Hybrid Bonding is an advanced IC packaging technology used to achieve high-density, high-performance interconnections between different chips. The key feature of this technology is to replace the traditional bump or

Hybrid bonding is an emerging packaging technology that combines the features of inter-chip bonding and intra-chip bonding. It utilises different bonding techniques to achieve interconnections between wafers and package substrates

FPC Bonding (Flexible Printed Circuit Board Bonding) is a technology that electrically and mechanically connects flexible circuit boards (FPC/FPCB) to other electronic components, rigid circuit boards (PCBs), or components such

Differential signal line is mainly the difference between the traditional signal line corresponds to a ground line signal transmission mode, differential signal transmission is mainly two lines on the signal

There is a significant difference between FPC PCB assembly and the assembly of rigid circuit boards, the main reason is that flex board is softer and less hard, if you

In the continuous development of modern industrial manufacturing, materials science has played a key role. Among many high-performance materials, polytetrafluoroethylene (PTFE), more commonly known as Teflon, is undoubtedly the most

Radar PCB is an RF circuit board used for detection and automation that is primarily responsible for generating, transmitting and receiving RF signals. It contains an antenna structure mounted on

A PCB radar is a type of printed circuit board designed for use in radar systems and is primarily responsible for generating, transmitting and receiving RF signals. It is typically

As an important basic component of electronic products, the stability of pcb substrate dimensions during the manufacturing process of printed circuit boards directly affects the performance and reliability of the

As a core component carrying complex functions and high-density interconnections in modern electronic products, multilayer circuit board faces many technical challenges in the manufacturing process due to their increased thickness,

PCB dielectric thickness is usually the thickness of the glass fibre cloth or other special material used to cover both sides of a printed circuit board (PCB) during the manufacturing

PCB thickness tolerance refers to the difference in the thickness of a circuit board due to the production process and equipment conditions during the manufacture of the pcb circuit board,

Burn in board is a common test method to evaluate the performance and reliability of circuit boards by simulating the conditions of long-time use or harsh environments. The circuit board

In the field of modern electronics manufacturing, SMT (surface mount technology) and burn in board is inextricably linked, and their synergistic effect is a key link to ensure the stability

In modern electronic products, printed circuit boards (PCBs) are an indispensable core component. In order to ensure the performance and reliability of PCBs, the application of pcb solder resist is

RO4350B is a commonly used high-frequency printed circuit board (PCB) material produced by Rogers Corporation in the United States. This material is used in wireless communications, radar systems, medical devices

HDI circuit boards are highly integrated printed circuit boards with high density, miniaturization, and light weight, which can significantly improve the performance and functional density of electronic products. HDI board

BGA packages is solder ball array package, is an integrated circuit using an organic carrier board packaging method. With the continuous development of society, in order to meet the demand

Rogers material is a specialised laminate used in the manufacture of high frequency, high performance Printed Circuit Boards (PCBs) and is manufactured by Rogers Corporation. Rogers materials typically do not

PCB prepreg​ is a soft material, similar to the black tape, also called ‘semi-glue’ or ‘film’, commonly used in the production of circuit boards. In the PCB PP is sandwiched

The laminated construction of PCB circuit boards refers to the stacking of multiple layers of circuit boards together to form a single structure. Electronic components can be arranged on each

Rogers ceramic pcb is a kind of circuit board using ceramic material as the substrate, which has the advantages of high thermal conductivity, high insulation, corrosion resistance and high temperature