Micro-hole machining on ceramic substrates represents the final hurdle in realising the performance of high-end electronic devices. The brittle yet hard ceramic materials (such as aluminium oxide and aluminium nitride)

The Fundamental Differences and Design Significance of FFC and FPC Cables In modern electronic products, flexible interconnect technology is increasingly becoming a critical component. The selection and design of FFC

The precision of ceramic circuit board design directly determines product reliability and mass production yield rates. Compared to traditional FR4 circuit boards, ceramic circuit board (such as aluminium oxide and

Ceramic circuit boards, owing to their high thermal conductivity and excellent insulation properties, have become a key material in high-end electronics. However, their high cost has hindered widespread adoption. Reasons

With the rapid development of power electronics technology, high-voltage circuits—thanks to their high efficiency and stability—have been widely adopted in new energy vehicles, industrial power supplies, and power systems, among

Why FMC Connector PCB Layout Often Determines System Limits In high-speed digital system design, many performance issues don’t originate with the chip itself, but rather occur in the very first

Vehicle grade PCB sockets refer to printed circuit board end connectors that meet the requirements of harsh automotive environments such as high temperature, vibration, and humidity, and are used for

The dielectric properties of PCB substrates have become a critical factor influencing device performance and stability. Conventional FR4 boards, due to their high dielectric loss, struggle to meet the demands

As the most widely used substrate in the PCB field, the flame retardancy of FR4 directly impacts the fire risk of end products. UL94-V0, the industry-recognised flame retardancy rating standard,

Below is a precise, idiomatic, and industry-appropriate English translation suitable for use in PCB engineering documentation, technical white papers, or professional marketing materials.Thanks to its mature manufacturing ecosystem and excellent

Below is a faithful, technically accurate, and idiomatic English translation suitable for professional use in electronics manufacturing, PCB engineering, or technical marketing materials.As the mainstream PCB substrate, the performance stability

In the RF PCB design process, the selection of high-frequency laminates often falls into the dual pitfalls of prioritising performance at all costs and prioritising cost at all costs. A

The core relationship between lead-free soldering and FR4 boards lies in the challenge posed by the elevated soldering temperature to the thermal properties of the substrate. Compared to traditional leaded

Why are “Package Substrate” and “PCB” often confused? In the semiconductor and electronics manufacturing industry, “Package Substrate” and “PCB” are frequently discussed in the same context, and even used interchangeably

FR4 PCBs (glass fiber–reinforced epoxy laminate boards), as the most widely used type of printed circuit board, have production efficiency and cost control that directly impact overall product competitiveness. Depanelization,

Flexible PCBs, characterized by their bendability and ultra-thin form factor, break through the geometric constraints of traditional rigid boards, while rigid FR4 boards, relying on structural stability, low cost, and

The physical characteristics of millimetre-wave signals render their transmission far more fragile than that of lower-frequency signals, forming the core premise for their reliance on high-density interconnect（HDI） technology. Compared to

SLP (Substrate-like PCB) is not an entirely new technological category, but rather a ‘transitional high-end PCB technology’ bridging the gap between traditional HDI PCBs and IC packaging substrates. Its core

The thermal conductivity coefficient of FR4 serves as a parameter for assessing the thermal performance of FR4 material (glass fibre reinforced epoxy resin). This coefficient is not a fixed absolute

PCB panelization design serves as the pivotal link between R&D and production. High-quality FR4 pcb panels can enhance SMT placement efficiency by over 30% while reducing defect rates; conversely, poorly

The choice of FR4 PCB color is often bound by ingrained assumptions: green is seen as the “king of cost performance,” black carries an aura of “high-end, high performance,” while

As the most widely used substrate material, the glass fibre epoxy structure of FR4 PCBs inherently predisposes their surface copper layers to oxidation and poor solderability. The three mainstream surface

LTCC (Low-Temperature Co-fired Ceramic) technology, a multilayer circuit technique originating in the 1980s, holds a pivotal position in high-density and high-frequency electronics. This process commences with the use of green