Introduction and Background In modern electronic product design and manufacturing, flexible printed circuits (FPCs) have expanded from a limited number of high-end applications to encompass a wide range of fields,

Rogers RT duroid high-frequency circuit materials are composite laminates of PTFE (with random fillers of glass or ceramic), suitable for high-reliability applications such as aerospace. For many years, the RT/duroid

Rigid PCB, commonly referred to simply as PCBs, are what most people envision when thinking of circuit boards. These boards utilise conductive tracks and other components arranged upon a non-conductive

Ultra-high thermal conductivity aluminium substrate is a novel circuit board that achieves exceptional thermal performance by replacing the resin insulating layer within existing metal aluminium-based circuit board structures with a

What is 5G millimetre wave? 5G millimetre wave, also known as the millimetre wave band, refers to the spectrum segment with wavelengths between 1mm and 10mm, corresponding to frequencies ranging

Thermal stress refers to the mechanical stress arising from uneven thermal expansion or contraction within materials during temperature changes. Within the PCB substrate sector, thermal stress primarily originates from the

Rogers PCB materials, owing to their unique properties, have become a critical choice in the manufacture of high-frequency electronic equipment. They find extensive application in wireless communication systems, satellite communication

Introduction and Background In the printed circuit board (PCB) manufacturing process, solder mask is a crucial step. It’s more than just a protective coating; it’s a key factor affecting soldering

Chip packaging technology constitutes a critical component within the semiconductor industry, directly influencing the performance, reliability, and lifespan of electronic devices. In recent years, as electronic products have evolved towards

TGV (Through Glass Via) technology evolved from 2.5D/3D integrated TSV interposer technology. Since its inception in 2008, it has focused on overcoming the dielectric loss bottleneck in high-frequency, high-speed signal

Cold solder joints refer to instances during the soldering process where an inadequate metallic bond forms between the solder and the workpiece. While appearing connected, such joints exhibit poor contact,

Introduction and Background Amid the rapid development of today’s high-speed digital and radio frequency electronics industries, circuit board materials and structural design are becoming crucial for corporate competitiveness. While traditional

Microwave radio frequency technology refers to techniques utilising radio waves within the frequency range of 300MHz to 300GHz for information transmission, processing, or application. Radio frequency (RF) typically denotes electromagnetic

Microwave RF PCB refers to microwave components manufactured using conventional rigid PCB fabrication methods on specific microwave-grade copper-clad laminates. In printed circuit board wiring for high-speed signal transmission lines, products

4D millimeter-wave radar represents an upgrade from conventional millimetre-wave radar, with “4D” denoting four dimensions: velocity, distance, horizontal angle, and vertical height. Compared to conventional 3D millimeter-wave radar, 4D millimetre-wave

Introduction and Clarification In the electronics manufacturing industry, printed circuit boards (PCBs) are fabricated using a variety of methods. Milling, as a key process, is gaining increasing attention from companies

The significance of high-frequency PCB materials in 77 GHz automotive radar applications. Within the high-frequency spectrum, although numerous novel PCB materials have been developed, not all are suitable for such

Flexible printed circuit boards (FPCs), serving as core components for interconnecting electronic devices, have their layer count design directly impacting product performance, cost, and application scenarios. Based on the number