PCB dimension tolerance refers to the PCB manufacturing process, due to a variety of reasons resulting in the actual size and design size of the deviation between the range. The

Parasitic capacitance is virtual capacitance (usually unnecessary) between two conductive structures separated by an insulator. It is an effect in PCB layout, where the propagating signal behaves as if it

Soldermask, as a thin layer of polymer, serves the primary purpose of protecting the copper layer on a circuit board from the risk of oxidation and short circuiting during manufacture

PCB via filling technology mainly refers to the use of specific filler materials to fill through holes (such as through holes, mounting holes, etc.) in the PCB manufacturing process, in

During the PCBA processing process, some electronic components with poor welding are often encountered. Desoldering is required during the adjustment and maintenance process, or when electronic components are replaced due

Flex cut technology usually refers to the use of lasers or high-precision mechanical tools to cut circuit boards made of flexible materials (e.g. polyimide, etc.). This technology is known for

Automatic soldering is the process of welding using automated equipment and robots. Automated welding offers significant advantages over manual welding. Due to the precision and stability of automated equipment, automated

Circuit board in the process of use, often appear pad off, especially in the circuit board repair time, in the use of soldering iron, it is very easy to appear

Metal Core PCB is a special type of printed circuit board, whose substrate material is metal instead of common glass fiber reinforced plastic. Metal Core PCBs are usually made of

PCB microsection is a technology that utilizes high-precision equipment and a special process to make fine cuts on circuit boards. Compared with traditional cutting methods, microsection technology has higher precision

Definition of copper corrosion:It is a phenomenon in which copper reacts with chemicals or gases in the surrounding environment under specific conditions, resulting in oxidation, corrosion or deterioration of the

BGA technology (Ball Grid Array Package) that is the ball grid array packaging technology, is about the early 1990’s by the United States Motorola and Japan Citizen jointly developed high-performance

FR4 is a commonly used PCB substrate materials, it is “flame retardant” (Flame Retardant) level 4 of the glass fiber reinforced epoxy resin material abbreviation. Flame Retardant (Flame Retardant): Flame

What is the relation between resistance and current?In a circuit system, the power supply is responsible for providing the potential difference that allows current to flow in the circuit. The

The solder ball reflow process is a commonly used surface mount technology. It can realize the soldering function by heating and melting the solder ball and connecting it to the

PCB as an important part of electronic equipment, its quality and reliability requirements are increasing. pcb testing is a complex and critical link, involving the application of a variety of

PCB substrate key components in the electronics field that utilize chemical etching technology to connect electronic components (e.g., wires, resistors, capacitors, etc.) to copper foil to form a complete circuit

Wafer Level Packaging (WLP) is an advanced packaging technology that has developed rapidly in recent years due to its advantages of small size, excellent electrical performance, good heat dissipation and

PCB color is mainly determined by its substrate on the soldermask layer, the main role of the soldermask layer is to prevent welding solder flow freely, to avoid causing short

Laser engraving pcb board is a kind of efficient and precise printed circuit board processing equipment, which adopts the laser technology, can carry out high-precision engraving, laser engraving, etc. on

CPU packaging technology refers to the packaging and encapsulation of integrated circuit chips to protect the chip from the external environment, and to facilitate the installation and maintenance of the

PCB stiffener is a type of sheet used to enhance the structural strength and stability of circuit boards. It is usually made of high-strength, high-rigidity materials, such as metal or

Electroplating copper is a thin film of copper plated on the surface of other materials, usually by electrolytic deposition. Pure copper is a material made entirely of copper, and the

Fix pcb board is a critical part of ensuring the proper functioning of electronic equipment. Once the circuit board failure, may lead to equipment performance degradation, abnormal function or even