Introduction and Background Amid the rapid development of today’s high-speed digital and radio frequency electronics industries, circuit board materials and structural design are becoming crucial for corporate competitiveness. While traditional

Microwave radio frequency technology refers to techniques utilising radio waves within the frequency range of 300MHz to 300GHz for information transmission, processing, or application. Radio frequency (RF) typically denotes electromagnetic

Microwave RF PCB refers to microwave components manufactured using conventional rigid PCB fabrication methods on specific microwave-grade copper-clad laminates. In printed circuit board wiring for high-speed signal transmission lines, products

4D millimeter-wave radar represents an upgrade from conventional millimetre-wave radar, with “4D” denoting four dimensions: velocity, distance, horizontal angle, and vertical height. Compared to conventional 3D millimeter-wave radar, 4D millimetre-wave

Introduction and Clarification In the electronics manufacturing industry, printed circuit boards (PCBs) are fabricated using a variety of methods. Milling, as a key process, is gaining increasing attention from companies

The significance of high-frequency PCB materials in 77 GHz automotive radar applications. Within the high-frequency spectrum, although numerous novel PCB materials have been developed, not all are suitable for such

Flexible printed circuit boards (FPCs), serving as core components for interconnecting electronic devices, have their layer count design directly impacting product performance, cost, and application scenarios. Based on the number

Flexible LED strip lights, also known as flexible ribbon lights, utilise FPC as the substrate circuit board and are assembled with surface-mount LEDs, resulting in a product thickness of merely

Multilayer flex pcb is formed by laminating three or more layers of single-sided or double-sided flexible circuit boards together. Through-holes are created via drilling and plating, establishing conductive pathways between

Photoresist, also known as photo-resistive material, refers to an etch-resistant thin-film material whose solubility changes upon exposure to ultraviolet light, electron beams, ion beams, X-rays, or other forms of radiation.

Overview and Basic Concepts of Flex PCB Prototypes In modern electronics design and manufacturing, flex PCB prototypes (flexible printed circuit board prototypes) have become an essential component of innovative product

PCB jumper refers to spaces reserved on a printed circuit board for connecting circuits, achieved by adding conductive wires and connectors. They serve a broad purpose in circuit design, effectively

The surface treatment process of PCB circuit boards is crucial to their performance and environmental credentials. Among these, the tin-plating process is widely favoured for its cost-effectiveness and solderability. Tin-plating

What are leaded and leadfree processes? Leaded solder typically consists primarily of tin-lead (Sn-Pb) alloys, such as the classic Sn63/Pb37 (63% tin, 37% lead), which has a low melting point

The encapsulation process, also known as the packaging process, involves the secure enclosure of semiconductor chips using specific materials. This provides effective defence against environmental degradation, ensuring stable chip operation.

Definition and Function of a PCB Board Transformer In modern electronics manufacturing, the term “PCB board transformer” is a common yet often misunderstood concept. It typically refers to a transformer

As electronic products demand increasingly diverse functionalities, pcb board structures have grown ever more complex. Constrained by spatial limitations, PCB circuit boards have progressively “evolved” from single-layer to double-layer and

Ionic cleanliness testing serves as a critical quality control measure for evaluating ionic contaminant levels on pcb boards surfaces. Its primary objective is to prevent electrical faults such as short

FR1 pcb is constructed from glass fiber-reinforced epoxy resin laminates. FR1 PCBs are rigid, flat materials composed of thin copper layers on a non-conductive phenolic resin substrate. FR1, fully known

In electronic manufacturing, circuit boards must be divided into distinct sections to meet the design requirements of various electronic products. Traditional mechanical cutting and punching techniques struggle to satisfy modern

OSP (Organic Solderability Preservative) is a surface treatment process for PCBs (Printed Circuit Boards). It involves coating the copper foil surface with an extremely thin organic protective film (approximately 0.2-0.5μm