a complete circuit

Wafer Level Packaging (WLP) is an advanced packaging technology that has developed rapidly in recent years due to its advantages of small size, excellent electrical performance, good heat dissipation and

PCB color is mainly determined by its substrate on the soldermask layer, the main role of the soldermask layer is to prevent welding solder flow freely, to avoid causing short

Laser engraving pcb board is a kind of efficient and precise printed circuit board processing equipment, which adopts the laser technology, can carry out high-precision engraving, laser engraving, etc. on

CPU packaging technology refers to the packaging and encapsulation of integrated circuit chips to protect the chip from the external environment, and to facilitate the installation and maintenance of the

PCB stiffener is a type of sheet used to enhance the structural strength and stability of circuit boards. It is usually made of high-strength, high-rigidity materials, such as metal or

Electroplating copper is a thin film of copper plated on the surface of other materials, usually by electrolytic deposition. Pure copper is a material made entirely of copper, and the

Fix pcb board is a critical part of ensuring the proper functioning of electronic equipment. Once the circuit board failure, may lead to equipment performance degradation, abnormal function or even

Make your own pcb board is a complex and specialized process that involves multiple steps and considerations. The following is a general design process: 2.PCB Structure DesignAccording to the size

Multilayer PCB stackup technology, in short, is the process of stacking multiple circuit board layers together through specific connections to form a circuit board structure with higher integration and more

Water soluble solder paste is a kind of flux widely used in electronic soldering process, which can improve the wettability of solder, prevent oxidation, and clean the residue with water

What is bga? BGA meaning Ball Grid Array Package, known as Ball Grid Array, is a surface mount packaging technology for integrated circuits. Its pins are arranged in an array

LGA is an electronic component packaging technology based on the Land Grid Array (LGA) connector design principle for connecting IC chips to printed circuit boards (PCBs). LGA is an electronic

What is a circuit board? A circuit board is a thin sheet made of conductive material, on which are densely covered with a variety of electronic components and lines. It

OSP plating, as a printed circuit board copper foil surface treatment of a RoHS-compliant process, is an abbreviation of Organic Solderability Preservatives, which uses chemical methods to form a layer

IC packaging is a method of protecting semiconductor components from external physical damage or corrosion by encapsulating them in an encapsulating material made of ceramic or plastic. There are many

PCB blind via buried via technology realizes the precise connection between the inner layer of the circuit board and the surface layer of the circuit board with the help of

DIP packaging (Dual In-line Package), also known as dual in-line package technology, refers to the use of dual in-line form of integrated circuit chip package, the vast majority of small

A PCB is a functional board that provides point-to-point connection of wires and printed components on an insulated substrate, according to a predetermined design.A PWB is a functional board that

PCB thermal relief refers to the process of heat management and control for printed circuit boards (PCBs). As the PCB is integrated with a large number of electronic components, these

Heavy copper pcb is a printed circuit board (PCB) with a layer of copper foil bonded to its glass epoxy substrate, and when the thickness of the copper foil is

As a popular choice for meeting the needs of flexible electronic circuits, FPC flexible circuit boards are designed to replace traditional wire harnesses for a variety of complex electronic design